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    SAC305 REFLOW Search Results

    SAC305 REFLOW Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    LUSB3193002 Amphenol Communications Solutions Lockable USB 3.0, Right Angle, with locking latch, For IR Reflow Pin in Paste Visit Amphenol Communications Solutions

    SAC305 REFLOW Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    M513

    Abstract: SAC305 SM-138
    Text: MABA-009600-CF48A0 4:1 RF Flux Coupled Transformer 5-200MHz Features • • • • • • M/A-COM Products Release - Rev. V2 Schematic Surface Mount 4:1 Impedance 260°C Reflow Compatible RoHS* Compliant, Pb Free SAC305 Recommended for Lead Free process only


    Original     		PDF MABA-009600-CF48A0 5-200MHz SAC305 MABA-009600-CF48A0 SM-138 M513 SAC305 SM-138

    Untitled

    Abstract: No abstract text available
    Text: MABA-009600-CF48A0 4:1 RF Flux Coupled Transformer 5-200MHz Features • • • • • • M/A-COM Products Release - Rev. V1 Schematic Surface Mount 4:1 Impedance 260°C Reflow Compatible RoHS* Compliant, Pb Free SAC305 Recommended for Lead Free process only


    Original     		PDF MABA-009600-CF48A0 5-200MHz SAC305 MABA-009600-CF48A0 SM-138

    bellcore GR-78

    Abstract: J-STD-006 SAC305
    Text: Lead Free Solder SAC305 Page 1 of 2 Lead Free Solder Sn96 SAC 305 4900 96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.


    Original     		PDF SAC305 J-Std-006 J-Std-006 4900-35G 4900-112G 4900-227G 4900-454G com/products/4900 bellcore GR-78 J-STD-006 SAC305

    SAC305

    Abstract: 24 leads qfn 5x5 "thermal via" PQFN-24 rf 4 mm PQFN PQFN 8 leads PQFN SAC-305 AN3778 QFN PACKAGE Junction to PCB thermal resistance
    Text: Freescale Semiconductor Application Note AN3778 Rev. 0, 2/2010 PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation By: Quan Li, Lu Li, Richard Rowan, and Mahesh Shah PURPOSE This document provides guidelines for printed circuit board


    Original     		PDF AN3778 SAC305 24 leads qfn 5x5 "thermal via" PQFN-24 rf 4 mm PQFN PQFN 8 leads PQFN SAC-305 AN3778 QFN PACKAGE Junction to PCB thermal resistance

    S146

    Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
    Text: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,


    Original     		PDF 15mmH misali6-2-2557-7351 S146 S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3

    JEDEC SMT reflow profile

    Abstract: J-STD-020 SAC305 SAC305 SAC305 reflow JEDEC J-STD-020 SAC305 reflow profile reflow profile SAC305 solder paste SMT Process Z-Communications
    Text: Application Note AN-112 Using Convection Ovens for Attaching Z-COMM VCOs Introduction: This application note is to provide a basic SMT process guideline for solder reflowing Z-Communications voltage-controlled oscillators. The data provided complies with JEDEC J-STD-020 specification for peak


    Original     		PDF AN-112 J-STD-020 SAC305 AN-112 JEDEC SMT reflow profile J-STD-020 SAC305 SAC305 reflow JEDEC J-STD-020 SAC305 reflow profile reflow profile SAC305 solder paste SMT Process Z-Communications

    Asp1251

    Abstract: J-STD-020 SAC305 land pattern for WLCSP RCN310 ASPIC320 ism Transceiver SAC305 reflow system in package SAC305 reflow csp IPD filter IPDiA filter
    Text: Manual Handling recommendation These capacitors are designed to be mounted with a standard pick and place machine, with reflow. In case of manual handling, please follow below recommendations: x Minimize mechanical pressure on the capacitors use of a vacuum nozzle is recommended .


