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    Infineon Technologies AG SIGC158T170R3EX1SA3

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC158T170R3EX1SA)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC158T170R3EX1SA3 Waffle Pack 20 Weeks 1,431
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    Untitled

    Abstract: No abstract text available
    Text: SIGC158T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling Chip Type SIGC158T170R3E VCE IC 1700V 125A This chip is used for:  power modules


    Original     		PDF SIGC158T170R3E L7801M, L7801T, L7801E,

    Untitled

    Abstract: No abstract text available
    Text: SIGC158T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC158T170R3E VCE IC 1700V 125A This chip is used for: • power modules


    Original     		PDF SIGC158T170R3E L7801T,