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    DC2050A Analog Devices LT3753EFE Isolated Self Driven Visit Analog Devices Buy
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    Catalog Datasheet MFG & Type PDF Document Tags

    YEW-2755

    Abstract: HP3478A MQ-1601 MC3015 MC30-101K MC30 High voltage
    Text: MC30 Molded Chip Inductors A Dimensions In. B C A B C D E F G H I D F E I G Electrical Inductance Q: Measured on Q meter HP4342A, MQ1601. Self Resonant Frequency SRF: Measured on Impedance Analyzer HP4191A or HP4195A. DC Resistance RDC: Measured on Wheatstone Bridge


    Original     		PDF HP4342A, MQ1601. HP4191A HP4195A. YEW-2755 HP3478A. HP3478A MQ-1601 MC3015 MC30-101K MC30 High voltage

    led matrix 5x7 18

    Abstract: 5 inch 5x7 Dot Matrix Display 14 pin diagram of LED dot matrix display 5x7 pin diagram of LED dot matrix display 5x7 pin diagram of LED dot matrix display 5x7 2 color 5 x 7 led dot matrix ALPHANUMERIC DISPLAY image DOT matrix LED display full decoder Ic led display board 8 x 8 Matrix LED Display Driver
    Text: HDSP-2131, HDSP-2132, HDSP-2133, HDSP-2179 Eight Character 5.0 mm 0.2 inch Glass/Ceramic Intelligent 5x7 Alphanumeric Displays for Military Applications Data Sheet Description The HDSP-2131 (yellow), HDSP-2179 (orange), HDSP-2132 (high efficiency red) and the HDSP-2133


    Original     		PDF HDSP-2131, HDSP-2132, HDSP-2133, HDSP-2179 HDSP-2131 HDSP-2132 HDSP-2133 HDSP-213x led matrix 5x7 18 5 inch 5x7 Dot Matrix Display 14 pin diagram of LED dot matrix display 5x7 pin diagram of LED dot matrix display 5x7 pin diagram of LED dot matrix display 5x7 2 color 5 x 7 led dot matrix ALPHANUMERIC DISPLAY image DOT matrix LED display full decoder Ic led display board 8 x 8 Matrix LED Display Driver

    3.3uH 1210 size inductor

    Abstract: MCFT000154 inductor 100uH 2.2uH inductor 3.3uH inductor 4.7uH inductor MCFT000157 Inductor inductor 680uH INDUCTOR 220uH
    Text: Wound Chip Ferrite Inductors Features: • • • • • Very strong solderability by flow soldering, soldering iron or wave soldering. Highly accurate dimensions, can be mounted automatically. Terminals are highly resistant to pull forces. Highly resistant to mechanical shocks and pressure.


    Original     		PDF

    NL12T681

    Abstract: NL05T100 NL12-T331 NL12-TC391 T120 crystal TC102 NL10 HP-4284 NL20 TR12
    Text: Wound Chip Inductors Ferrite – NL Series These revolutionary, highly reliable wound chip inductors for automatic mounting, have been developed in response to the trend toward high density in electronic equipment. With metal terminals and a body of heat resistant resin, these inductors offer many superior features.


    Original     		PDF 100cycles 24hrs 1000hrs NL12T681 NL05T100 NL12-T331 NL12-TC391 T120 crystal TC102 NL10 HP-4284 NL20 TR12

    1R02

    Abstract: rr0805 MIL-R-55342-D CHP CHP Vishay
    Text: Data sheet E 2/3.720 - 10497 CHP HCHP ESA SCC 4001 CECC in progress high stability resistor chips – thick film technology SFERNICE thick film resistor chips are especially designed to meet very stringent specifications in terms of reliability, stability, homogeneity, reproductibility and quality.


    Original     		PDF MIL-R-55342 1R02 rr0805 MIL-R-55342-D CHP CHP Vishay

    28F160

    Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
    Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than


    Original     		PDF

    Zentech

    Abstract: air humidity HP4285 INDUCTOR DIP Mil-std
    Text: Reliability test conditions Part 04/2003 EMC & Inductive Solutions Max- Eyth-Str. 1 D-t4638 Waldenburg SMD WE-PD – Series 74477xxx QS-Level: Standard: MIL-STD-202F Method 215 AQL Visual 0.25% Electrical(0.015%) Characteristic DC Resistance(Rdc) Performance


    Original     		PDF D-t4638 74477xxx MIL-STD-202F HP4285 Zentech3305 Zentech air humidity INDUCTOR DIP Mil-std

    MQ-1601

    Abstract: No abstract text available
    Text: Molded Chip Inductors A Dimensions In. A B C D E F G H I Allied Part Number MC20-R005M MC20-R010M MC20-R012M MC20-R015M MC20-R018M MC20-R022M MC20-R027M MC20-R033M MC20-R039M MC20-R047M MC20-R056M MC20-R068M MC20-R082M MC20-R10M MC20-R12M MC20-R15M MC20-R18M


