FSMA Connectors
Abstract: 5502580-4 tyco crimp height chart 1-5503628-9 2-6457567-1 503911 ANA 608 GR 733 krone SC CONNECTOR DRAWING
Text: Fiber Optic Products Catalog LC Connectors One-Piece LC Connector Product Facts • Singlemode Telecordia GR-326 tested Report #501-652 ■ Multimode TIA/EIA 568-B.3 tested ■ Singlemode and Multimode are compatible with both anaerobic adhesives and heat cure epoxy adhesives
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GR-326
568-B
FSMA Connectors
5502580-4
tyco crimp height chart
1-5503628-9
2-6457567-1
503911
ANA 608
GR 733
krone
SC CONNECTOR DRAWING
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55325W-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »
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ATS-55325W-C2-R0
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927 ke
Abstract: FS401 F185 931 ke Maruwa fused FH-301 80MPa fused quartz FH-302 SK3036
Text: 㩷 MARUWA 石英玻璃 CENERAL CATALOG MARUWA 利用进口及国内熔融石英玻璃棒玻璃管和玻璃板作为原材料进行生产制造。考虑到产品质量，根据生产工艺 差异从几种类型的原材料中选择所需产品特征的理想类型。产品的部件号和代表用途以及成分分析示例如下。
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FN-101
SK-3030
ST-10
FN-102
SK-4304
FH-301
SK-3036
FH-302
SK-4306
SK-1300
927 ke
FS401
F185
931 ke
Maruwa fused
FH-301
80MPa
fused quartz
FH-302
SK3036
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Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-54230W-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » Designed specifically for BGAs and other surface mount
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ATS-54230W-C2-R0
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Text: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-54350W-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » Designed specifically for BGAs and other surface mount
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ATS-54350W-C2-R0
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55230D-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »
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ATS-55230D-C2-R0
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-54190D-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » Designed specifically for BGAs and other surface mount
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ATS-54190D-C2-R0
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55400W-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »
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ATS-55400W-C2-R0
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Untitled
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-52170B-C2-R0 Features & Benefits » D maxiFLOW design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling
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ATS-52170B-C2-R0
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-54330W-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » Designed specifically for BGAs and other surface mount
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ATS-54330W-C2-R0
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Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53310K-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to
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ATS-53310K-C2-R0
GR-63-Core
MIL-STD-810
ATS-53310K-C1-R0
MGT310
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55190D-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »
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ATS-55190D-C2-R0
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53190K-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to
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ATS-53190K-C2-R0
GR-63-Core
MIL-STD-810
ATS-53190K-C1-R0
MGT190
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-54190K-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » Designed specifically for BGAs and other surface mount
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ATS-54190K-C2-R0
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Abstract: No abstract text available
Text: Low Profile, High Performance Cooling Solutions w/Thermal Tape Attachment ATS PART # ATS-60003-C2-R0 Features & Benefits » D blueICE heat sinks feature an ultra low profile for toughto-cool applications » Designed for high performance in low air velocities
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ATS-60003-C2-R0
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Text: High Performance ASIC Cooling Solutions w/Thermal Tape Attachment ATS PART # ATS-56001-C3-R0 Features & Benefits » D maxiFLOW design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling » Designed specifically for ASIC package and their unique
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ATS-56001-C3-R0
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55230R-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »
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ATS-55230R-C2-R0
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Untitled
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-52330G-C2-R0 Features & Benefits » D maxiFLOW design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling
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ATS-52330G-C2-R0
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Untitled
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-52425G-C2-R0 Features & Benefits » D maxiFLOW design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling
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ATS-52425G-C2-R0
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Untitled
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-52170P-C2-R0 Features & Benefits » D maxiFLOW design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling
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ATS-52170P-C2-R0
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Text: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55330K-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »
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ATS-55330K-C2-R0
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Untitled
Abstract: No abstract text available
Text: High Performance ASIC Cooling Solutions w/Thermal Tape Attachment ATS PART # ATS-56003-C3-R0 D Features & Benefits » maxiFLOW design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling » Designed specifically for ASIC package and their unique
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ATS-56003-C3-R0
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ Thermal Tape Attachment ATS PART # ATS-55170W-C2-R0 D Features & Benefits » High efficiency cross-cut fin design provides low pressure drop characteristics » Large surface area increases heat sink performance »
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ATS-55170W-C2-R0
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53330R-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to
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ATS-53330R-C2-R0
GR-63-Core
MIL-STD-810
ATS-53330R-C1-R0
MGT330
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