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    SAMSUNG EMMC NUMBER Search Results

    SAMSUNG EMMC NUMBER Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    R5F52203BDFL#V0 Renesas Electronics Corporation Entry-level 32-bit Microcontrollers with Minimum Number of Peripherals Visit Renesas Electronics Corporation
    R5F52203BDFL#30 Renesas Electronics Corporation Entry-level 32-bit Microcontrollers with Minimum Number of Peripherals Visit Renesas Electronics Corporation
    R5F52205BDFP#30 Renesas Electronics Corporation Entry-level 32-bit Microcontrollers with Minimum Number of Peripherals Visit Renesas Electronics Corporation
    R5F52206BGFL#30 Renesas Electronics Corporation Entry-level 32-bit Microcontrollers with Minimum Number of Peripherals Visit Renesas Electronics Corporation
    R5F52201BDFM#V0 Renesas Electronics Corporation Entry-level 32-bit Microcontrollers with Minimum Number of Peripherals Visit Renesas Electronics Corporation
    R5F52203BDFK#30 Renesas Electronics Corporation Entry-level 32-bit Microcontrollers with Minimum Number of Peripherals Visit Renesas Electronics Corporation

    SAMSUNG EMMC NUMBER Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    KLM8G2FE3B

    Abstract: klm8g samsung eMMC 4.5 TLC nand samsung tlc nand flash KLM4G 153 ball eMMC memory SAMSUNG emmc klm8g2 Samsung KLMBG4GE2A
    Text: Samsung eMMC Managed NAND Flash memory solution supports mobile applications FBGA QDP Package BROCHURE Efficiency, reduced costs and quicker time to market Expand device development with capable memory solutions Simplify mass storage designs Conventional NAND Flash memory can be challenging to


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    movinand emmc

    Abstract: samsung emmc lpddr2 moviNAND samsung eMMC 5.0 eMMC samsung emmc tlc samsung* lpddr2* pop package samsung lpddr2 SAMSUNG CL10
    Text: When Less Is More: Bigger & Faster Memory in Shrinking Packages for the Mobile Market Kathy Choe Thomas, Flash Product Mktg Samsung Semiconductor, Inc. Living in the Connected World Like it or Not, We Are Connected Anytime, Anywhere Cloud Services Bio Mobile


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    emmc controller

    Abstract: Sandisk iNAND micron emmc eMMC Sandisk eMMC Sandisk iNAND eMMC 8GB eMMC SLC emmc code emmc sector size Sandisk NAND Flash memory controller ecc
    Text: Micron e-MMC Embedded Memory Simplifies High-Capacity Storage for Mobile and Embedded Systems Summary This white paper addresses the various functions NAND designers face today. It also discusses the ways that e-MMC embedded memory can provide the necessary NAND Flash functions in an easy-to-use BGA


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    K4X2G323PD8GD8

    Abstract: K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03
    Text: PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from


    Original     		PDF BR-12-ALL-001 K4X2G323PD8GD8 K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03

    s3c2450

    Abstract: samsung EMMC user guide Samsung board Board design guide eMMC SAMSUNG emmc samsung emmc boot movinand irom application note iNAND eMMC 4 41 emmc spec SAMSUNG moviNAND
    Text: Application Note Internal ROM Booting S3C2450X RISC Microprocessor June 25, 2008 Preliminary REV 0.03 Preliminary product information describe products that are in development, for which full characterization data and associated errata are not yet available.


    Original     		PDF S3C2450X SMDK2450 s3c2450 samsung EMMC user guide Samsung board Board design guide eMMC SAMSUNG emmc samsung emmc boot movinand irom application note iNAND eMMC 4 41 emmc spec SAMSUNG moviNAND

    samsung toggle mode NAND

    Abstract: s3c2450 SMDK2450 Samsung EMMC "boot mode" movinand S3C64 samsung emmc boot Samsung eMMC irom application note s3c245
    Text: Application Note Internal ROM Booting S3C2450/51/16X RISC Microprocessor Oct 16, 2008 Preliminary REV 0.041 Preliminary product information describe products that are in development, for which full characterization data and associated errata are not yet available.


