S146
Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
Text: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,
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15mmH
misali6-2-2557-7351
S146
S514
S144
200POS
IT3D-200S-BGA37
IT3D-100S-BGA
BGA reflow guide
S142
PEAK TRAY bga
hirose it3
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sn63pb37 solder wire
Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information
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24-7068-1407
Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
Text: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com
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LGA voiding
Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print
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LTM4600
CCL-HL-832
LGA voiding
Indium 5.8LS Type 4
solder paste SAC305 alpha metal
PCB LAYOUT OF WATER LEVEL INDICATOR
CCL-HL-832
alpha OM-5300
SAC305 indium
TAIYO PSR 4000
Indium 5.8LS Type 6
OM-325
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GR-78-CORE
Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with
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65-0n-Tien
GR-78-CORE
ROSIN FLUX TYPE ROL0
sn63pb37
Sn62Pb36Ag2
J-STD-006A
RF771
bellcore GR-78
sn63pb37 solder wire
959T
TC-527
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SN63PB37
Abstract: No abstract text available
Text: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product
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EM907
EM828
SN63PB37
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BGA Solder Ball 0.35mm collapse
Abstract: TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm
Text: AMPHENOL TCS TB-2241 TM DFM and SMT Assembly Guideline Revision “B“ Specification Revision Status Revision “A“ “B” SCR No. Description Initial Date S1647 S1884 Initial Release Implemented 6-Pr changes Updated PN Tree and connector weight table
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TB-2241
S1647
S1884
BGA Solder Ball 0.35mm collapse
TB-2241
reballing
circular thermocouple connector
JEDEC tray standard dimension
tb224
BGA Solder Ball 0.35mm
BGA PROFILING
SAC305 solder paste
SAC305 reflow 13mm
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sn63pb37 solder SPHERES
Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
Text: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual
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AN-353-4
AN-353
AN-81.
sn63pb37 solder SPHERES
J-STD-020 SAC305
JEDEC J-STD-020d.1
Altera Flip Chip BGA warpage
reflow profile SAC305 bga
ALTERA AN81
sn63pb37 solder wire
sn63pb37 solder wire shelf life
pcb warpage in ipc standard
J-STD-020D
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TB-2082
Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
Text: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02
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TB-2082
28mil
TB-2082
TB208
470-2075-100
reballing
programming smt machine
470-1075-100
470-3105-100
programming for smt machine
C-471-1025-500
Amphenol MIL CIRCULAR CONNECTORS
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IPC-7525
Abstract: ipc 7525 IPC-9502 AN-9036 IPC9502 FDMS8660S JESD22-102D Soldering guidelines pin in paste JESD22-102 FDMS8660AS
Text: AN-9036 Guidelines for Using Fairchild's Power56 Dennis Lang, Staff Engineer Introduction The Power56 minimizes both Printed Wiring Board PWB space and RDS(ON) in a convenient, familiar SO-8 sized footprint, with the addition of a large drain tab for improving thermal
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AN-9036
Power56
Power56
FDMS8460,
FDMS8660AS,
FDMS8660S,
FDMS8662,
FDMS8670AS,
IPC-7525
ipc 7525
IPC-9502
AN-9036
IPC9502
FDMS8660S
JESD22-102D
Soldering guidelines pin in paste
JESD22-102
FDMS8660AS
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Systems
Abstract: systemtechnik 60352-5 component data SAC305 laser soldering through hole technology SAC305 DIN EN 60352-5 din mount pcb connector mini din 9 male
Text: Electronic Board Assembly ERNI Systems Technology Systems Solutions - a one stop shop - www.erni.com Contents ERNI Systems Technology Soldering Technologies SMT soldering - Reflow Soldering of Surface Mount Devices THR soldering - Through Hole Components, reflow soldered
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MT9V113
Abstract: No abstract text available
Text: Advance‡ MT9V113M02: 1/11-Inch VGA Reflowable Camera Features 1/11-Inch VGA SOC CMOS Digital Image Sensor Reflowable Camera Module with Parallel Output MT9V113M02 Features Table 2: • Reflowable module features – Ultracompact – 260°C Pb-free solder reflowable
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MT9V113M02:
1/11-Inch
MT9V113M02
1/11-inch,
30-ball
10-bit,
09005aef82f87af5/Source:
09005aef82f88608
MT9V113
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systemtechnik
Abstract: DIN EN 60352-5 60352-5 SN100C 60352 pin in paste SAC305
Text: Bestückung elektronischer Baugruppen ERNI Systemtechnik Systemlösungen -alles aus einer Hand- www.erni.com Themen-Übersicht ERNI Systemtechnik Löttechniken SMT-Löten - Reflow-Löten oberflächenmontierbarer Bauelemente THR-Löten - Durchsteck-Bauelemente im Reflow-Lötprozess
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Digital Pressure Gauge circuit diagram
Abstract: No abstract text available
Text: Pressure Freescale Semiconductor MPL115A2 Rev 6, 03/2010 Miniature I2C Digital Barometer The MPL115A2 is an absolute pressure sensor with digital output for low cost applications. A miniature 5 x 3 x 1.2 mm LGA package ideally suits it for portable electronics and space constrained applications. Low current consumptions of
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MPL115A2
02-Sep-2010
Digital Pressure Gauge circuit diagram
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Untitled
Abstract: No abstract text available
Text: LTM2881 Complete Isolated RS485/RS422 µModule Transceiver + Power DESCRIPTION FEATURES n n n n n n n n n n n n n n n n n n RS485/RS422 Transceiver: 2500VRMS for 1 Minute UL Recognized File #E151738 Isolated DC Power: 5V at Up to 200mA No External Components Required
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LTM2881
RS485/RS422
RS485/RS422
2500VRMS
E151738
200mA
20Mbps
250kbps
30kV/Î
LTM2881-3)
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SAC266
Abstract: SAC405 J-STD-012 IPC-6012 BGA Solder Ball compressive force WLCSP stencil design IPC-6012A LATTICE SEMICONDUCTOR Tape and Reel Specification IPC-4101 IPC-7525
Text: Application Note 71 Design and Manufacturing with Summit Microelectronic’s WLCSP Products Introduction Per the IPC/JEDEC J-STD-012 definition, a CSP is a single-die, direct surface mountable package with an area of no more than 1.2 times the original die area.