    Original     		PDF 100nF, TD431111615116 Asp1251 J-STD-020 SAC305 land pattern for WLCSP RCN310 ASPIC320 ism Transceiver SAC305 reflow system in package SAC305 reflow csp IPD filter IPDiA filter

    JEDEC SMT reflow profile

    Abstract: J-STD-020 SAC305 SAC305 SAC305 reflow profile SAC305 reflow reflow profile "Voltage Controlled Oscillators" preheat SAC305 solder paste
    Text: REFLOW PROCESS GUIDELINE Introduction This application note is to provide a basic SMT process guideline for solder reflowing Z-Communications voltage-controlled oscillators. The data provided complies with JEDEC J-STD-020 specification for peak reflow requirements. Each board must be characterized to establish reliable profile and to ensure high


    Original     		PDF J-STD-020 SAC305 AN-112 AN-112 JEDEC SMT reflow profile J-STD-020 SAC305 SAC305 reflow profile SAC305 reflow reflow profile "Voltage Controlled Oscillators" preheat SAC305 solder paste

    SAC405

    Abstract: Sn57Bi SAC305 reflow profile sac305 SAC305 reflow J-STD-020B SAC-305 jstd for msl 3
    Text: Application Note High Temperature Report Revision 3 OBJECTIVE The objective of this application note is to provide the customer with a general understanding of ANADIGICS’ product’s high temperature capabilities associated with 2nd level lead-free assembly. It also


    Original     		PDF

    JEDEC J-STD-020d.1

    Abstract: sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform J-STD-020D SAC-305
    Text: APPLICATION NOTE Solder Mounted Packaged Transistors Introduction This document is a supplement to Cree’s data sheet. It describes the recommended conditions under which Cree’s packaged transistors are to be soldered into amplifiers. Solder Temperatures Defined


    Original     		PDF J-STD-020D APPNOTE-007 JEDEC J-STD-020d.1 sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform SAC-305

    mems microphone

    Abstract: Laser microphone SAC305 ADMP421 admp401 paste profile AN-1068 microphone placement SAC305 reflow stencil
    Text: AN-1068 APPLICATON NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Reflow Soldering of the MEMS Microphone by Santosh A. Kudtarkar and Jia Gao BACKGROUND This application note provides guidance and suggestions for


    Original     		PDF AN-1068 ADMP401 ADMP421 AN08937-0-7/10 mems microphone Laser microphone SAC305 paste profile AN-1068 microphone placement SAC305 reflow stencil

    DAP 07

    Abstract: JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220
    Text: National Semiconductor Application Note 1187 August 27, 2010 Table of Contents Introduction . 2 Package Overview . 2


    Original     		PDF AN-1187 DAP 07 JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220

    SAC405

    Abstract: SAC305 SAC405 Data sheet SN60 SN62 SN63
    Text: AN-010 Rev A Reflow Soldering Guidelines for RoHS* Compliant E-Series Surface Mount Components Introduction This application note describes recommended practices and guidelines for the successful assembly of M/A-COM E-Series surface mount components using automated solder reflow


    Original     		PDF AN-010 of255 SAC405 SAC305 SAC405 Data sheet SN60 SN62 SN63

    sn63pb37 solder wire

    Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
    Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information


    Original     		PDF

    PCB design for 0.2mm pitch csp package

    Abstract: SAC305 reflow profile sac305 thermal conductive DAP 07 JESD22-B111 dap sot 23-5 DAP 06 dap 11 LDA08B MO-220
    Text: Table of Contents Introduction . 2 Package Overview . 2


    Original     		PDF CSP-9-111S2) CSP-9-111S2. AN-1187 PCB design for 0.2mm pitch csp package SAC305 reflow profile sac305 thermal conductive DAP 07 JESD22-B111 dap sot 23-5 DAP 06 dap 11 LDA08B MO-220

    ROSIN FLUX TYPE ROL1

    Abstract: IPC-J-STD-004 IPC-J-STD-004A ROSIN FLUX TYPE ROL0 J-STD-006 - ROL0 J-STD-006 SAC305 SAC405 bonding capillary led sac305 th hole design ipc insertion requirement
    Text: Soldering and Handling of High Brightness Through Holes LED Lamps Application Note 5334 Introduction LED is well known of its long useful life compare to conventional incandescent bulb. If LED is not being properly handled, it will significantly shorten its useful life and


