C8C12
Abstract: No abstract text available
Text: Material Content Data Sheet Product Name Process Name of the part Package Base ASFLK-Series Material Ceramics Material Weight mg 46.89 Die Bonding IC Adhesive Wire Bonding Gold Wire Blank (base plating) Silicon EPOXY-1 Au SiO2 0.7 0.35 0.07 1.31 Blank Mounter
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C8-C12)
C8C12
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Untitled
Abstract: No abstract text available
Text: ASV,ASVK,ASL Ceramic Type List of main material declaration Item Weight(mg) 183.7 INFORMATION Material Package Base Process Name of the part Package Base Ceramic SMD Material Ceramics Item Name Lead Free Material Au / Ni Material Weight(mg) 156 Die Bonding
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C8-C12)
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TDS05160
Abstract: TDS05150 TDS03160 TDS03150 TDSR5150 9999 DIODE tsop1736 TLU02401 BPW2 silver ag wire Bond
Text: V I^ W Y Vishay Telefunken Table of Package Forms Part Number Package Form Part Number Package Form Part Number Package Form TLBR5410 8 TLHR4401 11 TLMH3100 1 TLDR4400 11 TLHR4405 11 TLMH3101 1 TLDR4900 11 TLHR4600 11 TLMK3100 1 TLDR5400 TLDR5800 8 TLHR4601
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TLBR5410
TLDR4400
TLDR4900
TLDR5400
TLDR5800
TLHE4900
TLHE5100
TLHE5101
TLHE5102
TLHE5800
TDS05160
TDS05150
TDS03160
TDS03150
TDSR5150
9999 DIODE
tsop1736
TLU02401
BPW2
silver ag wire Bond
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cd photo diode
Abstract: class H epoxy resin gold detector IC material composition of chip capacitors ic 555 use with metal detector epoxy resin lead frame resin compound copper bond wire CNY64
Text: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future
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BORON
Abstract: BPW34 application BPW77NA BPW41N bpx43-6 BPW43 BPW17 BPW85 BPW34 BPW41N IR DATA
Text: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future
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que98
BORON
BPW34 application
BPW77NA
BPW41N
bpx43-6
BPW43
BPW17
BPW85
BPW34
BPW41N IR DATA
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80110
Abstract: TCST1000 CNY70 TCPT1200 TCST1030 TCST1210 TCST1230 TCST5123 TCST5250 TCUT1200
Text: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future
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ir photodetector
Abstract: CNY70 TCNT1000 TCPT1200 TCPT1200X01 TCRT1000 TCRT1010 TCRT5000 TCRT5000L TCSS1100
Text: Vishay Telefunken Packing and Order Information Part Number MOQ* pcs per Tube CNY70 TCNT1000 TCPT1200 TCPT1200X01 TCRT1000 TCRT1010 TCRT5000 TCRT5000L TCSS1100 TCSS2100 TCST1000 TCST2000 TCST1030 TCST1030L TCST1103 TCST1202 TCST1210 TCST1230 TCST1300 TCST2103
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CNY70
TCNT1000
TCPT1200
TCPT1200X01
TCRT1000
TCRT1010
TCRT5000
TCRT5000L
TCSS1100
TCSS2100
ir photodetector
CNY70
TCNT1000
TCPT1200
TCPT1200X01
TCRT1000
TCRT1010
TCRT5000
TCRT5000L
TCSS1100
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metal detector WITH IC 555
Abstract: ic 555 use with metal detector silver ag wire Bond TSAL6200 TSAL6400 TSHF5200 TSHF5400 TSOP21 TSAL4400 silver epoxy
Text: VISHAY Vishay Semiconductors Constituents of IR Receiver Modules Responsible electronic component and equipment manufacturers are already preparing for the time when the life span of their products comes to an end by scrutinizing the materials incorporated and their
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temt104
13-Aug-03
metal detector WITH IC 555
ic 555 use with metal detector
silver ag wire Bond
TSAL6200
TSAL6400
TSHF5200
TSHF5400
TSOP21
TSAL4400
silver epoxy
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d 9329
Abstract: MARKING Scw SOT23 gus-ss cel-9220 cel9220 scw marking code sot 23 PFC-W0805LF SCW-SC3LF WCA0804 PWC2512L
Text: Surface Mount QSOP Resistor Networks IRC Advanced Film Division QSOP Series • Reliable, no internal cavity • High resistor density - .025” lead spacing • Standard JEDEC 16, 20, and 24 pin packages • Ultra-stable TaNSil resistors on silicon substrates
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environment-57-5
CEL9220
30248E-05
2562E-05
d 9329
MARKING Scw SOT23
gus-ss
cel-9220
cel9220
scw marking code sot 23
PFC-W0805LF
SCW-SC3LF
WCA0804
PWC2512L
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Telefunken Electronic LED 3mm
Abstract: MG96
Text: Vishay Telefunken The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future
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Si3N4
Abstract: antimony trioxide epoxy molding TELEFUNKEN catalog
