Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SIL-PAD K10 Search Results

    SIL-PAD K10 Result Highlights (2)

    Part ECAD Model Manufacturer Description Download Buy
    V36BEZ02307000T Amphenol Communications Solutions ExtremePort QSFP-DD 112G stacked SMT connector, Glue pad version Visit Amphenol Communications Solutions
    NDHN3B7 Amphenol Communications Solutions Rectangular Push Pull IP67 Industrial Ethernet Connector, NDH, Ix Industrial, Hood + Plug Kit, B Key, Plug with Solder Pad Termination, 30u\\ Pd Ni with Gold flash plating Visit Amphenol Communications Solutions
    SF Impression Pixel

    SIL-PAD K10 Price and Stock

    The Bergquist Company SIL-PADK10 304X304 SHEET

    Thermally Conductive Insulator; Thermal Conductivity:1.3W/M.k; Conductive Material:Boron Nitride Filled Silicone Rubber; Thickness:0.152Mm; Thermal Impedance:0.86°C/W; Dielectric Strength:-; External Length:304Mm; Product Range:- Rohs Compliant: Yes |Bergquist SIL-PADK10 304X304 SHEET
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark SIL-PADK10 304X304 SHEET Bulk 40 1
    • 1 $110.59
    • 10 $100.52
    • 100 $89.91
    • 1000 $79.46
    • 10000 $79.46
    		Buy Now

    SIL-PAD K10 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MIL-I-49456

    Abstract: SIL-PAD E59150 MIL-M-38527 SIL-PAD K10 MIL-M-38527C ASTM D412 for rubber MIL-M-87111 ASTM D412 D150
    Text: Sil-Pad K-10 ® The High Performance Kapton Based Insulator Features and Benefits • Thermal impedance 2 0.41°C-in /W @50 psi Typical Properties of Sil-Pad K-10 Property Imperial Value Metric Value Test Method Beige Beige Visual Color Reinforcement Carrier


    Original     		PDF D2240 D1458 MIL-I-49456 SIL-PAD E59150 MIL-M-38527 SIL-PAD K10 MIL-M-38527C ASTM D412 for rubber MIL-M-87111 ASTM D412 D150

    SIL-PAD

    Abstract: D412 SIL-PAD K10 D1458 D149 D150 D2240 D257 D374 kapton film
    Text: Sil-Pad K-10 The High Performance Kapton®-Based Insulator Features and Benefits • Thermal impedance: 0.41°C-in2/W @50 psi • Tough dielectric barrier against cut-through • High performance film • Designed to replace ceramic insulators TYPICAL PROPERTIES OF SIL-PAD K-10


    Original     		PDF D2240 D1458 SIL-PAD D412 SIL-PAD K10 D1458 D149 D150 D2240 D257 D374 kapton film

    bergquist

    Abstract: SIL-PAD K10 ASTM D2240, D412 astm D150 ASTM D2240 ASTM D412 D412 D1458 D149 D150
    Text: Sil-Pad K-10 The High Performance Kapton®-Based Insulator Features and Benefits • Thermal impedance: 0.41°C-in2/W @50 psi • Tough dielectric barrier against cut-through • High performance film • Designed to replace ceramic insulators TYPICAL PROPERTIES OF SIL-PAD K-10


    Original     		PDF D2240 D1458 bergquist SIL-PAD K10 ASTM D2240, D412 astm D150 ASTM D2240 ASTM D412 D412 D1458 D149 D150

    Untitled

    Abstract: No abstract text available
    Text: Sil-Pad K-10 The High Performance Kapton®-Based Insulator Features and Benefits • Thermal impedance: 0.41°C-in 2/W @50 psi • Tough dielectric barrier against cut-through • High performance film • Designed to replace ceramic insulators T YPICAL PROPERT IES OF SIL-PAD K-10


    Original     		PDF D2240 D1458

    SP1750

    Abstract: SP1000 SP1950 SP400 SP2000 SP175
    Text: Choosing the right Sil-Pad Starts with the Mechanical and Electrical Properties MOUNTING TECHNIQUES MOUNTING PRESSURE AND Typical mounting techniques include: • A Spring clip, which exerts a centralized clamping force on the body of the transistor. The greater the mounting


