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SG3532D Abstract: UC3844AD SG3524D SG2844D SG3549D MC33164-3DM sg3843d UC3843AD FORM0309 LX1431CDM Text: PROCESS/PRODUCT CHANGE NOTIFICATION Integrated Products Subject: Pb-free Transition for devices assembled in Narrow Body SOIC Packages, including D, DM and DP P.C.N. NO.: DATE: 034 July 16, 2004 TO: CUSTOMER CONTACT INFORMATION MICROSEMI INTENDS TO MAKE A CHANGE IN OUR PROCESS/PRODUCT AND SEEK YOUR	Original	PDF	LX1882CDM SG2845D LX5650CDM SG3524D LX6431ACDM SG3532D LX6431AIDM SG3549D LX6431BCDM SG3843D SG3532D UC3844AD SG3524D SG2844D SG3549D MC33164-3DM sg3843d UC3843AD FORM0309 LX1431CDM

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PDF

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SG3532D

Abstract: UC3844AD SG3524D SG2844D SG3549D MC33164-3DM sg3843d UC3843AD FORM0309 LX1431CDM
Text: PROCESS/PRODUCT CHANGE NOTIFICATION Integrated Products Subject: Pb-free Transition for devices assembled in Narrow Body SOIC Packages, including D, DM and DP P.C.N. NO.: DATE: 034 July 16, 2004 TO: CUSTOMER CONTACT INFORMATION MICROSEMI INTENDS TO MAKE A CHANGE IN OUR PROCESS/PRODUCT AND SEEK YOUR

Original

PDF

LX1882CDM SG2845D LX5650CDM SG3524D LX6431ACDM SG3532D LX6431AIDM SG3549D LX6431BCDM SG3843D SG3532D UC3844AD SG3524D SG2844D SG3549D MC33164-3DM sg3843d UC3843AD FORM0309 LX1431CDM