Text: Vishay Telefunken The Constituents of Semiconductor Components Document Number 82601 05.01 www.vishay.com 1 Vishay Telefunken Table of Contents The Constituents of Semiconductor Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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The Constituents of Semiconductor Components
Abstract: 80095 TDSR5160 TDSR5150 TDSR1160 TDSG5160 TDSG1150 TDSG1160 TDSG3150 TDSG3160
Text: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future
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silver epoxy
Abstract: silver ag wire Bond telefunken germanium class H epoxy resin
Text: Vishay Telefunken The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their future
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Untitled
Abstract: No abstract text available
Text: NTC THERMISTORS F E N W A L d E L E C T R O N IC S NTC / PTC Thermistors STANDARD CHIP SERIES Without Leads • <* - v , .■ FEATURES May be surface m ounted by epoxy bonding or soldering 1Top and bottom surface electrode 1 Rapid response time 1Small size
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196-202IAGO0I
I96-I03LAGO0I
196-503Q
196-2031/lGOUl
196-303KAGO0I
196-104Q
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TS0300
Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Text: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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Ablestik 84-1LMI
Abstract: gold melting furnace 84-1LMI epoxy adhesive
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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opto fet
Abstract: ll90_3 JESD46-B LL85 LL90 transistor FET OS-PCN-2005-003-A
Text: Product / Process Change Notification For internal use only 2005-02-15 OS-PCN-2005-003-A Dear Customer, please find attached our OSRAM OS PCN: “Change of bond pad of field effect transistor FET and leadframe plating for laser SPL LLxx” Important information for your attention:
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OS-PCN-2005-003-A
JESD46-B"
D-93049
opto fet
ll90_3
JESD46-B
LL85
LL90
transistor FET
OS-PCN-2005-003-A
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AWTN15
Abstract: 3PDT toggle switch wiring diagram F4TPA0904 FTN5904 A101T1ZB FTD0904 FTS0904 A201SYAB04 FTPA0904 N4004
Text: Toggle Switches Product Range Toggle Switches Toggle Switches • Tiny Toggles: TT and TST Series ■ Miniature Toggles: Gemini Series and Green Series ■ Power Toggles: F and AW Series Main features: ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Up to 4 poles
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MHP smd
Abstract: 330 197 MHP025
Text: Medium Power RF Multilayer Porcelain Capacitors High Frequency Power Ceramic Capacitors Series MPV Series MHP Summary Data ELECTRICAL CHARACTERISTICS Series Range CAPACITANCE RANGE pF 10 CAPACITANCE RANGE PER CASE SIZE pF 10 - 360 - 1000 390 - 1000 MPVC MPVS 81 MPVS 82 MPVS 83
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ECF564A
Abstract: No abstract text available
Text: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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40039
Abstract: SOD-523 DO-219AB Germanium DO-35 DIODE 89901 cd 4553 material declaration vishay asbestos DO-219AB germanium diode SOD323
Text: VISHAY Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their
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LLP-75
06-May-04
40039
SOD-523 DO-219AB
Germanium DO-35 DIODE
89901
cd 4553
material declaration vishay
asbestos
DO-219AB
germanium diode SOD323
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material declaration semiconductor package
Abstract: asbestos safety material declaration vishay 89901 DO-219AB 58018
Text: Vishay Semiconductors The Constituents of Semiconductor Components Responsible electronic component and equipment manufacturers are already preparing for the time when the lifespan of their products comes to an end by scrutinizing the materials incorporated and their
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LLP-75
06-May-04
material declaration semiconductor package
asbestos safety
material declaration vishay
89901
DO-219AB
58018
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c06cf
Abstract: Di-Cap MIL-PRF-49464
Text: DiCap ® High Performance Single-Layer Capacitors for Functional Applications: Benefits: n DC Blocking Bypass n Filtering n Tuning n Submounts n n email sales@dilabs.com or europesales@dilabs.com or asiasales@dilabs.com n RF n n n Gold Metallization for wire bonding
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MIL-STD-202
MIL-STD-883
-STD-883,
c06cf
Di-Cap
MIL-PRF-49464
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