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    SIDE BRAZED Search Results

    SIDE BRAZED Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MG800FXF1ZMS3 Toshiba Electronic Devices & Storage Corporation N-ch SiC MOSFET Module, 3300 V, 800 A, iXPLV, High-side: SiC MOSFET、Low-side: SiC SBD Visit Toshiba Electronic Devices & Storage Corporation
    MG800FXF1JMS3 Toshiba Electronic Devices & Storage Corporation N-ch SiC MOSFET Module, 3300 V, 800 A, iXPLV, High-side: SiC SBD、Low-side: SiC MOSFET Visit Toshiba Electronic Devices & Storage Corporation
    ISO120SG Texas Instruments ISOLATION AMPLIFIER, 1500V ISOLATION-MIN, 60kHz BAND WIDTH, CDIP16, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-24/16 Visit Texas Instruments
    ISO120G Texas Instruments ISOLATION AMPLIFIER, 1500V ISOLATION-MIN, 60kHz BAND WIDTH, CDIP16, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-24/16 Visit Texas Instruments
    ISO120BG Texas Instruments ISOLATION AMPLIFIER, 1500V ISOLATION-MIN, 60kHz BAND WIDTH, CDIP16, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-24/16 Visit Texas Instruments

    SIDE BRAZED Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    B-3067

    Abstract: B-3226 TST-9107 DD-03182GP-200 ddc b-3067 DD-03282GP-200 B-3227 HS1-3182-5 ddc B-3226 DD-03282DC-120
    Text: INDUSTRY CROSS REFERENCE GUIDE ARINC 429 PACKAGE HOLT PART DEI LINE DRIVER 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 16-PIN CERAMIC SIDE-BRAZED DIP 28-PIN CERAMIC LEADLESS CHIP CARRIER 28-PIN CERAMIC LEADLESS CHIP CARRIER


    Original     		PDF 16-PIN 28-PIN B-3067 B-3226 TST-9107 DD-03182GP-200 ddc b-3067 DD-03282GP-200 B-3227 HS1-3182-5 ddc B-3226 DD-03282DC-120

    5-Lead Plastic DD Pak ltc Q

    Abstract: ADI TI 20 PIN LEADLESS CHIP CARRIER qfn 44 PACKAGE footprint 9mm DN SOT-223 8 lead side brazed MS8 PACKAGE footprint 5 lead dd pak maxim Cross Reference Search WO10
    Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE* DESCRIPTION LTC NSC ADI TI/BURR-BROWN MAXIM 8-Lead Side Brazed Hermetic D8 D D — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic)


    Original     		PDF 28-Lead 56-Lead 28-Lead 36-Lead 10-Lead 20-Lead O-220 5-Lead Plastic DD Pak ltc Q ADI TI 20 PIN LEADLESS CHIP CARRIER qfn 44 PACKAGE footprint 9mm DN SOT-223 8 lead side brazed MS8 PACKAGE footprint 5 lead dd pak maxim Cross Reference Search WO10

    117450

    Abstract: TO253 lt941 ltc947 1624i LT 129i5 sm 2178a LT1510CGN sot23 1303 ltbw 83
    Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D D ADI/PMI — l — — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic) D D D YB QB XB L — — DD, DE, DN, DP


    Original     		PDF 20-Lead 20-Lead O-220 117450 TO253 lt941 ltc947 1624i LT 129i5 sm 2178a LT1510CGN sot23 1303 ltbw 83

    LTC DWG 05-08-1661

    Abstract: ks 15544 transistor FN 1016 MS10 SO18 SO20 SO24 WO10 TO253 WO14
    Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D D ADI/PMI — l — — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic) D D D YB QB XB L — — DD, DE, DN, DP


    Original     		PDF 20-Lead 20-Lead O-226) LTC DWG 05-08-1661 ks 15544 transistor FN 1016 MS10 SO18 SO20 SO24 WO10 TO253 WO14

    Untitled

    Abstract: No abstract text available
    Text: OVER-THE-SIDE IMMERSION HEATERS PRODUCT DESCRIPTION Over-the side immersion heaters are designed for vessels where through the side immersion heaters cannot be conveniently installed. These heaters are installed through the top of the vessel with the heated portion of the unit along the


    Original     		PDF

    DD 127 D TRANSISTOR

    Abstract: FK 231 SA 220 transistor fn 1016 LTC DWG FN 1016 dp 502 t TO 220 MOT E SO18 TI 3-Lead Plastic DD Pak ltc m 5-Lead Plastic DD Pak ltc Q
    Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D


    Original     		PDF 20-Lead 20-Lead 28-Lead O-226) DD 127 D TRANSISTOR FK 231 SA 220 transistor fn 1016 LTC DWG FN 1016 dp 502 t TO 220 MOT E SO18 TI 3-Lead Plastic DD Pak ltc m 5-Lead Plastic DD Pak ltc Q

