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    SIEMENS PACKAGE OUTLINES Search Results

    SIEMENS PACKAGE OUTLINES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    SIEMENS PACKAGE OUTLINES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Siemens Aktiengesellschaft

    Abstract: No abstract text available
    Text: Package Outlines Siemens Aktiengesellschaft 245 Summary of Package Outlines Memory Components Siemens Aktiengesellschaft 246 Summary of Package Outlines Siemens Aktiengesellschaft 247 Summary of Package Outlines Memory Modules Siemens Aktiengesellschaft 248


    OCR Scan     		PDF P-DIP-16 20A16 P-DIP-18-T P-DIP-20-T L-SIM-30-950 MO-064-AD L-SIM-72-1000 Siemens Aktiengesellschaft

    TO-220AB Option E3045 Package

    Abstract: TO-220AB Option E3044 Package
    Text: Gehäusemaßbilder Package Outlines SIEMENS Gehäusemaßbilder Package Outlines Maße in mm, wenn nicht anders angegeben (Dimensions in mm, unless otherwise specified) Bild 9 Semiconductor Group Figure 9 135 GehäusemaBbllder Package Outlines SIEMENS - 15 -14.8-


    OCR Scan     		PDF O-218 O-220 E3045 E3044 TO-220AB Option E3045 Package TO-220AB Option E3044 Package

    Circuit Diagrams

    Abstract: siemens Package Outlines ECONOPACK
    Text: SIEMENS Package Outlines and Circuit Diagrams Fig. 1 W eight: 150 g Dim ensions in mm Fig. 2 W eight: 250 g Dim ensions in mm SIS00026 Sem iconductor Group 302 SIEMENS Package Outlines and Circfuit Diagrams Fig. 3 W eight: 190 g Dim ensions in mm Fig. 4 W eight: 420 g


    OCR Scan     		PDF SIS00026 Circuit Diagrams siemens Package Outlines ECONOPACK

    BUP101

    Abstract: bup transistor A 671 transistor
    Text: • 823SbD5 QDSlBb^ 2 O S I E G SIEMENS SIEMENS AKTIENGESELLSCHAF 47E I> r-3 3 -13 BUP101 SIRET Siemens Ring Emitter Transistor VGe = 1000 V /0 =15 A • N channel • Breakdown-proof • Package: TO-218 AA TO P-3 1) Type Ordering code B U P 101 C 6 7 060-A 1000-A 2


    OCR Scan     		PDF 823SbD5 QDS13bci BUP101 O-218 C67060-A1000-A2 01234s6789a10 r-33-/3 BUP101 bup transistor A 671 transistor

    MARKING SMD T43

    Abstract: siemens Package Outlines Plastic Package siemens Package Outlines smd marking l5 7750a
    Text: Package Outlines SIEMENS Mem ory Com ponents P-DIP-20-2 Plastic Package Plastic dual in-line package P-SOJ-26/20-1 (SMD) Plastic Package (Plastic small outline J-lead) P-SOJ-26/20-5 (SMD) Plastic Package (Plastic dual in-line package) P-SO J-28-2 (SMD) Plastic Package


    OCR Scan     		PDF P-DIP-20-2 P-SOJ-26/20-1 P-SOJ-26/20-5 J-28-2 P-SOJ-40-1 P-SOJ-26/24-1 J-28-3 P-SOJ-34-1 P-SOJ-42-1 L-DIM-168-1 MARKING SMD T43 siemens Package Outlines Plastic Package siemens Package Outlines smd marking l5 7750a

    siemens Package Outlines

    Abstract: l20x
    Text: Summary of Types in Alphanumerical Order Semiconductor Group - Addresses Information on Literature Package Outlines SIEMENS P-SOJ-28-2 SMD Plastic Package (small outline J-lead) P-SOJ-40-1 (SMD) Plastic Package (small outline J-lead) P-SOJ-26/24-1 (300 mil) (SMD)


    OCR Scan     		PDF P-SOJ-28-2 P-SOJ-40-1 P-SOJ-26/24-1 P-SOJ-28/24-1 P-SOJ-28-3 P-TSOPII-26/20-1 P-ZIP-20/19-1 L-SIM-30-1 SocM-30-4 L-SIM-72-3 siemens Package Outlines l20x

    Untitled

    Abstract: No abstract text available
    Text: 47E D ÔE35bOS QG2175S 7 «IS IE G SIEMENS SIEMENS AKTIENGESELLSCHAF 7 ^ j 9 - / 3 BUZ 230 SIPMOS Power MOS Transistor Vos la ^D S on = 1000 V = 5.5 A = 2.0 Q • N channel • FREDFET • Enhancement mode • Package: T O -204A A (T O -3 )1) Type Ordering code


