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    SAC305 SOLDER PASTE Search Results

    SAC305 SOLDER PASTE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    SAC305 SOLDER PASTE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    J-STD-006 SAC305

    Abstract: SAC305 solder paste SAC305
    Text: Chip Quik Solder Paste in Jars - Product Sheet Product Description Product Name: CHIP QUIK Solder Paste No- Lead in Jars Product Details CHIP QUIK® Solder Paste in Jars Type 3 & Type 5, SAC 305, No-Lead


    Original     		PDF ANSI/J-STD-006 SAC305 SMD291SNL500T3 SMD291SNL250T3 J-STD-006 SAC305 SAC305 solder paste

    Untitled

    Abstract: No abstract text available
    Text: Chip Quik Solder Paste in Jars - Product Sheet Product Description CHIP QUIK Product Name: Solder Paste Water Washable with Lead and No-Lead in Jars Product Details CHIP QUIK® Solder Paste in Jars Type 3 & Type 5 micron size, Lead_free,


    Original     		PDF ANSI/J-STD-006 Sn63/Pb37 SMD4300AX250T5 SMD4300AX250T3 SAC305 SMD4300SNL250T5 SMD4300SNL250T3

    SAC305

    Abstract: 24 leads qfn 5x5 "thermal via" PQFN-24 rf 4 mm PQFN PQFN 8 leads PQFN SAC-305 AN3778 QFN PACKAGE Junction to PCB thermal resistance
    Text: Freescale Semiconductor Application Note AN3778 Rev. 0, 2/2010 PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation By: Quan Li, Lu Li, Richard Rowan, and Mahesh Shah PURPOSE This document provides guidelines for printed circuit board


    Original     		PDF AN3778 SAC305 24 leads qfn 5x5 "thermal via" PQFN-24 rf 4 mm PQFN PQFN 8 leads PQFN SAC-305 AN3778 QFN PACKAGE Junction to PCB thermal resistance

    sn63pb37 solder wire

    Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
    Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information


    Original     		PDF

    24-7068-1407

    Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
    Text: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com


    Original     		PDF

    S146

    Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
    Text: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,


    Original     		PDF 15mmH misali6-2-2557-7351 S146 S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3

    JEDEC J-STD-020d.1

    Abstract: sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform J-STD-020D SAC-305
    Text: APPLICATION NOTE Solder Mounted Packaged Transistors Introduction This document is a supplement to Cree’s data sheet. It describes the recommended conditions under which Cree’s packaged transistors are to be soldered into amplifiers. Solder Temperatures Defined


    Original     		PDF J-STD-020D APPNOTE-007 JEDEC J-STD-020d.1 sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform SAC-305

    GR-78-CORE

    Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
    Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with


    Original     		PDF 65-0n-Tien GR-78-CORE ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527

    SN63PB37

    Abstract: No abstract text available
    Text: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product


    Original     		PDF EM907 EM828 SN63PB37

    DAP 07

    Abstract: JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220
    Text: National Semiconductor Application Note 1187 August 27, 2010 Table of Contents Introduction . 2 Package Overview . 2


    Original     		PDF AN-1187 DAP 07 JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220

    PCB design for 0.2mm pitch csp package

    Abstract: SAC305 reflow profile sac305 thermal conductive DAP 07 JESD22-B111 dap sot 23-5 DAP 06 dap 11 LDA08B MO-220
    Text: Table of Contents Introduction . 2 Package Overview . 2


    Original     		PDF CSP-9-111S2) CSP-9-111S2. AN-1187 PCB design for 0.2mm pitch csp package SAC305 reflow profile sac305 thermal conductive DAP 07 JESD22-B111 dap sot 23-5 DAP 06 dap 11 LDA08B MO-220

    ROSIN FLUX TYPE ROL1

    Abstract: IPC-J-STD-004 IPC-J-STD-004A ROSIN FLUX TYPE ROL0 J-STD-006 - ROL0 J-STD-006 SAC305 SAC405 bonding capillary led sac305 th hole design ipc insertion requirement
    Text: Soldering and Handling of High Brightness Through Holes LED Lamps Application Note 5334 Introduction LED is well known of its long useful life compare to conventional incandescent bulb. If LED is not being properly handled, it will significantly shorten its useful life and


    Original     		PDF AV02-0399EN ROSIN FLUX TYPE ROL1 IPC-J-STD-004 IPC-J-STD-004A ROSIN FLUX TYPE ROL0 J-STD-006 - ROL0 J-STD-006 SAC305 SAC405 bonding capillary led sac305 th hole design ipc insertion requirement

    SAC405

    Abstract: viscosity sac405 Sn57Bi JEDEC-STD-20C SAC305 screen emulsion QFN 8 CARSEM SAC305 reflow system in package QFN 16 CARSEM package outline sn63pb37 solder wire
    Text: Application Note Soldering Guidelines for Mounting ANADIGICS QFNs on PCBs Revision 2 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers’ general guidelines for PCB second level interconnect design when assembling with ANADIGICS’


