JEDEC J-STD-020d.1
Abstract: sac305 SAC305 reflow profile SAC305 solder paste sac305 kester SAC305 reflow Kester sn-pb-ag solder preform J-STD-020D SAC-305
Text: APPLICATION NOTE Solder Mounted Packaged Transistors Introduction This document is a supplement to Cree’s data sheet. It describes the recommended conditions under which Cree’s packaged transistors are to be soldered into amplifiers. Solder Temperatures Defined
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J-STD-020D
APPNOTE-007
JEDEC J-STD-020d.1
sac305
SAC305 reflow profile
SAC305 solder paste
sac305 kester
SAC305 reflow
Kester
sn-pb-ag solder preform
SAC-305
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GR-78-CORE
Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with
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65-0n-Tien
GR-78-CORE
ROSIN FLUX TYPE ROL0
sn63pb37
Sn62Pb36Ag2
J-STD-006A
RF771
bellcore GR-78
sn63pb37 solder wire
959T
TC-527
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SN63PB37
Abstract: No abstract text available
Text: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product
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EM907
EM828
SN63PB37
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sn63pb37 solder wire
Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Text: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information
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24-7068-1407
Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
Text: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com
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LGA voiding
Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print
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LTM4600
CCL-HL-832
LGA voiding
Indium 5.8LS Type 4
solder paste SAC305 alpha metal
PCB LAYOUT OF WATER LEVEL INDICATOR
CCL-HL-832
alpha OM-5300
SAC305 indium
TAIYO PSR 4000
Indium 5.8LS Type 6
OM-325
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BGA Solder Ball 0.35mm collapse
Abstract: TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm
Text: AMPHENOL TCS TB-2241 TM DFM and SMT Assembly Guideline Revision “B“ Specification Revision Status Revision “A“ “B” SCR No. Description Initial Date S1647 S1884 Initial Release Implemented 6-Pr changes Updated PN Tree and connector weight table
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TB-2241
S1647
S1884
BGA Solder Ball 0.35mm collapse
TB-2241
reballing
circular thermocouple connector
JEDEC tray standard dimension
tb224
BGA Solder Ball 0.35mm
BGA PROFILING
SAC305 solder paste
SAC305 reflow 13mm
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SAC405
Abstract: viscosity sac405 sac305 kester 114-13262 L622 SAC305
Text: Application Specification CFP Transceiver Connector Assembly NOTE i 114- 13262 14 JUL 09 Rev A All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2_. Figures and
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robotic arm
Abstract: solder paste SAC305 alpha metal plc transceiver 114-13263 robotic arm circuit design L622 SAC305 SAC405 pick and place robotic arm
Text: Application Specification 114- 13263 CFP Receptacle Connector 30 DEC 09 Rev B All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2_. Figures and
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74--position,
robotic arm
solder paste SAC305 alpha metal
plc transceiver
114-13263
robotic arm circuit design
L622
SAC305
SAC405
pick and place robotic arm
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A438
Abstract: SAC305 SAC405 SFP Connectors and Cages 1141301 ir 424f phosphor bronze msds
Text: Application Specification 114-13017 Small Form-Factor Pluggable SFP Connector and Cage Assembly NOTE i 03 DEC 08 Rev C All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2 . Figures and
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k639
Abstract: Cookson Group solder paste SAC305 alpha metal SAC405 10084 SAC305
Text: Small Form- Factor Pluggable SFP DWDM (Dense Wavelength Division Multiplexer) Connector and Cage Assembly NOTE i Application Specification 114- 13178 06 JUL 09 Rev D All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless
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SAC405
Abstract: solder paste SAC305 alpha metal SAC305 litton CONNECTOR 313a 788862 1489951
Text: Application Specification 114-13096 XFP Connector and Cage Assembly 08 DEC 08 Rev D All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2 . Figures and
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Qualcomm Atheros
Abstract: AR4100 block diagram of atheros MKG-16487 Atheros L1 sac305 kester atheros LDPC qualcomm mA RF atheros wifi update Qualcomm Atheros ar4100
Text: AR4100 System in Package 802.11n– General Availability Preliminary Data Sheet MKG-16487 Ver. 3.0 July 15, 2011 Not to be used, copied, reproduced in whole or in part, nor its contents revealed in any manner to others without the express written permission of Qualcomm Atheros, Inc.
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Untitled
Abstract: No abstract text available
Text: Application Specification Small Form-Factor SFP , SFP+, and zSFP+ Surface Mount PT Connectors and Cage Assemblies 114-13120 30 JUL 13 Rev G NOTE iNOTE All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless otherwise
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Qualcomm Atheros
Abstract: Atheros L1 LDPC Codes atheros application note AR4100 802.11 wifi SOC guide dma transmitter atheros MKG-16487 WiFi LDPC Atheros Qualcomm
Text: om AR4100 System in Package 802.11n– General Availability e. c Data Sheet MKG-16487 Ver. 5.0 fr ee sc al April 2012 ww w. Not to be used, copied, reproduced in whole or in part, nor its contents revealed in any manner to others without the express written permission of Qualcomm Atheros, Inc.
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atheros LDPC
Abstract: Atheros L1
Text: om AR4100 P System in Package 802.11n: General Availability e. c Data Sheet 80-Y2310-1 Rev. B fr ee sc al March 2013 ww w. Qualcomm is a registered trademark of QUALCOMM Incorporated. Atheros is a registered trademark of Qualcomm Atheros, Inc. Atheros is a trademark of Qualcomm Atheros Inc., registered in the United States and other countries.
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data circuit schematics satellite connector
Abstract: TANS III GPS ipc 610D abb SOFT STARTER CIRCUIT DIAGRAM nmea 0183 buffer solder paste SAC305 alpha metal ICD-GPS-200 N00146 db9 pcb mount female trimble multi Track target
Text: REFERENCE MANUAL USER GUIDE Copernicus GPS Receiver NORTH AMERICA Trimble Navigation Limited Corporate Headquarters 935 Stewart Drive Sunnyvale, CA 94086 +1-800-787-4225 +1-408-481-7741 EUROPE Trimble Navigation Europe Phone: +49-6142-2100-161 KOREA Trimble Export Ltd, Korea
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