    OCR Scan     		PDF E35bOS QG2175S -204A 7078-A 105-A 023Sb05 QQ517bO T-39-13 SIL00733 SIL00740

    Untitled

    Abstract: No abstract text available
    Text: H ISIE G â235bG5 0020077 s SIEMENS SIEMENS A KT IE NGESELLSCHAF 47E T> T -39-/5 SIMOPAC MOSFET Module ^03 A ^DS on) • • • • • • BSM 121 AR (C) = 200 V = 130 A '=» 20 mfl Power module Single switch N channel Enhancement mode Package with insulated metal base plate


    OCR Scan     		PDF 235bG5 C67076-S1014-A2 235b05 535b05 T-39-15

    BSM300GA120DN2E3166

    Abstract: C67070-A2007-A70 D273 siemens igbt BSM300GA120DN2
    Text: SIEMENS BSM300GA120DN2E3166 IGBT Power Module Preliminary data • Single switch • Including fast free-wheeling diodes • Enlarged diode area • Package with insulated metal base plate Type BSM300GA120DN2E3166 VCE 1200V 430A Package Ordering Code SINGLE SWITCH 1


    OCR Scan     		PDF BSM300GA120DN2E3166 BSM300GA120DN2E3166 C67070-A2007-A70 fl235b05 053Sb05 53SLDS C67070-A2007-A70 D273 siemens igbt BSM300GA120DN2

    Untitled

    Abstract: No abstract text available
    Text: SIEMENS BSM150GB120DN2E3166 IGBT Power Module Preliminary data • Half-bridge • Including fast free-wheeling diodes • Enlarged diode area • Package with insulated metal base plate BSM150GB120DN2E3166 h 1200V 210A 111 Type Package Ordering Code HALF-BRIDGE 2


    OCR Scan     		PDF BSM150GB120DN2E3166 C67076-A2112-A70 ID0fl020fl 023Sb05

    microwave transistor siemens

    Abstract: Siemens Microwave A 1887 transistor siemens p1
    Text: SIEMENS HiRel Discrete and Microwave Semiconductors 5 Package Outlines HiRel 5.1 Package Outlines of Diode Packages SYMBOL B B1 D D1 d di F L MILLIMETRES MIN MAX 3.10 3.56 3.00 3.30 1.70 1 30 055 0.65 0.10 0.15 025 0.40 2.40 2.60 5.50 « Anode / D1 Cathode end


    OCR Scan     		PDF HPAC140 Microw90 MWP-25 MWP-35 microwave transistor siemens Siemens Microwave A 1887 transistor siemens p1

    BSM50GD60DN2E3226

    Abstract: No abstract text available
    Text: SIEMENS BSM50GD60DN2E3226 IGBT Power Module • Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate • E3226: long terminals, limited current per terminal Type VCE lc Package Ordering Code


    OCR Scan     		PDF BSM50GD60DN2E3226 E3226: BSM50GD60DN2E3226

    VQE 13E

    Abstract: No abstract text available
    Text: SIEMENS BSM150GB170DN2 E3166 IGBT Power Module Preliminary data • Half-bridge • Including fast free-wheeling diodes • Enlarged diode area • Package with insulated metal base plate • ^G on.min = Ohm Type BSM150GB170DN2 E3166 h Vcz 1700V 220A Package


    OCR Scan     		PDF BSM150GB170DN2 E3166 C67070-A2709-A67 0235b05 VQE 13E

    Untitled

    Abstract: No abstract text available
    Text: SIEMENS BXY 42BA-6 Silicon PIN Diode • Fast switching • Coax package * E SD : Electrostatic discharge sensitive device, observe handling precautions! Type Marking Ordering C ode Pin Configuration Package* B X Y 42BA-6 - Q62702-X146 Í D ki o EHA07001


    OCR Scan     		PDF 42BA-6 Q62702-X146 EHA07001 S23SbGS AB35LQ5 GDbb73fl

    siemens igbt

    Abstract: No abstract text available
    Text: SIEMENS BSM300GA170DN2 E3166 IGBT Power Module Prelim inary data • Half-bridge • Including fast free-wheeling diodes • Enlarged diode area • Package with insulated metal base plate • on.min = 5-6 Ohm Type Kce BSM300GA170DN2 E3166 1700V 440A 1c Package


