JEDEC SMT reflow profile
Abstract: J-STD-020 SAC305 SAC305 SAC305 reflow profile SAC305 reflow reflow profile "Voltage Controlled Oscillators" preheat SAC305 solder paste
Text: REFLOW PROCESS GUIDELINE Introduction This application note is to provide a basic SMT process guideline for solder reflowing Z-Communications voltage-controlled oscillators. The data provided complies with JEDEC J-STD-020 specification for peak reflow requirements. Each board must be characterized to establish reliable profile and to ensure high
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J-STD-020
SAC305
AN-112
AN-112
JEDEC SMT reflow profile
J-STD-020 SAC305
SAC305 reflow profile
SAC305 reflow
reflow profile
"Voltage Controlled Oscillators"
preheat
SAC305 solder paste
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SAC405
Abstract: Sn57Bi SAC305 reflow profile sac305 SAC305 reflow J-STD-020B SAC-305 jstd for msl 3
Text: Application Note High Temperature Report Revision 3 OBJECTIVE The objective of this application note is to provide the customer with a general understanding of ANADIGICS’ product’s high temperature capabilities associated with 2nd level lead-free assembly. It also
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S146
Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
Text: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,
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15mmH
misali6-2-2557-7351
S146
S514
S144
200POS
IT3D-200S-BGA37
IT3D-100S-BGA
BGA reflow guide
S142
PEAK TRAY bga
hirose it3
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JEDEC J-STD-020d.1
Abstract: sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform J-STD-020D SAC-305
Text: APPLICATION NOTE Solder Mounted Packaged Transistors Introduction This document is a supplement to Cree’s data sheet. It describes the recommended conditions under which Cree’s packaged transistors are to be soldered into amplifiers. Solder Temperatures Defined
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J-STD-020D
APPNOTE-007
JEDEC J-STD-020d.1
sac305
SAC305 reflow profile
SAC305 solder paste
sac305 kester
SAC305 reflow
Kester
sn-pb-ag solder preform
SAC-305
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DAP 07
Abstract: JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220
Text: National Semiconductor Application Note 1187 August 27, 2010 Table of Contents Introduction . 2 Package Overview . 2
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AN-1187
DAP 07
JESD22-B111
DAP 08
transistor smd sensor 80L
dap 07 smd
dap sot 23-5
SPA52A
AN-1187
LQB08A
MO-220
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PCB design for 0.2mm pitch csp package
Abstract: SAC305 reflow profile sac305 thermal conductive DAP 07 JESD22-B111 dap sot 23-5 DAP 06 dap 11 LDA08B MO-220
Text: Table of Contents Introduction . 2 Package Overview . 2
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CSP-9-111S2)
CSP-9-111S2.
AN-1187
PCB design for 0.2mm pitch csp package
SAC305 reflow profile
sac305 thermal conductive
DAP 07
JESD22-B111
dap sot 23-5
DAP 06
dap 11
LDA08B
MO-220
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MCM SERIES Q-TECH OSCILLATOR
Abstract: No abstract text available
Text: LOW PROFILE QT84 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature strip AT quartz crystal built in a
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500kHz
160MHz
EAR99
36000G
12kHz
QT84L11,
25MHz
MCM SERIES Q-TECH OSCILLATOR
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Untitled
Abstract: No abstract text available
Text: LOW PROFILE QT84 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature strip AT quartz crystal built in a
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500kHz
160MHz
EAR99
160MHz
36000G
QT84L11,
25MHz
30MHz
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CRYSTAL DIP 16MHZ
Abstract: MCM SERIES Q-TECH OSCILLATOR
Text: LOW PROFILE QT84 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature strip AT quartz crystal built in a
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500kHz
160MHz
EAR99
160MHz
36000G
20MHz,
QT84L11,
25MHz
12kHz
CRYSTAL DIP 16MHZ
MCM SERIES Q-TECH OSCILLATOR
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JEDEC SMT reflow profile
Abstract: J-STD-020 SAC305 SAC305 SAC305 reflow JEDEC J-STD-020 SAC305 reflow profile reflow profile SAC305 solder paste SMT Process Z-Communications
Text: Application Note AN-112 Using Convection Ovens for Attaching Z-COMM VCOs Introduction: This application note is to provide a basic SMT process guideline for solder reflowing Z-Communications voltage-controlled oscillators. The data provided complies with JEDEC J-STD-020 specification for peak
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AN-112
J-STD-020
SAC305
AN-112
JEDEC SMT reflow profile
J-STD-020 SAC305
SAC305 reflow
JEDEC J-STD-020
SAC305 reflow profile
reflow profile
SAC305 solder paste
SMT Process
Z-Communications
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QT84HCD10M-50
Abstract: 32MHz Quartz oscillator 30MHz
Text: LOW PROFILE QT84 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature strip AT quartz crystal built in a
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500kHz
160MHz
EAR99
160MHz
36000G
QT84L11,
25MHz
30MHz
QT84HCD10M-50
32MHz
Quartz oscillator 30MHz
