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    SIM BLOCK AMPHENOL Search Results

    SIM BLOCK AMPHENOL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SF-SFPP2EPASS-005 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-005 5m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (16.4 ft) Datasheet
    SF-SFPP2EPASS-001 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-001 1m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (3.3 ft) Datasheet
    AV-DPMDPM0000-001 Amphenol Cables on Demand Amphenol AV-DPMDPM0000-001 1m DisplayPort Cable - Amphenol DisplayPort 1.1 Certified Cable (3.3ft) 1m (3.3') Datasheet
    SF-SFPP2EPASS-007 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-007 7m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (23 ft) Datasheet
    SF-SFPP2EPASS-002 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-002 2m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (6.6 ft) Datasheet

    SIM BLOCK AMPHENOL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    sim card 6PIN

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contacts: Copper Alloy, Switch: Copper Alloy Insulator: High temperature. Thermoplastic, UL94V-0, Black. 2. Finish: Contacts: 30u” Gold plated on contact area,100u” min Matte-Tin on solder tail, Nickel underplated over all.


    Original     		PDF UL94V-0, 5000cycles CAD-06-S1-20-1 sim card 6PIN

    sim card 6PIN

    Abstract: 06S1 sim card
    Text: Amphenol SIM Card Connector 1. Material: Contacts: Copper Alloy, Switch: Copper Alloy Insulator: High temperature. Thermoplastic, UL94V-0, Black. 2. Finish: Contacts: 30u” Gold plated on contact area,100u” min Matte-Tin on solder tail, Nickel underplated over all.


    Original     		PDF UL94V-0, 5000cycles CAD-06-S1-20-1 sim card 6PIN 06S1 sim card

    CAD-0601-262

    Abstract: amphenol sim block
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601262 CAD-0601-262 amphenol sim block

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-182

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-222

    amphenol sim block

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601242 amphenol sim block

    CAD-0605-202

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-202

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-112

    CAD-0601-302

    Abstract: CAD0601302 amphenol sim block
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601302 CAD-0601-302 amphenol sim block

    amphenol sim block

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601402 amphenol sim block

    SIM READER amphenol

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-162 SIM READER amphenol

    amphenol sim block

    Abstract: SIM BLOCK
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601382 amphenol sim block SIM BLOCK

    amphenol sim block

    Abstract: SIM BLOCK
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601342 amphenol sim block SIM BLOCK

    amphenol sim block

    Abstract: sim block
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601322 amphenol sim block sim block

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-192

    CAD-0605-122

    Abstract: CAD0605122
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-122 CAD0605122

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-132

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-172

    CAD-0605-212

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-212

    SIM READER amphenol

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-152 SIM READER amphenol

    amphenol sim block

    Abstract: SIM BLOCK
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601282 amphenol sim block SIM BLOCK

    sim block

    Abstract: amphenol sim block
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601222 sim block amphenol sim block

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-142

    sim 300 processor datasheet for gsm modem

    Abstract: free circuit diagram of USB modem using gsm sim motorola G20 sim 300 processor gsm modem datasheet CIRCUIT DIAGRAM FOR gsm modem with sim 300 module sim 300 gsm modem block diagram sim 300 processor gsm modem stk audio power amplifiers stk power audio ics STK power amplifier module overview
    Text: Developer's Guide Motorola g20 Cellular Engine Module Description 98-08901C66-B REVISION HISTORY Revision Date Purpose O 30 June 2003 Initial release A 05 November 2003 Minor corrections to the manual B 15 February 2004 Updated book version Updated section 2.3, Product Specifications


    Original     		PDF 98-08901C66-B RS232 sim 300 processor datasheet for gsm modem free circuit diagram of USB modem using gsm sim motorola G20 sim 300 processor gsm modem datasheet CIRCUIT DIAGRAM FOR gsm modem with sim 300 module sim 300 gsm modem block diagram sim 300 processor gsm modem stk audio power amplifiers stk power audio ics STK power amplifier module overview