S13N30S Search Results

S13N30S Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: RN ICPAK N uaant Specifications for TSOP Sockets MATERIALS Body: Liquid crystal polymer Plating: TT = 2.03 pm 80 pinch Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. Frame: Glass-filled PPS Contact: Copper alloy Holder: Copper alloy Flammability: UL 94V-0	OCR Scan	PDF	490m/s2 98m/s2 TSOP-4050XX-SMT-TT S13N30S TSOP-28XX-SMT-TT TSOP-32XX-SMT-TT TSOP-40XX-SMT-TT

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: RN ICPAK N uaant Specifications for TSOP Sockets MATERIALS Body: Liquid crystal polymer Plating: TT = 2.03 pm 80 pinch Tin/Lead overall. 1.27 pm (50 pinch) Nickel underplate. Frame: Glass-filled PPS Contact: Copper alloy Holder: Copper alloy Flammability: UL 94V-0

OCR Scan

PDF

490m/s2 98m/s2 TSOP-4050XX-SMT-TT S13N30S TSOP-28XX-SMT-TT TSOP-32XX-SMT-TT TSOP-40XX-SMT-TT