    Original     		PDF

    JEDEC SMT reflow profile

    Abstract: J-STD-020 SAC305 SAC305 SAC305 reflow JEDEC J-STD-020 SAC305 reflow profile reflow profile SAC305 solder paste SMT Process Z-Communications
    Text: Application Note AN-112 Using Convection Ovens for Attaching Z-COMM VCOs Introduction: This application note is to provide a basic SMT process guideline for solder reflowing Z-Communications voltage-controlled oscillators. The data provided complies with JEDEC J-STD-020 specification for peak


    Original     		PDF AN-112 J-STD-020 SAC305 AN-112 JEDEC SMT reflow profile J-STD-020 SAC305 SAC305 reflow JEDEC J-STD-020 SAC305 reflow profile reflow profile SAC305 solder paste SMT Process Z-Communications

    JEDEC SMT reflow profile

    Abstract: J-STD-020 SAC305 SAC305 SAC305 reflow profile SAC305 reflow reflow profile "Voltage Controlled Oscillators" preheat SAC305 solder paste
    Text: REFLOW PROCESS GUIDELINE Introduction This application note is to provide a basic SMT process guideline for solder reflowing Z-Communications voltage-controlled oscillators. The data provided complies with JEDEC J-STD-020 specification for peak reflow requirements. Each board must be characterized to establish reliable profile and to ensure high


    Original     		PDF J-STD-020 SAC305 AN-112 AN-112 JEDEC SMT reflow profile J-STD-020 SAC305 SAC305 reflow profile SAC305 reflow reflow profile "Voltage Controlled Oscillators" preheat SAC305 solder paste

    SAC387

    Abstract: SAC387 solder Multicore 96SC SAC-387 QQ-S-571 MSDS J-STD-006 sac387 97SC Loctite 510 henkel solder J-STD-006 SAC305
    Text: Technical Data Sheet 96SC and 97SC Alloy February 2005 Lead Free Solder Alloys for Electronics PRODUCT DESCRIPTION MULTICORE 96SC and 97SC alloys are designed to be lead free substitutes for tin/lead alloys in all electronics assembly soldering operations. Some advantages of MULTICORE®


    Original     		PDF QQ-S-571, J-STD-006 SAC387 SAC387 solder Multicore 96SC SAC-387 QQ-S-571 MSDS J-STD-006 sac387 97SC Loctite 510 henkel solder J-STD-006 SAC305

    LGA voiding

    Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
    Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print


    Original     		PDF LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325

    mems microphone

    Abstract: Laser microphone SAC305 ADMP421 admp401 paste profile AN-1068 microphone placement SAC305 reflow stencil
    Text: AN-1068 APPLICATON NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Reflow Soldering of the MEMS Microphone by Santosh A. Kudtarkar and Jia Gao BACKGROUND This application note provides guidance and suggestions for


    Original     		PDF AN-1068 ADMP401 ADMP421 AN08937-0-7/10 mems microphone Laser microphone SAC305 paste profile AN-1068 microphone placement SAC305 reflow stencil

    SAC405

    Abstract: SAC305 SAC405 Data sheet SN60 SN62 SN63
    Text: AN-010 Rev A Reflow Soldering Guidelines for RoHS* Compliant E-Series Surface Mount Components Introduction This application note describes recommended practices and guidelines for the successful assembly of M/A-COM E-Series surface mount components using automated solder reflow


    Original     		PDF AN-010 of255 SAC405 SAC305 SAC405 Data sheet SN60 SN62 SN63

    SAC405

    Abstract: NC266 Flux for solder wire Sn 96 SN100C IPC-TM650 J-STD-004 SAC305 TM650 177E-09 solder paste SAC305 .032
    Text: Glow Core No-Clean Cored Wire Solder Features: - Excellent Wetting - Wide Process Window - Cleanable with Saponifier - Lead-Free Compatible Description: Glow Core is a no-clean, resin-based flux cored wire solder designed to offer excellent wetting characteristics and


    Original     		PDF ISO9001 45-micron SAC405 NC266 Flux for solder wire Sn 96 SN100C IPC-TM650 J-STD-004 SAC305 TM650 177E-09 solder paste SAC305 .032

    BGA Solder Ball 0.35mm collapse

    Abstract: TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm
    Text: AMPHENOL TCS TB-2241 TM DFM and SMT Assembly Guideline Revision “B“ Specification Revision Status Revision “A“ “B” SCR No. Description Initial Date S1647 S1884 Initial Release Implemented 6-Pr changes Updated PN Tree and connector weight table


    Original     		PDF TB-2241 S1647 S1884 BGA Solder Ball 0.35mm collapse TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm

    sn63pb37 solder SPHERES

    Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
    Text: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual


    Original     		PDF AN-353-4 AN-353 AN-81. sn63pb37 solder SPHERES J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D

    TB-2082

    Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
    Text: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02


    Original     		PDF TB-2082 28mil TB-2082 TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS

    Untitled

    Abstract: No abstract text available
    Text: TAT9988 CATV GaN Power Doubler MMIC Applications • HFC Nodes • CATV Line Amplifiers • Head End Equipment 40 Pin 5x7 mm QFN Package Product Features • • • • • • • • • • Functional Block Diagram Excellent High Output Linearity High Gain 24dB @ 1000MHz


    Original     		PDF TAT9988 1000MHz 50MHz 1000MHz 445mA TAT9988