    LT1460BCS3-10

    Abstract: marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS
    Text: PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE LCC METAL CAN CERDIP Ceramic Dual-In-Line METAL CANS SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE DESCRIPTION LTC NSC MOT TI LINFIN MAXIM 8-Lead Side Brazed Hermetic D8 D


    Original     		PDF 20-Lead 20-Lead 28-Lead LT1613CS5 LT1615CS5 LT1615CS5-1 LT1617CS5 LT1617CS5-1 LT1761ES5-1 LT1761ES5-2 LT1460BCS3-10 marking code LTGG LTGF marking code sot 23 MARK LTGG LTKD MARKING CODE ltbw LM 3937 LT1460BCS3-2 LT1521CS8-3 LTHS

    Untitled

    Abstract: No abstract text available
    Text: 2.0 RADHARD MSI PACKAGES Side-Brazed Packages 245 RadHard MSI Logic Flatpack Packages RadHard MSI Logic 246


    Original     		PDF

    d1001-09

    Abstract: d10-0109
    Text: Supertex inc. Package Outline 20-Lead Ceramic Side-Brazed Package Outline C/NC .980x.280in. body, .200in. height (max), .100in. pitch D 20 Note 1 (Index Area) E1 E b1 1 b Top View View B View B Seating Plane A L A A1 e eA A eB Side View View A - A Note:


    Original     		PDF 20-Lead 280in. 200in. 100in. DSPD-20CDIPCNC D100109 d1001-09 d10-0109

    Untitled

    Abstract: No abstract text available
    Text: 2.0 RAD-HARD MSI PACKAGES Side-Brazed Packages 237 Rad-Hard MSI Logic Flatpack Packages Rad-Hard MSI Logic 238


    Original     		PDF

    DS812

    Abstract: Side Brazed Ceramic Dual-In-Line Packages lead side brazed hermetic
    Text: data sheet CERAMIC / HERMETIC Side Braze Side Braze SB Amkor Technology is committed to continuing to service this long established standard industry package. The SB package comes in a wide range of lead counts: from 8-48 leads with a lead pitch of 100 mil inches. This thru-hole package consists


    Original     		PDF DS812 DS812 Side Brazed Ceramic Dual-In-Line Packages lead side brazed hermetic

    Untitled

    Abstract: No abstract text available
    Text: Package Outline 20-Lead Ceramic Side-Brazed Package Outline C/NC .980x.280in. body, .200in. height (max), .100in. pitch D 20 Note 1 (Index Area) E1 E b1 1 b Top View View B View B Seating Plane A L A A1 e eA A eB Side View View A - A Note: 1. A Pin 1 identifier must be located in the index area indicated. The Pin 1 identifier can be: a molded mark/identifier; an embedded metal marker; or


    Original     		PDF 20-Lead 280in. 200in. 100in. DSPD-20CDIPCNC C101008

    ISO103

    Abstract: ISO103B PWS750-1
    Text: ISO103 Low-Cost, Internally Powered ISOLATION AMPLIFIER FEATURES APPLICATIONS ● SIGNAL AND POWER IN ONE DOUBLE-WIDE 0.6" SIDE-BRAZED PACKAGE ● 5600Vpk TEST VOLTAGE ● 1500Vrms CONTINUOUS AC BARRIER RATING ● MULTICHANNEL ISOLATED DATA ACQUISITION


    Original     		PDF ISO103 5600Vpk 1500Vrms 4-20mA 20kHz PWS750-1 PWS750-1 ISO103 ISO103B

    ISO103

    Abstract: pt100/RTD PT100 ISO103B PWS750-1 Isolated 4-20ma
    Text: ISO103 Low-Cost, Internally Powered ISOLATION AMPLIFIER FEATURES APPLICATIONS ● SIGNAL AND POWER IN ONE DOUBLE-WIDE 0.6" SIDE-BRAZED PACKAGE ● 5600Vpk TEST VOLTAGE ● MULTICHANNEL ISOLATED DATA ACQUISITION ● 1500Vrms CONTINUOUS AC BARRIER RATING


    Original     		PDF ISO103 5600Vpk 1500Vrms 20kHz 4-20mA PWS750-1 PWS750-1 ISO103 pt100/RTD PT100 ISO103B Isolated 4-20ma

    DS33023

    Abstract: PIC16C72 seminar Applications Book Maxim AN578 PIC16CR72
    Text: M PIC16C72 SERIES 8-Bit CMOS Microcontrollers with A/D Converter Devices included: Pin Diagrams • PIC16C72 SDIP, SOIC, SSOP, Windowed Side Brazed Ceramic • PIC16CR72 Microcontroller Core Features:  1998 Microchip Technology Inc. •1 28 RB7 RA0/AN0


    Original     		PDF PIC16C72 PIC16C72 PIC16CR72 DS33023 seminar Applications Book Maxim AN578 PIC16CR72

