str w 6554 a
Abstract: str 6554 STR 6456 str w 6554 str f 6456 str x 6456 BK2425-1320ALF str f 6554 NSH-03SB-S1-TG 12697
Text: Central Component Manufacturing - Cross Reference CCM PART # GCTJ-08-2-H-A1-BK-8-P1-S 22-11-2032 22-11-2042 22-11-2062 22-12-2024 22-12-2034 22-12-2034 22-12-2044 22-12-2104 30190 382811-5 39-30-1241 39-30-1241 41A-9-750 43045-0602 43045-0612 43045-0614 43045-0802
|
Original
|
GCTJ-08-2-H-A1-BK-8-P1-S
1A-9-750
752D02-50CRB301
731-8818-22A
ADT-911-G
AFC-10-P-SG
str w 6554 a
str 6554
STR 6456
str w 6554
str f 6456
str x 6456
BK2425-1320ALF
str f 6554
NSH-03SB-S1-TG
12697
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Robinson Nugent- Screw Machine Terminal Strips I Solderless Backplane Socket r SBE-CP Series High reliability gas-tight connections Eliminates expensive manual soldering of backplanes Press-fit pin eliminates PCB damage Compatible with standard press-fit
|
OCR Scan
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HIGH DENSITY PGA Socket Tooling PGA-ET Series • Allows device removal without damaging | or device body • Available for 10 x 10 through 21 x 21 grids • 18x18 through 21 x 21 extraction tools feature 4-sided pulling action DESCRIPTION PGA-ET-10x10 - Robinson Nugent, Inc. •
|
OCR Scan
|
18x18
PGA-ET-10x10
PGA-ET-12x12
PGA-ET-13x13
PGA-ET-14x14
PGA-ET-15x15
|
PDF
|
Robinson Nugent
Abstract: Robinson Nugent SCREW MACHINE SOCKET Motorola 68040
Text: HIGH DENSITY Pin Grid Array Socket with Heat Sink Tabs PGHS Series CLIP HEAT SINK • High temp molded insulator body compatible with IR and vapor phase soldering MICROPROCESSOR • Precision screw machine sockets for high reliability PGA SOCKET • “Ultra Low Force” 6-finger contact
|
OCR Scan
|
PGHS-179CH3-US-TG
50ninch
PGHS-T79CH3-US-TG
Robinson Nugent
Robinson Nugent SCREW MACHINE SOCKET
Motorola 68040
|
PDF
|
ROBINSON NUGENT
Abstract: ROBINSON
Text: 50 mil Interconnect System Redundant Ribbon Contact Reliability Until now the standard pitch for PC board connectors has been 100 mil 2.54mm , but as systems become smaller and the corresponding mounting density ot PC boards increases, it becomes necessary to increase the density
|
OCR Scan
|
PAK-50Â
PAK-50
ROBINSON NUGENT
ROBINSON
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HIGH DENSITY_ PGA Interstitial Sockets PGA-INT Series 9 .050" staggered design mates with n high density devices 9 Molded high temperature body mate - Suitable for infrared and vapor ph soldering applications 9 Screw machine reliability 9 Uses RN’s ultra-low force contact
|
OCR Scan
|
fUS-XX-TG30
PGA-INT-325AH-XX-TG30
NT-391
AX-XX-TG30
PGA-INT-S03AS-XX-TG30
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 50 mil Interconnect System Redundant Ribbon Contact Reliability Until now the standard pitch for PC board connectors has been 100 mil 2.54mm , but as systems become smaller and the corresponding mounting density of PC boards increases, it becomes necessary to increase the density
|
OCR Scan
|
PAK-50Â
PAK-50*
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HIGH DENSITY Pin Grid Array Sockets . ^ ^ 7 . PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermittent solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press-fit
|
OCR Scan
|
15x15
16x16
18x18
19x19
10x10
SP138
|
PDF
|
McKenzie technology
Abstract: burndy zif YAMAICHI 132 PGA MAXCONN ms McKenzie technology pga
Text: Sockets Below are two lists of manufactures known to offer sockets for Xilinx package types. This list does not imply an endorsement by Xilinx. Each user must evaluate the particular socket type. a compatible PGA socket with wire-wrap pins. Note that the board-layout then differs from a PGA board layout.