    Original     		PDF MC20-R005M MC20-R010M MC20-R012M MC20-R015M MC20-R018M MC20-R022M MC20-R027M MC20-R033M MC20-R039M MC20-R047M MQ-1601

    YEW-2755

    Abstract: HP3478 HP3478A top magnetics corporation top magnetics HWI322522-1R5M HWI322522-100K HWI322522-1R0M HWI322522-220K HWI322522-330K
    Text: SPECIFICATION FOR APPROVAL Product Name MOLDED WIREWOUND CHIP INDUCTOR HIGH CURRENT TMC Part No. HWI322522 SERIES Page 2 Rev. No. 5. ELECTRICAL CHARACTERISTICS : TMC Part No. HWI322522-1R0M HWI322522-1R5M HWI322522-2R2M HWI322522-3R3M HWI322522-4R7M HWI322522-6R8M


    Original     		PDF HWI322522 HWI322522-1R0M HWI322522-1R5M HWI322522-2R2M HWI322522-3R3M HWI322522-4R7M HWI322522-6R8M HWI322522-100K HWI322522-150K HWI322522-220K YEW-2755 HP3478 HP3478A top magnetics corporation top magnetics HWI322522-1R5M HWI322522-100K HWI322522-1R0M HWI322522-220K HWI322522-330K

    Copper wire to inductors

    Abstract: R 4R7 inductor HWI322522-100 HWI322522-150 HWI322522-1R0 HWI322522-1R5 HWI322522-2R2 HWI322522-3R3 HWI322522-4R7 HWI322522-6R8
    Text: MOLDED WIREWOUND CHIP INDUCTORS HWI322522 SERIES 1. PART NO. EXPRESSION : HW I 3 2 2 5 2 2 - 1 R 0 K F a (b) (c) (d)(e) (a) Series code (d) Tolerance code : K = ±10%, M = ±20% (b) Dimension code (e) F : Lead Free (c) Inductance code : 1R0 = 1.00uH 2. CONFIGURATION & DIMENSIONS :


    Original     		PDF HWI322522 Specifica15 Copper wire to inductors R 4R7 inductor HWI322522-100 HWI322522-150 HWI322522-1R0 HWI322522-1R5 HWI322522-2R2 HWI322522-3R3 HWI322522-4R7 HWI322522-6R8

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    NATIONAL SEMICONDUCTOR ink MARKING

    Abstract: Die Attach epoxy stamping cte table flip chip substrate cte table ic bga JESD 49 gold wire bond failures due to ultrasonic cleaning Aluminum alloys physical properties FLIP CHIP PRODUCTS micro machine thermal conductivity coefficient of thermal expansion of thermal conductive pressure sensitive adhesive
    Text: September 2000 Die Products Business Unit as watches, calculators and smart cards as well as leading edge multiple die applications like cellular handsets and digital cameras. Better device performance utilizing die show up in processor modules for computers, workstations and servers as


    Original     		PDF

    5r6 inductor

    Abstract: HWI453232 HWI453232-1R0 HWI453232-1R2 HWI453232-1R5 HWI453232-1R8 HWI453232-2R2 HWI453232-2R7 HWI453232-3R3 HWI453232-3R9
    Text: MOLDED WIREWOUND CHIP INDUCTORS HWI453232 SERIES 1. PART NO. EXPRESSION : HW I 4 5 3 2 3 2 - 1 R 0 K F a (b) (c) (d)(e) (a) Series code (d) Tolerance code : K = ±10%, M = ±20% (b) Dimension code (e) F : Lead Free (c) Inductance code : 1R0 = 1.00uH 2. CONFIGURATION & DIMENSIONS :


    Original     		PDF HWI453232 5r6 inductor HWI453232-1R0 HWI453232-1R2 HWI453232-1R5 HWI453232-1R8 HWI453232-2R2 HWI453232-2R7 HWI453232-3R3 HWI453232-3R9

    WI322522-101

    Abstract: marking code diode R12 FWI322522-R39 FWI322522-R47 YEW-2755 WI322522-R12KF
    Text: MOLDED WIREWOUND CHIP INDUCTORS WI322522 SERIES 1. PART NO. EXPRESSION : WI322522-R12KF a (b) (c) (d)(e) (f) (a) Series code (d) Tolerance code : J = ±5%, K = ±10%, M = ±20% (b) Dimension code (e) F : RoHS Compliant (c) Inductance code : R12 = 0.12uH (f) 11 ~ 99 : Internal controlled number


    Original     		PDF WI322522 WI322522-R12KF WI322522-101 marking code diode R12 FWI322522-R39 FWI322522-R47 YEW-2755

    HPE4991A

    Abstract: WI-453232-4R7
    Text: MOLDED WIREWOUND CHIP INDUCTORS WI453232 SERIES 1. PART NO. EXPRESSION : WI453232-R10JF a (b) (c) (d)(e) (a) Series code (d) Tolerance code : J = ±5%, K = ±10%, M = ±20% (b) Dimension code (e) F : Lead Free (c) Inductance code : R10 = 0.10uH 2. CONFIGURATION & DIMENSIONS :