    Original     		PDF S3C2450/51/16X SMDK2450/51/16 samsung toggle mode NAND s3c2450 SMDK2450 Samsung EMMC "boot mode" movinand S3C64 samsung emmc boot Samsung eMMC irom application note s3c245

    "Manufacturer ID" eMMC

    Abstract: emmc EXT_CSD emmc "boot mode" eMMC emmc pin EXT_CSD samsung emmc boot efuse emmc boot Samsung oneNand Mux
    Text: Freescale Semiconductor Application Note Document Number: AN3996 Rev. 0, 04/2010 i.MX35 Boot Options by Multimedia Applications Division Freescale Semiconductor, Inc. Austin, TX 1 Introduction This application note describes the different booting options available for the i.MX35 processor. The i.MX35 offers


    Original     		PDF AN3996 "Manufacturer ID" eMMC emmc EXT_CSD emmc "boot mode" eMMC emmc pin EXT_CSD samsung emmc boot efuse emmc boot Samsung oneNand Mux

    ZTE AD

    Abstract: hynix emmc SAMSUNG emmc
    Text: Xeltek, Inc. 1296 Kifer Rd. Suite #605 Sunnyvale, CA 94086 United States SuperPro 7000 Tel: 14085308080 Fax: 408.530.0096 Email: info@xeltek.com High-speed Universal Programmer for large NAND Flash / eMMC devices. Transform into a mini gang programmer. Features:


    Original     		PDF SuperPro7000 SuperPro6000 SuperPro5000/6000 L1809OG) DIP48 ZTE AD hynix emmc SAMSUNG emmc

    eMMC

    Abstract: emmc spec samsung eMMC 4.5 emmc 4.5 spec emmc operation emmc Initialization KMCME0000M emmc 5.0 emmc 4.5 emmc spec samsung
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF S19904EJ1V0AN00 CMD42 CMD43 CMD54 CMD55 CMD56 CMD59 eMMC emmc spec samsung eMMC 4.5 emmc 4.5 spec emmc operation emmc Initialization KMCME0000M emmc 5.0 emmc 4.5 emmc spec samsung

    emmc 5.0

    Abstract: numonyx oneNand flash NUMONYX emmc samsung eMMC 5.0 eMMC driver eMMC powerdown emmc samsung eMMC samsung emmc boot samsung mcp emmc
    Text: NAND225AQA5P 2-Gbit demux I/O OneNAND , 2-Gbyte NAND with MMC™ interface & 2x1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 2-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 2x1-Gbit (x32) DDR LPSDRAM


    Original     		PDF NAND225AQA5P LFBGA199 emmc 5.0 numonyx oneNand flash NUMONYX emmc samsung eMMC 5.0 eMMC driver eMMC powerdown emmc samsung eMMC samsung emmc boot samsung mcp emmc

    eMMC data retention

    Abstract: emmc jedec mechanical standard data retention samsung emmc boot emmc 5.0 numonyx oneNand flash Samsung EMMC "boot mode" samsung eMMC emmc Initialization eMMC samsung eMMC 5.0
    Text: NAND225AQA9P 2-Gbit demux I/O OneNAND , 2-Gbyte NAND with MMC™ interface & 2x1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 2-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 2x1-Gbit (x32) DDR LPSDRAM


    Original     		PDF NAND225AQA9P LFBGA199 eMMC data retention emmc jedec mechanical standard data retention samsung emmc boot emmc 5.0 numonyx oneNand flash Samsung EMMC "boot mode" samsung eMMC emmc Initialization eMMC samsung eMMC 5.0

    emmc pin

    Abstract: 221 ball eMMC memory numonyx oneNand flash samsung emmc boot eMMC slc mode emmc 5.0 samsung eMMC 5.0 emmc boot operation emmc jedec Flash Memory SAMSUNG OneNAND mcp
    Text: NAND114APA5M 1-Gbit, mux I/O OneNAND , 1-Gbyte NAND with MMC™ interface & 1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • ■ ■ MCP (multichip package) – 1-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 1-Gbit (x32) DDR LPSDRAM