|
OCR Scan
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermitte solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press tails
|
OCR Scan
|
12x12
13x13
14x14
15x15
16x16
17x17
18x18
10x10
|
PDF
|
Robinson Nugent pga
Abstract: Robinson Nugent
Text: HIGH DENSITY Pin Grid Array Sockets PGA SERIES * High temp molded insulator body * Stand-offs available to eliminate intermittent solder connections * Precision screw machine sockets for high reliability * Available with solder, wire wrap and press-fit tails
|
OCR Scan
|
10x10
11x11
15x15
16x16
17x17
18x18
E73746
27urn)
Robinson Nugent pga
Robinson Nugent
|
PDF
|
Robinson Nugent
Abstract: Robinson Nugent pga 18x18 Nugent
Text: HIGH DENSITY_ PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints 9 Insures a reliable solder joint by provid ing an exact amount of solder * Eliminates the need for solder paste and
|
OCR Scan
|
13x13
18x18
Robinson Nugent
Robinson Nugent pga
Nugent
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Sockets HIGH DENSITY_ ^ Pin Grid Array Sockets with Heat Sink Tabs PGHS Series • High temp molded insulator body compatible with IR and vapor phase soldering • Precision screw machine sockets for high reliability • “Ultra Low Force” 6-finger contact
|
OCR Scan
|
762pm)
27\im)
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HIGH DENSITY PGA Sockets PGA-ET Series 9 Allows device removal without damaging pins or device body 9 Available for 10 x 10 through 21 x 21 grids 9 18x18 through 21 x 21 extraction tools feature 4-sided pulling action DESCRIPTION PGA-ET-10X10 SOCKETS PGA-ET-11X11
|
OCR Scan
|
18x18
PGA-ET-11X11
PGA-ET-12X12
PGA-ET-13X13
PGA-ET-10
PGA-ET-17x17
PGA-ET-18x4
PGA-ET-19X4
PGA-ET-20x4
PGA-ET-21x4
|
PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: HIGH DENSITY Pin Grid Array Headers PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements SOCKETS * Mates with PGA Series "A" SQUARE Grid Size Dimension A 8x8 .800“ 20 . 32 9x9 .900" (22 . 86)
|
OCR Scan
|
10x10
12x12
15x15
18x18
19x19
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HIGH DENSITY Pin Grid Array Socket with Heat Sink Tabs PGHS Series 9 High temp molded insulator body compatible with IR and vapor phase soldering 9 Precision screw machine sockets for high reliability 9 “Ultra Low Force” 6-finger contact RN Part Description
|
OCR Scan
|
PGHS-179CH3-US-TG
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HIGH DENSITY Pin Grid Array Headers PGH Series * High temp molded insulator body * Mates with PGA Series Grid Size Dimension A 8x8 .800* 20.32 9x9 .900“ (22 . 86) 10x10 1.000" (25 .40) 11 x 11 1.100" (27 . 94) 12x12 1.200" (30.48) 13x13 1.300" (33. 02)
|
OCR Scan
|
10x10
13x13
12x12
14x14
16x16
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Sockets — N ugent-Interstitial Pin Grid Array Sockets PGA-INT Series • .050" staggered design mates with new high density devices * Molded high temperature body material - Suitable for infrared and vapor phase soldering applications • Screw machine reliability
|
OCR Scan
|
E73746
PGA-INT-296BS-XX-XX*
PGA-INT-321AX-XX-XX
L-020
PGA-INT-391AX-XX-XX
PGA-INT-325AX-XX-XX
PGA-INT-431AS-XX-XX
PGA-INT-447AX-XX-XX
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HIGH DENSITY_ PGA Interstitial Sockets 7.' t PGA-INT Series * .050" staggered design mates with new high density devices * Molded high temperature body material - Suitable for infrared and vapor phase soldering applications * Screw machine reliability
|
OCR Scan
|
E73746
PGA-INT-296BS3-XX-TG30
NT-321
AS-XX-TG30
NT-325AH-XX-TG30
PGA-INT-391AX-XX-TG30
NT-503AS-XX-TG30
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Sockets HIGH DENSITY Pin Grid Array Headers 5X&tJ. PGH Series * High temp molded insulator body * Variety of pin lengths to accommodate different board spacing requirements * Mates with PGA Series "A" SQUARE .1 2 0 Grid Size Dimension A 8x8 .800" 20 . 32
|
OCR Scan
|
10x10
11x11
12x12
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HIGH DENSITY PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints * Insures a reliable solder joint by prc ing an exact amount of solder 9 Eliminates the need for solder paste
|
OCR Scan
|
18x18
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Sockets HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body * Stand-offs available to eliminate intermittent solder connections * Precision screw machine sockets for high reliability * Available with solder, wire wrap and press-fit
|
OCR Scan
|
16x16
18x18
10x10
SP138
|
PDF
|
Robinson Nugent pga
Abstract: No abstract text available
Text: SCREW MACHINE Terminal Strips Solderless Backplane Socket SBE-CP Series High reliability gas-tight connections Eliminates expensive manual soldering of backplanes Press-fit pin eliminates PCB damage Compatible with standard press-fit assembly technology Hi temp IR compatible
|
OCR Scan
|
08urn)
Robinson Nugent pga
|
PDF
|
PGHS179
Abstract: INTEL DX4 Motorola 68060
Text: HIGH DENSITY Pin Grid Array Sockets with Heat Sink Tabs PGHS Series SOCKETS * High temp molded insulator body compatible with IR and vapor phase soldering 9 Precision screw machine sockets for high reliability • “Ultra Low Force” 6-finger contact Heat Sink Vendor
|
OCR Scan
|
PGHS-168AH3-US-TG
PGHS-273AS3-US-TG
PGHS-INT-296BH3-US-TG
PGHS-INT-296CH3-US-TG
PGHS-179CH3-US-TG
PGHS-223EH3-US-T
PGHS-223EH3-US-TG
PGHS-27BASB-US-T6
PGHS179
INTEL DX4
Motorola 68060
|
PDF
|