    Original     		PDF WI453232 WI453232-R10JF HPE4991A WI-453232-4R7

    OMFZ2

    Abstract: No abstract text available
    Text: SPECIFICATION FOR APPROVAL REF : PAGE: 1 PROD. NAME WOUND CHIP INDUCTOR CC2520□□□□2□ ABC'S DWG NO. ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： 1R0 Marking : 2.5±0.2 m/m B : 2.0±0.2 m/m C : 1.8±0.2 m/m E : 1.4±0.1 m/m F : 0.45 m/m F F A


    Original     		PDF CC2520â E79029 E79029A E59481 BM-21 BM-22 BM-23 EME-1100 EME-1200 EME-5961C OMFZ2

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    transistor b 1238

    Abstract: PCB design for very fine pitch csp package tray datasheet bga 8x9 5 ball csp drawing BGA PACKAGE TOP MARK intel land pattern BGA 0.75 SCR Manual, General electric databook N4646 15 ball CSP bga 6x8 tray dimension
    Text: The Micro Ball Grid Array µBGA Package The Micro Ball Grid Array (µBGA*) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than


    Original     		PDF

    E 102 M

    Abstract: CC3225 E59481 AE001 eme-1100 EME-5961C 94hb HP16034E EME-1200 CC3225101KL
    Text: SPECIFICATION FOR APPROVAL REF : PAGE: 1 PROD. NAME ABC'S DWG NO. WOUND CHIP INDUCTOR CC3225□□□□L□ ABC'S ITEM NO. Ⅰ﹒CONFIGURATION & DIMENSIONS： 100 Marking Inductance code 2.9±0.2 A : 3.2±0.4 m/m B : 2.5±0.2 m/m C : 2.2±0.2 m/m E : 1.0±0.2


    Original     		PDF CC3225L E59481 BM-21 BM-22 BM-23 EME-1100 EME-1200 EME-5961C AE-001A E 102 M CC3225 E59481 AE001 eme-1100 EME-5961C 94hb HP16034E EME-1200 CC3225101KL

    at2910

    Abstract: BT3000 SP8 taymar lt2900 BL0870 fusilier LIGHTER B873 LG980 pt2950 HG753 BURNER
    Text: SPARES & ACCESSORIES PART NO PACK QTY. EAN PACKAGE Flame Spreader - For use with ET2850 Gas Torch. BL0870 and LG980 Blowlamps. Gives a broad flat flame ideal for paint stripping. Push-fit. 5012832 070101 Display Card 6 Pencil Flame Burner • For use with ET2850 Gas Torch,


    OCR Scan     		PDF ET2850 BL0870 LG980 HG3750 at2910 BT3000 SP8 taymar lt2900 fusilier LIGHTER B873 pt2950 HG753 BURNER

    Untitled

    Abstract: No abstract text available
    Text: REVISIONS A LL RIGHTS RESERVED. NO PORTION OF THIS PUBLICATION, WHETHER IN WHOLE OR IN PART CAN BE REPRODUCED WITHOUT THE EXPRESS WRITTEN CONSENT O F SPC TECHNOLOGY. DCP # REV DESCRIPTION 2048 TECH N O L O G Y DOC. NO. SPC— F005 RELEASED DRAWN DATE JN


    OCR Scan     		PDF 1000hrs

    Untitled

    Abstract: No abstract text available
    Text: Molded Chip Inductors MC30 Dimensions In. MC30 Allied Part Number MC30-R10M MC30-R12M MC30-R15M MC30-R18M MC30-R22M MC30-R27M MC30-R33M MC30-R39M MC30-R47M MC30-R56M MC30-R68M MC30-R82M MC30-1R0K MC30-1R2K MC30-1R5K MC30-1R8K MC30-2R2K MC30-2R7K MC30-3R3K


    OCR Scan     		PDF MC30-R10M MC30-R12M MC30-R15M MC30-R18M MC30-R22M MC30-R27M MC30-R33M MC30-R39M MC30-R47M MC30-R56M

    ELL8 P

    Abstract: utfb bedok ELL8UV100M coil chip land spec ELL8UV270M 4R7 COIL CHIP
    Text: 25 FEB 200! Si'NCOM INDUCTIVE TECH. Approval Specifications CUSTOMER Digi Key PART NAME CHIP CHOKE COIL CUSTOMER PART No. MATSUSHITA PART No. ELL8UVanoa MODEL NAM E/No. INDONESIA MANUFACTURED IN CUSTOMER'S ACKNOWLEDGEMENT PLEASE RETURN ONE COPY MATSUSHITA ELECTRONIC COMPONENTS S PTE. LTD.


    OCR Scan     		PDF T1S-05013 100mm 400mm 22-Feb-2005 151-ELL8-023 500pcs. ELL8 P utfb bedok ELL8UV100M coil chip land spec ELL8UV270M 4R7 COIL CHIP