    Original     		PDF O-220, SP400 SP1000® SP2000® SPK-10® SP1750 SP1000 SP1950 SP2000 SP175

    TRANSISTOR REPLACEMENT GUIDE d882

    Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
    Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


    Original     		PDF

    ALY 03

    Abstract: ALY 23 power generation POWER COMMAND HM 1211 TG Series 1037h MX12 MX23 PM4328 PM4388 PM6388
    Text: PM4328 TECT3 STANDARD PRODUCT DATASHEET ISSUE 1 HIGH DENSITY T1/E1 FRAMER AND M13 MULTIPLEXER 05 :32 :39 AM PMC-2011596 ,2 ay to nT ue sd TECT3 0A ug us t, 2 00 2 PM4328 DATASHEET Do wn loa de db ya hm ed me tw aly of sil ico ne xp er HIGH DENSITY T1/E1 FRAMER WITH


    Original     		PDF PM4328 PMC-2011596 PM4328 PMC-2011596 PMC-2011465 ALY 03 ALY 23 power generation POWER COMMAND HM 1211 TG Series 1037h MX12 MX23 PM4388 PM6388

    SIL-PAD to-247

    Abstract: ASTM-A228 A228 T247 SIL-PAD K10 A366 C110 ASTM-A-366 TO220 HEATSINK Heatsinks TO247
    Text: WV Series Heatsinks For TO-220 and TO-247 devices T220 0.72" 18.3mm T247 0.92" (23.4mm) 0.63" (16.0mm) T220 1.20" (30.5mm) T247 1.20-1.26" (30.5-32.0mm) Ohmite Manufacturing has launched a series of heatsink solutions for use with our popular TO-220 and TO-247


    Original     		PDF O-220 O-247 O-247 6063T5 900-S, 800-S, WV-T220-101E O-220 WV-T247-101E SIL-PAD to-247 ASTM-A228 A228 T247 SIL-PAD K10 A366 C110 ASTM-A-366 TO220 HEATSINK Heatsinks TO247

    chotherm 1674

    Abstract: P4855-1 TC-30AG 32-microinch TO3 SILICONE MICA SHEET torque for SELF TAPPING SCREW 87-HS-9 to225a SIL-PAD density Case 806-05
    Text: SECTION 7 MOUNTING TECHNIQUES FOR THYRISTORS Edited and Updated Figure 7.1 shows an example of doing nearly everything wrong. A tab mount TO-220 package is shown being used as a replacement for a TO-213AA TO-66 part which was socket mounted. To use the socket, the


    Original     		PDF

    1587H

    Abstract: sdh demapper 1035H-1037H 1037h 1250H 1488h MX12 MX23 PM5365 9811J
    Text: PM5365 TEMAP STANDARD PRODUCT DATASHEET ISSUE 3 HIGH DENSITY VT/TU MAPPER AND M13 MULTIPLEXER 11 :3 2: 49 PM PMC-1991148 ,1 1J an ua ry ,2 00 3 PM5365 to n Sa tu rd ay TEMAP DATA SHEET PROPRIETARY AND CONFIDENTIAL RELEASED ISSUE 3: SEPTEMBER 2001 Do wn lo


    Original     		PDF PM5365 PMC-1991148 PM5365 1587H sdh demapper 1035H-1037H 1037h 1250H 1488h MX12 MX23 9811J

    PM8353

    Abstract: ELLS 110 PM4354 PM7324 PM7326 PM7343 G.SHDSL LOOP modems UNI-IMA-32 paladin 172 411
    Text: 2: 06 PM S/UNI-IMA-16 Telecom Standard Product Data Sheet Released Su nd ay ,0 5J an S/UNI-IMA-16 ua ry ,2 00 3 11 :0 PM7343 sil ico ne xp er to n S/UNI INVERSE MULTIPLEXING FOR ATM, 16 LINKS PROPRIETARY AND CONFIDENTIAL RELEASED ISSUE 1: MAY 2002 Do wn lo


    Original     		PDF S/UNI-IMA-16 S/UNI-IMA-16 PM7343 PMC-2020890, PM8353 ELLS 110 PM4354 PM7324 PM7326 PM7343 G.SHDSL LOOP modems UNI-IMA-32 paladin 172 411