    Original     		PDF NAND114APA5M LFBGA199 emmc pin 221 ball eMMC memory numonyx oneNand flash samsung emmc boot eMMC slc mode emmc 5.0 samsung eMMC 5.0 emmc boot operation emmc jedec Flash Memory SAMSUNG OneNAND mcp

    emmc pin

    Abstract: emmc 5.0 samsung eMMC 5.0 221 ball eMMC memory emmc controller emmc jedec mechanical standard data retention samsung eMMC NUMONYX emmc eMMC slc mode NAND08GAH
    Text: NAND114AQA5M 1-Gbit, demux I/O OneNAND , 1-Gbyte NAND with MMC™ interface & 1-Gbit x32 DDR LPSDRAM MCP Preliminary Data Features • MCP (multichip package) – 1-Gbit (x16) high-density SLC large page OneNAND™ flash memory(a) – 1-Gbit (x32) DDR LPSDRAM


    Original     		PDF NAND114AQA5M LFBGA199 emmc pin emmc 5.0 samsung eMMC 5.0 221 ball eMMC memory emmc controller emmc jedec mechanical standard data retention samsung eMMC NUMONYX emmc eMMC slc mode NAND08GAH

    Manufacturer ID list eMMC

    Abstract: SAMSUNG emmc "Manufacturer ID" eMMC 20/Manufacturer ID list eMMC
    Text: Product Center : SUPERPRO/6100 device programmer,chip programmer,programmer, nanad flash programmer,NAND Programmer,FLASH Programmer,PLD Programmer,eMMC Programmer,MCU Programmer,Microcontroller Programmer,BIOS Programmer Xeltek SUPERPRO Programmer: Device Search!


    Original     		PDF SUPERPRO/6100 SUPERPRO/SB01 SUPERPRO/SB03 SUPERPRO/7000 50/60Hz, DIP48 cn/en/sp6100 Manufacturer ID list eMMC SAMSUNG emmc "Manufacturer ID" eMMC 20/Manufacturer ID list eMMC

    SMSC911x

    Abstract: emmc 4.3 MC13892 SGTL5000 IMX35 76343 emmc MC13892 registers V4L2 emmc spi
    Text: Freescale Semiconductor Application Note Document Number: 924-76343 Rev. 1.5 04/2009 i.MX35 PDK 1.4 to PDK 1.5 Revision Changes Linux This document explains the application changes for the Linux i.MX35 PDK 1.4 to PDK 1.5 revisions. Contents 1 2 3 New Features . 2


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    PICOCHIP

    Abstract: No abstract text available
    Text: Xeltek, Inc. 1296 Kifer Rd. Suite #605 Sunnyvale, CA 94086 United States SuperPro 6000 High-speed Universal Programmer. Tel: 14085308080 Fax: 408.530.0096 Email: info@xeltek.com Features: • Supports 301 IC manufacturer, 85,000+ IC devices. Device support as of December 2012, check


    Original     		PDF SuperPro6000 SuperPro5000 CE4100) L1809OG) 50/60Hz, DIP48 PICOCHIP

    S3F8285XZZ-TW85

    Abstract: S3F84K4
    Text: 2/4/2014 Microcontroller Product Catalogue | Samsung Semiconductor Global Website C SEMICONDUCTOR Home Product System Logic PRODUCTS SUPPORT NEWS & EVENTS SALES NETWORK ABOUT US C C Enter the keyword Microcontroller Product Catalogue Microcontroller PRODUCT CATALOGUE


    Original     		PDF S3F8285 S3F8285XZZ-TW85 S3F84K4

    Samsung eMMC 4.51

    Abstract: samsung eMMC 4.5
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 Samsung eMMC 4.51 samsung eMMC 4.5

    samsung eMMC 4.5

    Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
    Text: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 samsung eMMC 4.5 Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50

    samsung eMMC 4.5

    Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 samsung eMMC 4.5 eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50

    samsung eMMC 4.5

    Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch


    Original     		PDF IMX50CEC MCIMX50 samsung eMMC 4.5 emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51