    OCR Scan     		PDF BSM300GA170DN2 E3166 E3166 C67070-A2710-A67 siemens igbt

    siemens Package Outlines

    Abstract: No abstract text available
    Text: SIEMENS SDA 5650/X Package Outlines P-DIP-14-1 Plastic Dual In-line Package 7ß to2 1.5mex 2.54 0.45 84 -os 7.8 woai 14x 14 8 1 u u y y u a 7 r F? F I Fi_£3_E3-E3-E3. 17.6 . 0.25max Q a. O Index Marking P-DSO-20-1 (Plastic Dual Small Outline Package) 0.35x46'


    OCR Scan     		PDF P-DIP-14-1 5650/X 25max P-DSO-20-1 35x46' siemens Package Outlines

    Untitled

    Abstract: No abstract text available
    Text: SIEMENS 6 SD A 5642-6/X Package Outlines P-DSO-20-1 Plastic Dual Small Outline Package 1,27 0.85•to* a 41MÌ 20x 1) Does not Include plastic or metal protrusion of 0.15 max. per side 2) Does not Include damber protrusion to CL O Sorts of Packing Package outlines for tubes, trays etc. are contained in our


    OCR Scan     		PDF 5642-6/X P-DSO-20-1

    Motorola SMD code

    Abstract: PSB21525-N
    Text: SIEMENS High-Level Serial Communications Controller Extended HSCX-TE PSB 21525 Version 2.1 1 CMOS Features Package Besides P-LCC-44-1 and P-MQFP-44-2, the HSCX-TE PSB 21525 is available also in P-TQFP-64-1 package. Type Ordering Code Package PSB 21525 N Q67100-H6672


    OCR Scan     		PDF P-LCC-44-1 P-MQFP-44-2, P-TQFP-64-1 Q67100-H6672 Q67100-H6671 Q67101-H6733 P-LCC-44-1 P-MQFP-44-2 P-TQFP-64-1 FP-64-1 Motorola SMD code PSB21525-N

    Untitled

    Abstract: No abstract text available
    Text: SIEMENS BSM150 GT 120 DN2 IGBT Power Module Preliminary data • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type BSM 150 GT 120 DN2 K ce 1200V 200A Package Ordering Code


    OCR Scan     		PDF BSM150 C67070-A2518-A67 resista25

    NS160H

    Abstract: No abstract text available
    Text: SIEMENS BSM 100G D120 DN2 IGBT Power Module Preliminary data • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type BSM 100 GD 120 DN2 h VCE 1200V 150A Package Ordering Code


    OCR Scan     		PDF GU10H76 NS160H

    VPS053

    Abstract: No abstract text available
    Text: SIEMENS Gehäusebauformen Package Outlines Dieses Gehäuse ist nicht mehr lieferbar! This package is not available! / i1— - 4.75 T — VMT05Î60 13.5 — * 1 5.5 i t 1— 2.54 5.2 3 TO-18 Pin Gewicht etwa 0,3 g Approx. weight 0.3 g 1 2 3 S G D Figure 1


    OCR Scan     		PDF VMT05 GPT05548 E-6288 M13-GM135273 M17-GM175569 VPS053

    Untitled

    Abstract: No abstract text available
    Text: SIEMENS BSM 150 GB 170 DN2 IGBT Power Module Preliminary data • Half-bridge • Including fast free-wheeling diodes • Package with insulated metal base plate • on.min = 10 Ohm BSM 150 GB 170 DN2 1C 1700V 220A LU Type Package Ordering Code HALF-BRIDGE 2


    OCR Scan     		PDF C67070-A2704-A67 0235bD5

    siemens igbt BSM 300

    Abstract: GT120DN2
    Text: SIEMENS BSM 200 GT 120 DN2 IGBT Power Module Preliminary data • Solderable Power module • 3-phase full-bridge • Including fast free-wheel diodes • Package with insulated metal base plate Type VCE BSM 200 GT 120 DN2 1200V 300A h Package Ordering Code


    OCR Scan     		PDF

    siemens igbt BSM 300 gb

    Abstract: siemens igbt BSM 300
    Text: SIEMENS BSM 400 GB 60 DN2 IGBT Power Module Preliminary data • Half-bridge • Including fast free-wheeling diodes • Package with insulated metal base plate Type BSM 400 GB 60 DN2 VCE 600V 475A Package Ordering Code HALF-BRIDGE 2 C67070-A2120-A67 Maximum Ratings


    OCR Scan     		PDF C67070-A2120-A67 siemens igbt BSM 300 gb siemens igbt BSM 300