    C2NC

    Abstract: 0x052B PM4332 TE-32 TR-TSY-000008 277-TE 407 0X090A 5SIL4 0x09c6
    Text: :35 PM TE-32 ASSP Telecom Standard Product Data Sheet Released t, 2 00 2 10 :54 PM4332 sd ay ,2 0A ug us TE-32 sil ico ne xp er to nT ue High Density 32 Channel T1/E1/J1 Framer Proprietary and Confidential Released Issue No. 5: June 2002 Do wn loa de db ya


    Original     		PDF TE-32 PM4332 TE-32 PMC-2011402, 23x23mm C2NC 0x052B PM4332 TR-TSY-000008 277-TE 407 0X090A 5SIL4 0x09c6

    P4855-1

    Abstract: Ablestik Transistor Substitution 1993 2088AB belleville washer 33702 SIL-PAD density 208ab 2088a 814a
    Text: Order this document by AN1040/D MOTOROLA SEMICONDUCTOR APPLICATION NOTE AN1040 MOUNTING CONSIDERATIONS FOR POWER SEMICONDUCTORS Prepared by: Bill Roehr Staff Consultant, Motorola Semiconductor Sector TABLE OF CONTENTS Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


    Original     		PDF AN1040/D AN1040 P4855-1 Ablestik Transistor Substitution 1993 2088AB belleville washer 33702 SIL-PAD density 208ab 2088a 814a

    2088AB

    Abstract: TO-210AA Package motorola mhw 252 mhw 592 to220 torque for SELF TAPPING SCREW socket SELF TAPPING SCREW 4-40 Kapton Washer eb107 SIL-PAD density TO-210AB
    Text: MOTOROLA Freescale Semiconductor, Inc. Order this document by AN1040/D SEMICONDUCTOR APPLICATION NOTE AN1040 NOTE: The theory in this application note is still applicable, but some of the products referenced may be discontinued. Mounting Considerations for Power


    Original     		PDF AN1040/D AN1040 2088AB TO-210AA Package motorola mhw 252 mhw 592 to220 torque for SELF TAPPING SCREW socket SELF TAPPING SCREW 4-40 Kapton Washer eb107 SIL-PAD density TO-210AB

    WELTREND SEMICONDUCTORS

    Abstract: DIP-40 LQFP-48 SDIP-28 WT65F4 WT65F4-N28 WT65F4-N40 WT65F4-Q48 WT65F4-S28 homepage ups
    Text: Suites 2202-7, 22/F, Tower 6, The Gateway, 9 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel 852 2123 3289 Fax (852) 2123 3393 E-mail: sales@jesstech.com HomePage: http://www.jesstech.com WT65F4 USB µC with 8KB ISP Flash memory & 12bit ADC WT65F4 USB uC with 8KB ISP Flash Memory


    Original     		PDF WT65F4 12bit 12-bit WELTREND SEMICONDUCTORS DIP-40 LQFP-48 SDIP-28 WT65F4 WT65F4-N28 WT65F4-N40 WT65F4-Q48 WT65F4-S28 homepage ups

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5675K Rev. 7, 5/2012 Qorivva MPC5675K Microcontroller Data Sheet 1 MPC5675K Introduction Document overview This document provides electrical specifications, pin assignments, and package diagrams for the Qorivva


    Original     		PDF MPC5675K OT-343R MPC5675K 32-bit

    LIDAR radar

    Abstract: MPC5675K mpc5675 MPC5673K e200z7d f5k5 Ultrasonic Transducer application notes MPC5674K 180MHZ-1 ultrasonic power generator with PLL
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5675K Rev. 7, 5/2012 Qorivva MPC5675K Microcontroller Data Sheet 1 MPC5675K Introduction Document overview This document provides electrical specifications, pin assignments, and package diagrams for the Qorivva


    Original     		PDF MPC5675K MPC5675K QFN12 OT-343R 32-bit LIDAR radar mpc5675 MPC5673K e200z7d f5k5 Ultrasonic Transducer application notes MPC5674K 180MHZ-1 ultrasonic power generator with PLL

    MPC5675K

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPC5675K Rev. 8, 10/2013 MPC5675K Qorivva MPC5675K Microcontroller Data Sheet 1 Introduction 1.1 Document overview Description The Qorivva MPC5675K microcontroller, a SafeAssure solution, is a 32-bit embedded controller designed for


