M513
Abstract: SAC305 SM-138
Text: MABA-009600-CF48A0 4:1 RF Flux Coupled Transformer 5-200MHz Features • • • • • • M/A-COM Products Release - Rev. V2 Schematic Surface Mount 4:1 Impedance 260°C Reflow Compatible RoHS* Compliant, Pb Free SAC305 Recommended for Lead Free process only
|
Original
|
MABA-009600-CF48A0
5-200MHz
SAC305
MABA-009600-CF48A0
SM-138
M513
SAC305
SM-138
|
PDF
|
Untitled
Abstract: No abstract text available
Text: MABA-009600-CF48A0 4:1 RF Flux Coupled Transformer 5-200MHz Features • • • • • • M/A-COM Products Release - Rev. V1 Schematic Surface Mount 4:1 Impedance 260°C Reflow Compatible RoHS* Compliant, Pb Free SAC305 Recommended for Lead Free process only
|
Original
|
MABA-009600-CF48A0
5-200MHz
SAC305
MABA-009600-CF48A0
SM-138
|
PDF
|
bellcore GR-78
Abstract: J-STD-006 SAC305
Text: Lead Free Solder SAC305 Page 1 of 2 Lead Free Solder Sn96 SAC 305 4900 96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.
|
Original
|
SAC305
J-Std-006
J-Std-006
4900-35G
4900-112G
4900-227G
4900-454G
com/products/4900
bellcore GR-78
J-STD-006 SAC305
|
PDF
|
SAC305
Abstract: 24 leads qfn 5x5 "thermal via" PQFN-24 rf 4 mm PQFN PQFN 8 leads PQFN SAC-305 AN3778 QFN PACKAGE Junction to PCB thermal resistance
Text: Freescale Semiconductor Application Note AN3778 Rev. 0, 2/2010 PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation By: Quan Li, Lu Li, Richard Rowan, and Mahesh Shah PURPOSE This document provides guidelines for printed circuit board
|
Original
|
AN3778
SAC305
24 leads qfn 5x5
"thermal via"
PQFN-24
rf 4 mm PQFN
PQFN 8 leads
PQFN
SAC-305
AN3778
QFN PACKAGE Junction to PCB thermal resistance
|
PDF
|
S146
Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
Text: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,
|
Original
|
15mmH
misali6-2-2557-7351
S146
S514
S144
200POS
IT3D-200S-BGA37
IT3D-100S-BGA
BGA reflow guide
S142
PEAK TRAY bga
hirose it3
|
PDF
|
JEDEC SMT reflow profile
Abstract: J-STD-020 SAC305 SAC305 SAC305 reflow JEDEC J-STD-020 SAC305 reflow profile reflow profile SAC305 solder paste SMT Process Z-Communications
Text: Application Note AN-112 Using Convection Ovens for Attaching Z-COMM VCOs Introduction: This application note is to provide a basic SMT process guideline for solder reflowing Z-Communications voltage-controlled oscillators. The data provided complies with JEDEC J-STD-020 specification for peak
|
Original
|
AN-112
J-STD-020
SAC305
AN-112
JEDEC SMT reflow profile
J-STD-020 SAC305
SAC305 reflow
JEDEC J-STD-020
SAC305 reflow profile
reflow profile
SAC305 solder paste
SMT Process
Z-Communications
|
PDF
|
Asp1251
Abstract: J-STD-020 SAC305 land pattern for WLCSP RCN310 ASPIC320 ism Transceiver SAC305 reflow system in package SAC305 reflow csp IPD filter IPDiA filter
Text: Manual Handling recommendation These capacitors are designed to be mounted with a standard pick and place machine, with reflow. In case of manual handling, please follow below recommendations: x Minimize mechanical pressure on the capacitors use of a vacuum nozzle is recommended .
