Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    RP-21225 Search Results

    RP-21225 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54112-112122500LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    54112-812122500LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    10138102-122500ULF Amphenol Communications Solutions EXAMEZZ® 56Gbps High speed Mezzanine connector system,2-pair, 21 column, 22.5mm Visit Amphenol Communications Solutions
    10127721-225LF Amphenol Communications Solutions Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 22 Position, 3.2mm Straight Tail (G/F on contact) plating, Non GW Compatible LCP, Black Color,Tray Packing. Visit Amphenol Communications Solutions
    10127721-225NPLF Amphenol Communications Solutions Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 22 Position, 3.2mm Straight Tail (G/F on contact) plating, Non GW Compatible LCP, Natural Color,Tray with PE Bag. Visit Amphenol Communications Solutions