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    SIDC112D170H Price and Stock

    Infineon Technologies AG SIDC112D170HX1SA2

    Diode Switching 205A DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC112D170HX1SA2)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIDC112D170HX1SA2 Waffle Pack 1,026
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    • 10000 $12.98801
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    SIDC112D170H Datasheets Context Search

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    chip diode "sawn on foil"

    Abstract: soft solder die bonding infineon 205a
    Text: SIDC112D170H Fast switching diode Features: • 1700V technology, Emitter Controlled Diode 3th generation, 200 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient Chip Type SIDC112D170H VR IF 1700V 205A A This chip is used for:


    Original     		SIDC112D170H L4502A, chip diode "sawn on foil" soft solder die bonding infineon 205a PDF