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    rdl 117

    Abstract: SENJU SOLDER PASTE rdl 117-a wcsp reliability IPC9701 MO-211 solder paste senju snpb wcsp package reliability
    Text: Application Report SBVA016 – September 2003 NanoStar Wafer Chip-Scale Package Design Ray Crampton, Jim Rosson High-Performance Analog Products ABSTRACT To satisfy market demand for an ultra-small, staggered 5-ball wafer-level chip-scale WCSP package, Texas Instruments has introduced the 170µm NanoStar™ YEQ


    Original     		PDF SBVA016 MO-211 rdl 117 SENJU SOLDER PASTE rdl 117-a wcsp reliability IPC9701 MO-211 solder paste senju snpb wcsp package reliability

    C1005X7R1H472KT

    Abstract: C1608X5R0J475KT PTC36SAAN TPS793
    Text: TPS793xxYEQEVM Evaluation Module User’s Guide September 2003 SBVU001 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue


    Original     		PDF TPS793xxYEQEVM SBVU001 C1608X5R1A105KT 4700pF, C1005X7R1H472KT C1608X5R0J475KT 36-pin PTC36SAAN C1005X7R1H472KT C1608X5R0J475KT PTC36SAAN TPS793