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    SIGC158T120R3E Price and Stock

    Infineon Technologies AG SIGC158T120R3EX1SA

    Trans IGBT Chip N-CH 1.2KV DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC158T120R3EX1SA)
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    Avnet Americas SIGC158T120R3EX1SA Waffle Pack 1,404
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    Infineon Technologies AG SIGC158T120R3EX1SA4

    Trans IGBT Chip N-CH 1.2KV DIE (Alt: SP000533958)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    EBV Elektronik SIGC158T120R3EX1SA4 71 Weeks 1
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    SIGC158T120R3E Datasheets Context Search

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    Abstract: No abstract text available
    Text: SIGC158T120R3E IGBT3 Chip Features: • 1200V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC158T120R3E VCE IC 1200V 150A This chip is used for: • power modules


    Original     		PDF SIGC158T120R3E L7696T,