|
10114829-11109LF
|
|
Amphenol Communications Solutions
|
1.25mm Wire to Board Wafer, Vertical, Through Hole, 9 Positions |
|
|
|
10005639-11109LF
|
|
Amphenol Communications Solutions
|
Vertical Through-Hole 240 Position DDR2 DIMM Connector, 1.00mm pitch |
|
|
|
54111-109151500LF
|
|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 15 Positions, 2.54mm (0.100in) Pitch. |
|
|
|
54111-109201800LF
|
|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch. |
|
|
|
54111-109061200LF
|
|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch. |
|
|