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Untitled
Abstract: No abstract text available
Text: LOW PROFILE QT81, QT82, QT83 MINIATURE CLOCK OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 5 X 7 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature stripAT quartz crystal built
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500kHz
160MHz
EAR99
raQT82LD10M,
32MHz
QT83HCD10M,
40MHz
36000G
30MHz
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Untitled
Abstract: No abstract text available
Text: LOW PROFILE QT81, QT82, QT83 MINIATURE CLOCK OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 5 X 7 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature stripAT quartz crystal built
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500kHz
160MHz
EAR99
fQT82LD10M,
32MHz
QT83HCD10M,
40MHz
36000G
30MHz
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SAC405
Abstract: viscosity sac405 Sn57Bi JEDEC-STD-20C SAC305 screen emulsion QFN 8 CARSEM SAC305 reflow system in package QFN 16 CARSEM package outline sn63pb37 solder wire
Text: Application Note Soldering Guidelines for Mounting ANADIGICS QFNs on PCBs Revision 2 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers’ general guidelines for PCB second level interconnect design when assembling with ANADIGICS’
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sn63pb37 solder wire
Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information
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24-7068-1407
Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
Text: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com
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MCM SERIES Q-TECH OSCILLATOR
Abstract: No abstract text available
Text: LOW PROFILE QT81, QT82, QT83 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature stripAT quartz crystal built
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500kHz
160MHz
QT81HCD10M-50
000MHz
000MHz
QT82LD10M,
32MHz
QT83HCD10M,
40MHz
12kHz
MCM SERIES Q-TECH OSCILLATOR
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Asp1251
Abstract: J-STD-020 SAC305 land pattern for WLCSP RCN310 ASPIC320 ism Transceiver SAC305 reflow system in package SAC305 reflow csp IPD filter IPDiA filter
Text: Manual Handling recommendation These capacitors are designed to be mounted with a standard pick and place machine, with reflow. In case of manual handling, please follow below recommendations: x Minimize mechanical pressure on the capacitors use of a vacuum nozzle is recommended .
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100nF,
TD431111615116
Asp1251
J-STD-020 SAC305
land pattern for WLCSP
RCN310
ASPIC320
ism Transceiver
SAC305 reflow system in package
SAC305 reflow csp
IPD filter
IPDiA filter
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33-2C
Abstract: No abstract text available
Text: 8200 Series Miniature Surface Mount Power Inductors SELECTION GUIDE Inductance, L Order Code 0.1V @ 10KHz Tolerance H % FEATURES n RoHS compliant n Up to 2.0A IDC n 1.0μH to 470μH n Ultra low profile n Low RDC n Tape and reel packaging n J-STD-020C reflow
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10KHz
82102C
82152C
82222C
82332C
82472C
82682C
82103C
82153C
82223C
33-2C
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LGA voiding
Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print
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LTM4600
CCL-HL-832
LGA voiding
Indium 5.8LS Type 4
solder paste SAC305 alpha metal
PCB LAYOUT OF WATER LEVEL INDICATOR
CCL-HL-832
alpha OM-5300
SAC305 indium
TAIYO PSR 4000
Indium 5.8LS Type 6
OM-325
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mems microphone
Abstract: Laser microphone SAC305 ADMP421 admp401 paste profile AN-1068 microphone placement SAC305 reflow stencil
Text: AN-1068 APPLICATON NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Reflow Soldering of the MEMS Microphone by Santosh A. Kudtarkar and Jia Gao BACKGROUND This application note provides guidance and suggestions for
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AN-1068
ADMP401
ADMP421
AN08937-0-7/10
mems microphone
Laser microphone
SAC305
paste profile
AN-1068
microphone placement
SAC305 reflow
stencil
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SAC405
Abstract: SAC305 SAC405 Data sheet SN60 SN62 SN63
Text: AN-010 Rev A Reflow Soldering Guidelines for RoHS* Compliant E-Series Surface Mount Components Introduction This application note describes recommended practices and guidelines for the successful assembly of M/A-COM E-Series surface mount components using automated solder reflow
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AN-010
of255
SAC405
SAC305
SAC405 Data sheet
SN60
SN62
SN63
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GR-78-CORE
Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with
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65-0n-Tien
GR-78-CORE
ROSIN FLUX TYPE ROL0
sn63pb37
Sn62Pb36Ag2
J-STD-006A
RF771
bellcore GR-78
sn63pb37 solder wire
959T
TC-527
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SN63PB37
Abstract: No abstract text available
Text: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product
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EM907
EM828
SN63PB37
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