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    Thermal Considerations for Power Semiconductors

    Abstract: 74F2244 74F240 74F244 74F245 74F299 74F373 74F374 74F543 74F827
    Text: INTEGRATED CIRCUITS AN2021 Thermal considerations for FAST logic products 1995 Mar 13 Philips Semiconductors Philips Semiconductors Application note Thermal considerations for FAST logic products AN2021 The equation for static power dissipation is, INTRODUCTION


    Original     		PDF AN2021 Thermal Considerations for Power Semiconductors 74F2244 74F240 74F244 74F245 74F299 74F373 74F374 74F543 74F827

    ssop junction to ambient resistance

    Abstract: AN2021 Package Thermal Considerations SMD Packages 74F2244 74F240 74F244 74F245 Thermal Considerations for Power Semiconductors 74F373
    Text: Philips Semiconductors Application note Thermal considerations for FAST logic products AN2021 The equation for static power dissipation is, INTRODUCTION Thermal considerations by both supplier and user require more attention as package sizes shrink and operating frequencies


    Original     		PDF AN2021 SF00654 SF00655 ssop junction to ambient resistance AN2021 Package Thermal Considerations SMD Packages 74F2244 74F240 74F244 74F245 Thermal Considerations for Power Semiconductors 74F373