|
Original
|
100nF,
TD431111615116
Asp1251
J-STD-020 SAC305
land pattern for WLCSP
RCN310
ASPIC320
ism Transceiver
SAC305 reflow system in package
SAC305 reflow csp
IPD filter
IPDiA filter
|
PDF
|
JEDEC SMT reflow profile
Abstract: J-STD-020 SAC305 SAC305 SAC305 reflow profile SAC305 reflow reflow profile "Voltage Controlled Oscillators" preheat SAC305 solder paste
Text: REFLOW PROCESS GUIDELINE Introduction This application note is to provide a basic SMT process guideline for solder reflowing Z-Communications voltage-controlled oscillators. The data provided complies with JEDEC J-STD-020 specification for peak reflow requirements. Each board must be characterized to establish reliable profile and to ensure high
|
Original
|
J-STD-020
SAC305
AN-112
AN-112
JEDEC SMT reflow profile
J-STD-020 SAC305
SAC305 reflow profile
SAC305 reflow
reflow profile
"Voltage Controlled Oscillators"
preheat
SAC305 solder paste
|
PDF
|
SAC405
Abstract: Sn57Bi SAC305 reflow profile sac305 SAC305 reflow J-STD-020B SAC-305 jstd for msl 3
Text: Application Note High Temperature Report Revision 3 OBJECTIVE The objective of this application note is to provide the customer with a general understanding of ANADIGICS’ product’s high temperature capabilities associated with 2nd level lead-free assembly. It also
|
Original
|
|
PDF
|
JEDEC J-STD-020d.1
Abstract: sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform J-STD-020D SAC-305
Text: APPLICATION NOTE Solder Mounted Packaged Transistors Introduction This document is a supplement to Cree’s data sheet. It describes the recommended conditions under which Cree’s packaged transistors are to be soldered into amplifiers. Solder Temperatures Defined
|
Original
|
J-STD-020D
APPNOTE-007
JEDEC J-STD-020d.1
sac305
SAC305 reflow profile
SAC305 solder paste
sac305 kester
SAC305 reflow
Kester
sn-pb-ag solder preform
SAC-305
|
PDF
|
mems microphone
Abstract: Laser microphone SAC305 ADMP421 admp401 paste profile AN-1068 microphone placement SAC305 reflow stencil
Text: AN-1068 APPLICATON NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Reflow Soldering of the MEMS Microphone by Santosh A. Kudtarkar and Jia Gao BACKGROUND This application note provides guidance and suggestions for
|
Original
|
AN-1068
ADMP401
ADMP421
AN08937-0-7/10
mems microphone
Laser microphone
SAC305
paste profile
AN-1068
microphone placement
SAC305 reflow
stencil
|
PDF
|
DAP 07
Abstract: JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220
Text: National Semiconductor Application Note 1187 August 27, 2010 Table of Contents Introduction . 2 Package Overview . 2
|
Original
|
AN-1187
DAP 07
JESD22-B111
DAP 08
transistor smd sensor 80L
dap 07 smd
dap sot 23-5
SPA52A
AN-1187
LQB08A
MO-220
|
PDF
|
SAC405
Abstract: SAC305 SAC405 Data sheet SN60 SN62 SN63
Text: AN-010 Rev A Reflow Soldering Guidelines for RoHS* Compliant E-Series Surface Mount Components Introduction This application note describes recommended practices and guidelines for the successful assembly of M/A-COM E-Series surface mount components using automated solder reflow
|
Original
|
AN-010
of255
SAC405
SAC305
SAC405 Data sheet
SN60
SN62
SN63
|
PDF
|
sn63pb37 solder wire
Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information
|
Original
|
|
PDF
|
|
|
PCB design for 0.2mm pitch csp package
Abstract: SAC305 reflow profile sac305 thermal conductive DAP 07 JESD22-B111 dap sot 23-5 DAP 06 dap 11 LDA08B MO-220
Text: Table of Contents Introduction . 2 Package Overview . 2
|
Original
|
CSP-9-111S2)
CSP-9-111S2.
