Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SG-BGA-7052 Search Results

    SG-BGA-7052 Result Highlights (5)

    Part
    ECAD Model
    Manufacturer
    Description
    Download
    Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions

    SG-BGA-7052 Datasheets (1)

    Part
    ECAD Model
    Manufacturer
    Description
    Curated
    Datasheet Type
    PDF
    SG-BGA-7052 Ironwood Electronics High Density GHz BGA Sockets; Max Pincount: 81; Top Pitch (mm): 0.5; IC Array X: 9; IC Array Y: 9; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1.2; IC Size X (mm): 6; IC Size Y (mm): 6; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.22; IC Ball Height Min (mm): 0.08; IC Ball Height Max (mm): 0.32; IC Ball Diameter Max (mm): 0.35; Max Package Code: Part Description: GHz BGA Socket (ZIF)-HD Original PDF