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J-STD-012
SAC266
SAC405
IPC-6012
BGA Solder Ball compressive force
WLCSP stencil design
IPC-6012A
LATTICE SEMICONDUCTOR Tape and Reel Specification
IPC-4101
IPC-7525
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DC1559
Abstract: No abstract text available
Text: LTM8046 3.1VIN to 32VIN, 2kVAC Isolated DC/DC µModule Converter FEATURES DESCRIPTION 2kVAC Isolated µModule Converter Tested to 3kVDC n UL 60950 Recognized , File E464570 n Wide Input Voltage Range: 3.1V to 31V n 5V at 550mA from 24V IN n 1.8V to 12V Output Voltage
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LTM8046
32VIN,
E464570
550mA
LTM8046
LTM8061
8046fa
com/LTM8046
DC1559
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Untitled
Abstract: No abstract text available
Text: LTM8057 3.1VIN to 31VIN Isolated µModule DC/DC Converter FEATURES DESCRIPTION n n n The LTM 8057 is a 2kV AC isolated flyback µModule® micromodule DC/DC converter. Included in the package are the switching controller, power switches, transformer, and all support components. Operating over an input voltage range of 3.1V to 31V, the LTM8057 supports an output
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LTM8057
31VIN
LTM8057
UL60950
EN55022
LTM8061
LTM4613
LTM8047
8057f
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Untitled
Abstract: No abstract text available
Text: AN-617 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Wafer Level Chip Scale Package by the Wafer Level Package Development Team GENERAL DESCRIPTION PURPOSE
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AN03272-0-5/12
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pcb warpage in ipc standard
Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387
Text: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.
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LTM4601Y
Abstract: No abstract text available
Text: LTM4601/LTM4601-1 12A µModule Regulators with PLL, Output Tracking and Margining Description Features n n n n n n n n n n n n n n n n n Complete Switch Mode Power Supply Wide Input Voltage Range: 4.5V to 20V 12A DC Typical, 14A Peak Output Current 0.6V to 5V Output Voltage
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LTM4601/LTM4601-1
LTM4601
LTM8061
com/LTM4601
4601fe
LTM4601Y
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Untitled
Abstract: No abstract text available
Text: LTM8028 36VIN, UltraFast, Low Output Noise 5A µModule Regulator Features Description High Performance 5A Linear Regulator with Switching Step-Down Converter for High Efficiency n Digitally Programmable V OUT: 0.8V to 1.8V n Input Voltage Range: 6V to 36V
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LTM8028
36VIN,
100kHz)
LTM8048
300mA
LTM4615
LTM4620
8028fa
com/LTM8028
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Untitled
Abstract: No abstract text available
Text: LTM8028 36VIN, UltraFast, Low Output Noise 5A µModule Regulator Features Description High Performance 5A Linear Regulator with Switching Step-Down Converter for High Efficiency n Digitally Programmable V OUT: 0.8V to 1.8V n Input Voltage Range: 6V to 36V
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LTM8028
36VIN,
100kHz)
LTM8048
300mA
LTM4615
LTM4620
8028fb
com/LTM8028
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LCMXO2-1200
Abstract: CEL-9750ZHF CEL-9750ZHF10
Text: MachXO2 Product Family Qualification Summary Lattice Document # 25 – 106923 July 2013 Lattice Semiconductor Corporation Doc. #25-106923 Rev. G 1 Dear Customer, Enclosed is Lattice Semiconductor‟s MachXO2 Product Family Qualification Report. This report was created to assist you in the decision making process of selecting and using our products. The
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LCMXO2-1200-25WLCSP
LCMXO2-1200
CEL-9750ZHF
CEL-9750ZHF10
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