AN-1187
PCB design for 0.2mm pitch csp package
SAC305 reflow profile
sac305 thermal conductive
DAP 07
JESD22-B111
dap sot 23-5
DAP 06
dap 11
LDA08B
MO-220
|
PDF
|
ROSIN FLUX TYPE ROL1
Abstract: IPC-J-STD-004 IPC-J-STD-004A ROSIN FLUX TYPE ROL0 J-STD-006 - ROL0 J-STD-006 SAC305 SAC405 bonding capillary led sac305 th hole design ipc insertion requirement
Text: Soldering and Handling of High Brightness Through Holes LED Lamps Application Note 5334 Introduction LED is well known of its long useful life compare to conventional incandescent bulb. If LED is not being properly handled, it will significantly shorten its useful life and
|
Original
|
AV02-0399EN
ROSIN FLUX TYPE ROL1
IPC-J-STD-004
IPC-J-STD-004A
ROSIN FLUX TYPE ROL0
J-STD-006 - ROL0
J-STD-006 SAC305
SAC405
bonding capillary led
sac305
th hole design ipc insertion requirement
|
PDF
|
33-2C
Abstract: No abstract text available
Text: 8200 Series Miniature Surface Mount Power Inductors SELECTION GUIDE Inductance, L Order Code 0.1V @ 10KHz Tolerance H % FEATURES n RoHS compliant n Up to 2.0A IDC n 1.0μH to 470μH n Ultra low profile n Low RDC n Tape and reel packaging n J-STD-020C reflow
|
Original
|
10KHz
82102C
82152C
82222C
82332C
82472C
82682C
82103C
82153C
82223C
33-2C
|
PDF
|
SAC405
Abstract: viscosity sac405 Sn57Bi JEDEC-STD-20C SAC305 screen emulsion QFN 8 CARSEM SAC305 reflow system in package QFN 16 CARSEM package outline sn63pb37 solder wire
Text: Application Note Soldering Guidelines for Mounting ANADIGICS QFNs on PCBs Revision 2 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers’ general guidelines for PCB second level interconnect design when assembling with ANADIGICS’
|
Original
|
|
PDF
|
sn63pb37 solder SPHERES
Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
Text: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual
|
Original
|
AN-353-4
AN-353
AN-81.
sn63pb37 solder SPHERES
J-STD-020 SAC305
JEDEC J-STD-020d.1
Altera Flip Chip BGA warpage
reflow profile SAC305 bga
ALTERA AN81
sn63pb37 solder wire
sn63pb37 solder wire shelf life
pcb warpage in ipc standard
J-STD-020D
|
PDF
|
AN5334
Abstract: No abstract text available
Text: HLMP-D101/D105, HLMP-K101/K105 T-13/4 5 mm , T-1 (3 mm), High Intensity, Double Heterojunction AlGaAs Red LED Lamps Data Sheet Description Features These solid state LED lamps utilize newly developed double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output
|
Original
|
HLMP-D101/D105,
HLMP-K101/K105
T-13/4
SAC305
AV02-0230EN
AN5334
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HLMP-D101/D105, HLMP-K101/K105 T-13/4 5 mm , T-1 (3 mm), High Intensity, Double Heterojunction AlGaAs Red LED Lamps Data Sheet Description Features These solid-state LED lamps utilize newly developed double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output
|
Original
|
HLMP-D101/D105,
HLMP-K101/K105
T-13/4
SAC305
AV02-0230EN
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HLMP-DS25/DM25/NS30/NM31 T-1¾ 5 mm , T-1 (3 mm) InGaN LED Lamps Data Sheet Description Features The blue HLMP-DS25 and HLMP-NS30, and green HLMP-DM25 and HLMP-NM31 LEDs are designed in an industry standard T-1¾ and T-1 pack-ages with clear and nondiffused optics.
|
Original
|
HLMP-DS25/DM25/NS30/NM31
HLMP-DS25
HLMP-NS30,
HLMP-DM25
HLMP-NM31
AV02-1029EN
|
PDF
|
MCM SERIES Q-TECH OSCILLATOR
Abstract: No abstract text available
Text: LOW PROFILE QT84 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature strip AT quartz crystal built in a
|
Original
|
500kHz
160MHz
EAR99
36000G
12kHz
QT84L11,
25MHz
MCM SERIES Q-TECH OSCILLATOR
|
PDF
|
Untitled
Abstract: No abstract text available
Text: LOW PROFILE QT84 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature strip AT quartz crystal built in a
|
Original
|
500kHz
160MHz
EAR99
160MHz
36000G
QT84L11,
25MHz
30MHz
|
PDF
|
