SG-BGA-6056 Search Results
SG-BGA-6056 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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MPC860PZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |||
MPC860PVR80D4 |
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32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |||
MPC855TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |||
MPC860TCZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |||
MPC860ENZQ50D4 |
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32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
SG-BGA-6056 Price and Stock
Ironwood Electronics SG-BGA-6056BGA SOCKET KIT |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SG-BGA-6056 | 2 |
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Buy Now |
SG-BGA-6056 Datasheets (1)
Part | ECAD Model | Manufacturer | Description | Curated | Type | |
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SG-BGA-6056 |
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GHz BGA Sockets-1.0mm; IC Size X (mm): 23; IC Size Y (mm): 23; IC Array X: 22; IC Array Y: 22; Max Pincount: 484; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.15; IC Ball Diameter Max (mm): 0.65; IC Ball Height Max (mm): 0.5; IC Ball Height Min (mm): 0.3; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.12; Max Package Code: BGA484C; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF) | Original |