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    Infineon Technologies AG SIGC109T120R3EX1SA2

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC109T120R3EX1SA)
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    Avnet Americas SIGC109T120R3EX1SA2 Waffle Pack 1,998
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    Untitled

    Abstract: No abstract text available
    Text: SIGC109T120R3E IGBT3 Chip Features: • 1200V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC109T120R3E VCE IC 1200V 100A This chip is used for: • power modules


    Original     		PDF SIGC109T120R3E L7686T,

    Untitled

    Abstract: No abstract text available
    Text: SIGC109T120R3E IGBT3 Power Chip Features: • 1200V Trench & Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling Chip Type SIGC109T120R3E VCE IC 1200V 100A This chip is used for:  power modules


    Original     		PDF SIGC109T120R3E L7688M, L7688T, L7688E,