    Original     		PDF MPC5675K MPC5675K 32-bit MPC5500/5600

    ni usb 6212

    Abstract: SS-00259-1 C2060 C2055 C2068 quanta C2096 R2067 915GM SW1010CPT
    Text: 1 2 3 4 5 478 PIN micro FC-PGA 14, 15, 15w , 17w inch XGA, SXGA+ A LVDS LCD P7 P3,4 400/533 MHz A LVDS Alviso DVI M24/M26 UNBUFFERED DDRII SODIMM DDRII 400/533 P10 915GM/PM R/G/B CRT P9 R/G/B UNBUFFERED DDRII SODIMM DDRII 400/533 1257 PIN (micro FCBGA) PCIE 16Lanes


    Original     		PDF M24/M26 915GM/PM 16Lanes 88E8053 ALC260 31x31mm) TI-TPA6011A4 33MHZ VT6212 11a/b/g ni usb 6212 SS-00259-1 C2060 C2055 C2068 quanta C2096 R2067 915GM SW1010CPT

    K C2026 Y

    Abstract: VT6212 sony C2105 c2078 c2166 C2068 c2096 Marvell 88E8053 C2060 C2076
    Text: 1 2 3 4 5 478 PIN micro FC-PGA 14, 15, 15w , 17w inch XGA, SXGA+ A LVDS LCD P7 P3,4 400/533 MHz A LVDS Alviso DVI M24/M26 UNBUFFERED DDRII SODIMM DDRII 400/533 P10 915GM/PM R/G/B CRT P9 R/G/B UNBUFFERED DDRII SODIMM DDRII 400/533 1257 PIN (micro FCBGA) PCIE 16Lanes


    Original     		PDF M24/M26 915GM/PM 16Lanes 88E8053 ALC260 31x31mm) TI-TPA6011A4 33MHZ VT6212 11a/b/g K C2026 Y VT6212 sony C2105 c2078 c2166 C2068 c2096 Marvell 88E8053 C2060 C2076

    ISL6259

    Abstract: transistor C3229 ISL6258AHRTZ transistor c6074 ISL9504BCRZ of transistor c2570 transistor c3300 c3228 transistor transistor c3150 c2570 transistor
    Text: 8 7 6 5 4 3 2 1. ALL RESISTANCE VALUES ARE IN OHMS, 0.1 WATT +/- 5%. 2. ALL CAPACITANCE VALUES ARE IN MICROFARADS. 3. ALL CRYSTALS & OSCILLATOR VALUES ARE IN HERTZ. 1 REV ECN DESCRIPTION OF REVISION C 0000813234 CK APPD DATE PRODUCTION RELEASED 2009-11-01


    Original     		PDF

    LPC47N354

    Abstract: BCM4401KQL quanta foxconn bm10 PR148 88sa8040 pq54 computer fan emc6n300
    Text: 1 2 DRAM Power 1.8V, 0.9V PG 43 DC/DC +3V_SRC +5VSUS A 3 6 7 TAHITI-INTEGRATED PG 44 Dothan AC/BATT CONNECTOR PG 47 BATT SELECTOR PG 40 BATT CHARGER PG 41 SYSTEM RESET CKT CLOCKS 478 Micro-FCPGA PG 15 PG 39 PG 3,4 Panel Connector PG 46 PG 17 4X133MHZ LVDS


    Original     		PDF 4X133MHZ SI1362 33MHz 88SA8040 19PBAT BAT54 100K/F BLM11B102S FDS4435 15K/F LPC47N354 BCM4401KQL quanta foxconn bm10 PR148 pq54 computer fan emc6n300

    2088AB

    Abstract: mhw 592 TC-30AG AN778 ierc heatsink RF 433 RR3 RF Power Modules 814a Aham-Tor SIL 1030
    Text: Order this document MOTOROLA m by AN1040/D SEMICONDUCTOR h m m b APPLICATION NOTE A N 1040 M ounting Considerations fo r Power Semiconductors Prepared by Bill Roehr Staff Consultant, Motorola Semiconductor Sector TABLE OF CONTENTS In tro d u c tio n .


    OCR Scan     		PDF AN1040/D MK145BP, RR3-20 2088AB mhw 592 TC-30AG AN778 ierc heatsink RF 433 RR3 RF Power Modules 814a Aham-Tor SIL 1030