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    RESIN COMPOUND Search Results

    RESIN COMPOUND Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    SMOD707KITV1 Renesas Electronics Corporation Volatile Organic Compound (VOC) Sensor Evaluation Kit Visit Renesas Electronics Corporation
    LM5111-2MYX/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD Visit Texas Instruments Buy
    LM5111-1MY/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD Visit Texas Instruments Buy
    LM5111-2MY/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD Visit Texas Instruments Buy
    LM5111-4M/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-SOIC Visit Texas Instruments Buy
    LM5111-4MY/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD Visit Texas Instruments Buy

    RESIN COMPOUND Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    HG-2

    Abstract: 3060A 7471A AES chips E.04
    Text: Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn SOIC 150 mils 8 Pb-Free Molding Compound % of Compound Weight g 10 4.44 E-03 85 3.77 E-02 3 1.33 E-03 1.5 6.66 E-04


    Original     		PDF 6010B HG-2 3060A 7471A AES chips E.04

    DSA0090625.txt

    Abstract: No abstract text available
    Text: 5.0 mm DIA LED LAMP 599R2GYW-CC REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange


    Original     		PDF 599R2GYW-CC DS-35-07-0235 HD-R/RD013 DSA0090625.txt

    k2950

    Abstract: IR 16713
    Text: 5.0 mm DIA LED 540R2GY-CC LAMP REV:A / 0 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange


    Original     		PDF 540R2GY-CC DS-35-07-0235 HD-R/RD013 k2950 IR 16713

    Untitled

    Abstract: No abstract text available
    Text: 5.0 mm DIA LED LAMP REV:A / 1 520MY8C-f2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange


    Original     		PDF 520MY8C-f2 DS-35-05-0057

    Untitled

    Abstract: No abstract text available
    Text: 5.0 mm DIA LED LAMP REV:A / 1 520CG6C-f2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange


    Original     		PDF 520CG6C-f2 DS-35-08-0354

    PA 0016

    Abstract: 520LB7C D4463
    Text: 5.0 mm DIA LED LAMP REV:A / 1 520LB7C-F2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange


    Original     		PDF 520LB7C-F2 -400V DS-35-07-0016 HD-R/RD013 PA 0016 520LB7C D4463

    d4515

    Abstract: LED highlight
    Text: 5.0 mm DIA LED LAMP REV:A / 0 520PG2C-F2 PACKAGE DIMENSIONS ITEM MATERIALS RESIN Epoxy Resin LEAD FRAME Sn Plating iron Alloy Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm 0.010 " Unless otherwise specified. 3.Protruded resin under flange


    Original     		PDF 520PG2C-F2 -400V DS-35-08-0395 mm8-12-24 d4515 LED highlight

    Untitled

    Abstract: No abstract text available
    Text: 12X12mm SMD LED WITH CERAMIC SUBSTRATE Part Number: KT-1213WG9SX9/10 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Materials: Features Dimensions : 12mmX12mmX1.2mm Package : Ceramics High power lighting. Encapsulating resin : Silicone resin


    Original     		PDF 12X12mm KT-1213WG9SX9/10 12mmX12mmX1 DSAK1042 OCT/07/2011

    JESD22-A120

    Abstract: No abstract text available
    Text: 12X12mm SMD LED WITH CERAMIC SUBSTRATE Part Number: KT-1213WG9SX9/10 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Materials: z Dimensions : 12mmX12mmX1.2mm Package : Ceramics z High power lighting. Encapsulating resin : Silicone resin


    Original     		PDF 12X12mm KT-1213WG9SX9/10 12mmX12mmX1 DSAK1042 OCT/07/2011 JESD22-A120

    SB2336E-G

    Abstract: No abstract text available
    Text: SB2336E-G Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin


    Original     		PDF SB2336E-G 100pF, KSD-O8V005-003 SB2336E-G

    SSB2336

    Abstract: No abstract text available
    Text: SSB2336E-GD2 Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin


    Original     		PDF SSB2336E-GD2 100pF, KSD-O8V022-002 SSB2336

    Untitled

    Abstract: No abstract text available
    Text: SW2336E-H Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin


    Original     		PDF SW2336E-H 100pF, KSD-O8V001-004

    isopropyl alcohol

    Abstract: B589
    Text: SY2336-HA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin


    Original     		PDF SY2336-HA KSD-O8V023-002 isopropyl alcohol B589

    Untitled

    Abstract: No abstract text available
    Text: SY2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin


    Original     		PDF SY2336-GA KSD-O8V026-003 SY2336-GA

    Untitled

    Abstract: No abstract text available
    Text: SSB2336E-GD3 Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin


    Original     		PDF SSB2336E-GD3 100pF, KSD-O8V025-002

    Untitled

    Abstract: No abstract text available
    Text: SA2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin


    Original     		PDF SA2336-GA KSD-O8V031-001

    Untitled

    Abstract: No abstract text available
    Text: SA2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin


    Original     		PDF SA2336-GA KSD-O8V031-000

    B1588

    Abstract: No abstract text available
    Text: SY2336-GA Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin


    Original     		PDF SY2336-GA KSD-O8V026-004 B1588

    Untitled

    Abstract: No abstract text available
    Text: SW2336E-H Semiconductor High Brightness Chip LED Features • Colorless transparency lens type • Using a package with high heat dissipation properties, it can be driven with a large current • Wide viewing angle • Encapsulating Resin : Silicone Resin


    Original     		PDF SW2336E-H 100pF, KSD-O8V001-003

    Untitled

    Abstract: No abstract text available
    Text: WT-U3A8TW-8538 TOP Mount Super Bright SMD LED Product Specifications Specification Material Quantity Resin White Silicone Resin Carrier tape EIA 481-1A specs Conductive black tape Reel EIA 481-1A specs Conductive black Label WT standard Paper Packing bag 220x240mm


    Original     		PDF WT-U3A8TW-8538 81-1A 220x240mm 1000pcs 30sec, 01-Feb-2013

    Untitled

    Abstract: No abstract text available
    Text: Materials Declaration Data Sheet ASDM_ASDMB QFN 2.5 x 2.0 mm 12.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating


    Original     		PDF NEX-130CT 8200T Q3-6646)

    Untitled

    Abstract: No abstract text available
    Text: WT-U3A8TW-8539 TOP Mount Super Bright SMD LED Product Specifications Specification Material Quantity Resin Cool White Silicone Resin Carrier tape EIA 481-1A specs Conductive black tape Reel EIA 481-1A specs Conductive black Label WT standard Paper Packing bag


    Original     		PDF WT-U3A8TW-8539 81-1A 220x240mm 1000pcs 30sec, 01-Feb-2013

    Q3-6646

    Abstract: No abstract text available
    Text: Materials Declaration Data Sheet ASEM_ASEMB QFN 3.2 x 2.5 mm 19.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating


    Original     		PDF NEX-130CT 8200T Q3-6646) Q3-6646

    Untitled

    Abstract: No abstract text available
    Text: Materials Declaration Data Sheet ASFLM,ASFLMB QFN 5.0 x 3.2 mm 37.1 4 Device Package Body Size Weight mg Lead Count Silica Fused Epoxy Resin Phenol Resin Carbon Black Item Item Leadframe base metal Copper (Cu) Iron (Fe) Phosphorus (P) Zinc (Zn) Leadframe plating


    Original     		PDF NEX-130CT 8200T Q3-6646)