    Original     		PDF AV02-0399EN ROSIN FLUX TYPE ROL1 IPC-J-STD-004 IPC-J-STD-004A ROSIN FLUX TYPE ROL0 J-STD-006 - ROL0 J-STD-006 SAC305 SAC405 bonding capillary led sac305 th hole design ipc insertion requirement

    33-2C

    Abstract: No abstract text available
    Text: 8200 Series Miniature Surface Mount Power Inductors SELECTION GUIDE Inductance, L Order Code 0.1V @ 10KHz Tolerance H % FEATURES n RoHS compliant n Up to 2.0A IDC n 1.0μH to 470μH n Ultra low profile n Low RDC n Tape and reel packaging n J-STD-020C reflow


    Original     		PDF 10KHz 82102C 82152C 82222C 82332C 82472C 82682C 82103C 82153C 82223C 33-2C

    SAC405

    Abstract: viscosity sac405 Sn57Bi JEDEC-STD-20C SAC305 screen emulsion QFN 8 CARSEM SAC305 reflow system in package QFN 16 CARSEM package outline sn63pb37 solder wire
    Text: Application Note Soldering Guidelines for Mounting ANADIGICS QFNs on PCBs Revision 2 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers’ general guidelines for PCB second level interconnect design when assembling with ANADIGICS’


    Original     		PDF

    sn63pb37 solder SPHERES

    Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
    Text: SMT Board Assembly Process Recommendations AN-353-4.0 Application Note This application note describes the board assembly process used in surface-mount technology SMT and focuses on the SMT component-to-board reflow soldering process and rework soldering if you are removing or replacing individual


    Original     		PDF AN-353-4 AN-353 AN-81. sn63pb37 solder SPHERES J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D

    AN5334

    Abstract: No abstract text available
    Text: HLMP-D101/D105, HLMP-K101/K105 T-13/4 5 mm , T-1 (3 mm), High Intensity, Double Heterojunction AlGaAs Red LED Lamps Data Sheet Description Features These solid state LED lamps utilize newly developed double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output


    Original     		PDF HLMP-D101/D105, HLMP-K101/K105 T-13/4 SAC305 AV02-0230EN AN5334

    Untitled

    Abstract: No abstract text available
    Text: HLMP-D101/D105, HLMP-K101/K105 T-13/4 5 mm , T-1 (3 mm), High Intensity, Double Heterojunction AlGaAs Red LED Lamps Data Sheet Description Features These solid-state LED lamps utilize newly developed double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output


    Original     		PDF HLMP-D101/D105, HLMP-K101/K105 T-13/4 SAC305 AV02-0230EN

    Untitled

    Abstract: No abstract text available
    Text: HLMP-DS25/DM25/NS30/NM31 T-1¾ 5 mm , T-1 (3 mm) InGaN LED Lamps Data Sheet Description Features The blue HLMP-DS25 and HLMP-NS30, and green HLMP-DM25 and HLMP-NM31 LEDs are designed in an industry standard T-1¾ and T-1 pack-ages with clear and nondiffused optics.


    Original     		PDF HLMP-DS25/DM25/NS30/NM31 HLMP-DS25 HLMP-NS30, HLMP-DM25 HLMP-NM31 AV02-1029EN

    MCM SERIES Q-TECH OSCILLATOR

    Abstract: No abstract text available
    Text: LOW PROFILE QT84 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature strip AT quartz crystal built in a


    Original     		PDF 500kHz 160MHz EAR99 36000G 12kHz QT84L11, 25MHz MCM SERIES Q-TECH OSCILLATOR

    Untitled

    Abstract: No abstract text available
    Text: LOW PROFILE QT84 MINIATURE SMD CRYSTAL OSCILLATORS 1.8 to 5.0Vdc - 500kHz to 160MHz Q-TECH CORPORATION Description Q-Tech’s surface mount 7 x 5 mm oscillator series consist of an IC 5Vdc, 3.3Vdc, 2.5Vdc, 1.8Vdc clock square wave generator and a miniature strip AT quartz crystal built in a


    Original     		PDF 500kHz 160MHz EAR99 160MHz 36000G QT84L11, 25MHz 30MHz