    PIC16C72

    Abstract: PIC Mid-Range Reference Manual DS33023
    Text: PIC16C72 SERIES 8-Bit CMOS Microcontrollers with A/D Converter Devices included: Pin Diagrams • PIC16C72 SDIP, SOIC, SSOP, Windowed Side Brazed Ceramic • PIC16CR72 Microcontroller Core Features:  1998-2013 Microchip Technology Inc. •1 28 RB7 RA0/AN0


    Original     		PDF PIC16C72 PIC16C72 PIC16CR72 Me-3-5770-955 DS39016B-page PIC Mid-Range Reference Manual DS33023

    ansi y14.5m-1982

    Abstract: 100-PIN CB100 XC3000
    Text: NON LID SIDE LID SIDE s Y M B A2 DETAIL ’A’ □ DETAIL ’B’ NOTES: 1. ALL DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y 1 4 .5 M - 1 982 2. SYMBOL ” N” IS THE NUMBER OF TERMINALS. 3. PACKAGES ARE SHIPPED UNFORMED. 4. LEAD FINISH: GOLD 50 MICROINCHES MINIMUM


    OCR Scan     		PDF 5M-1982 MIL-l-38535 100-PIN CB100) XC3000 ansi y14.5m-1982 CB100

    CB164

    Abstract: XC3000 164-pin 007012c
    Text: LID SIDE NON LID SIDE SECTION P - P s / Y M aTT ^ T jt t DETAIL ’A’ INCHES B bJ U DETAIL ’B’ □ L ,130 A1 ,110 AP ,020 C D l/ E l 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y1 4 .5 M - 1 982 MAX, NDM, A B NOTES: MIN. ,007 ,005 ,006 ,012 ,009


    OCR Scan     		PDF 5M-1982 MIL-l-38535 164-PIN CB164) XC3000 CB164 007012c

    BSC 25-05

    Abstract: CB164 XC4000
    Text: LID SIDE NON LID SIDE SECTION P - P s Y M B t-U i A1 A «"t h DETAIL ’A' □ L INCHES MIN. MAX, NDM, B- ,130 A DETAIL ’B’ Al ,110 "’ S - ,020 AP B NOTES: C D l/ E l 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y 14.5 M —1982 ,007 ,005 -S - ,006


    OCR Scan     		PDF 5M-1982 MIL-l-38535 164-PIN CB164) XC4000 BSC 25-05 CB164

    ansi y14.5m-1982

    Abstract: 100-PIN CB100 XC4000 5M-1982
    Text: NON LID SIDE LID SIDE s Y M B A2 □ DETAIL ’A’ DETAIL ’B’ NOTES: L MIN, NDM. MAX, ,135 A Al ,115 A2 ,020 B C 1. ALL DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y 1 4 .5 M -1 982 IN CH ES D l/ E l ,006 ,005 ,008 ,006 ,012 ,009 ,740 ,750 ,765 ,600 BSC


    OCR Scan     		PDF 5M-1982 MIL-l-38535 100-PIN CB100) XC4000 ansi y14.5m-1982 CB100

    Untitled

    Abstract: No abstract text available
    Text: Installation Tools Crimping Guidelines for PANDUIT P a n -TEr m ® Terminals and Disconnects C R IM P DIRECTIO N dznL= L IN SU LATIO N C R IM P A R E A IND EN TER SIDE B R A Z E D SEAM 1 i IND EN TER SIDE — ^ (B U TTE D SEAM ) J Insulated Terminals and Disconnects


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: LID SIDE NON LID SIDE SEE DETAIL ’B’ £ SECTION P - P J_L 1 A1 A ¡rtrr s u u u U U □ DETAIL ’A ’ L B— NOTES: Y M B DETAIL ’B’ IN C H E S MIN, MAX, NDM, A Al ,130 ,081 ,090 ,105 A2 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ANSI Y 14.5 M —1982


    OCR Scan     		PDF 5M-1982 MIL-l-38535 196-PIN CB196

    AD2700

    Abstract: No abstract text available
    Text: S iP e X HS2700 SERIES "cofDOfatiori^ “ CofDOfatiori' SIGNAL PROCESSING EXCELLENCE PRECISION +10V, •10V, ±10V REFERENCES FEATURES ■ High accuracy: 10.000 volts, ±2,5mV ■ Low temperature coefficient: 3 ppm/°C ■ 14-pin ceramic side brazed package


    OCR Scan     		PDF HS2700 14-pin AD2700 HS2701 HS2702 MIL-STD-883C

    HV20420C

    Abstract: No abstract text available
    Text: HV204 inc. Objective Low Charge Injection 8-Channel High Voltage Analog Switch Ordering Information_ Package Options V - Vw NN * PP 28-pin ceramic*1 side-brazed DIP 200V Die in waffle pack 28-pin plastic DIP HV20420X HV20420P HV20420C


    OCR Scan     		PDF HV204 28-pin HV20420C HV20420X HV20420P 28-lead HV20420PJ IL-STD-883 10MHz HV20420C