68771-411HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail
71991-411HLF
Amphenol Communications Solutions
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry, 22 Position, 2.54mm (0.100in) Pitch
68001-411HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 11 Positions, 2.54 mm (0.100in) Pitch.
131-3114-11H
Amphenol Communications Solutions
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
131-4514-11H
Amphenol Communications Solutions
Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
131-6314-11H
Amphenol Communications Solutions
Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
