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    RELIABILITY TESTING REPORT Search Results

    RELIABILITY TESTING REPORT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    FO-62.5LPBMT0-001 Amphenol Cables on Demand Amphenol FO-62.5LPBMT0-001 MT-RJ Connector Loopback Cable: Multimode 62.5/125 Fiber Optic Port Testing .1m Datasheet
    FO-9LPBMTRJ00-001 Amphenol Cables on Demand Amphenol FO-9LPBMTRJ00-001 MT-RJ Connector Loopback Cable: Single-Mode 9/125 Fiber Optic Port Testing .1m Datasheet
    SF-SFP28LPB1W-3DB Amphenol Cables on Demand Amphenol SF-SFP28LPB1W-3DB SFP28 Loopback Adapter Module for SFP28 Port Compliance Testing - 3dB Attenuation & 1W Power Consumption Datasheet
    FO-50LPBMTRJ0-001 Amphenol Cables on Demand Amphenol FO-50LPBMTRJ0-001 MT-RJ Connector Loopback Cable: Multimode 50/125 Fiber Optic Port Testing .1m Datasheet
    SF-SFPPLOOPBK-003.5 Amphenol Cables on Demand Amphenol SF-SFPPLOOPBK-003.5 SFP+ Loopback Adapter Module for SFP+ Port Compliance Testing - 3.5dB Copper/Optical Cable Emulation Datasheet

    RELIABILITY TESTING REPORT Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    TRANSISTOR A104b

    Abstract: TRANSISTOR A107 EIAJ ED-4701 305 water pumping machine control schematic electromigration calculation for TTL smd transistor AIT AAAA series SMD transistor schematic diagram atom ED-4701 A103-C
    Text: [ 3 ] Reliability Testing Contents 1. What is Reliability Testing . 1 1.1 Significance and Purpose of Reliability Testing. 1 1.2 1.3 Before Testing . 1


    Original     		15000m/s2, 200000m/s2, TRANSISTOR A104b TRANSISTOR A107 EIAJ ED-4701 305 water pumping machine control schematic electromigration calculation for TTL smd transistor AIT AAAA series SMD transistor schematic diagram atom ED-4701 A103-C PDF

    EIAJ-IC-121-17

    Abstract: JESD22-A110 EIAJ-ED4701-D323 EIAJ-IC-121-18 MIL-STD-883 PRESSURE COOKER failure rate SM stress migration EIAJ-IC-121 JESD22A110
    Text: Quality and Reliability Report 5. Reliability Testing The purpose of reliability testing is to ensure that The purpose of the high-temperature operating life products are properly designed and assembled by HTOL test is to determine the reliability of subjecting them to stress conditions that acceler-


    Original     		MIL-STD-883, 85C/140C EIAJ-IC-121-17 JESD22-A110 EIAJ-ED4701-D323 EIAJ-IC-121-18 MIL-STD-883 PRESSURE COOKER failure rate SM stress migration EIAJ-IC-121 JESD22A110 PDF

    max785cai

    Abstract: MAX232A SO-16 MAX232CPE application sheet MAX232CPE MAX232AEPE MAX785 MAX232ACPE MAX241CWI LH101 MAX724CCK
    Text: January 1999 Product Reliability Report This report presents the product reliability data for Maxim’s analog products. The data was acquired from extensive reliability stress testing performed in 1997/1998. It is separated into seven fabrication processes: 1


    Original     		PDF

    max785cai

    Abstract: MAX6809 MAX232CPE MAX232CPE application sheet MAX232ACPE MAX232AEPE MAX691ACPE T 9722 MAX232ECPE MAX233 application notes
    Text: January 1999 Product Reliability Report This report presents the product reliability data for Maxim’s analog products. The data was acquired from extensive reliability stress testing performed in 1997/1998. It is separated into seven fabrication processes: 1


    Original     		PDF

    DG302 to220

    Abstract: MAX233 application notes zener 9514 MAX249 MAX238 9545 MAX232CPE application sheet max809 ICM7218AIPI MAX232 application notes
    Text: November 1, 1996 RR-1J Product Reliability Report This report presents the product reliability data for Maxim’s analog products. The data was acquired from extensive reliability stress testing performed in 1995. It is separated into seven fabrication processes: 1 Standard


    Original     		PDF

    MAX785

    Abstract: st 9635 DG302 to220 MAX232CPE MAX232 integrated chips IC 9637 MAX333 equivalent max232 MTBF calculation MAX232 mtbf st 9548
    Text: December 1997 RR-1K Product Reliability Report This report presents the product reliability data for Maxim’s analog products. The data was acquired from extensive reliability stress testing performed in 1996. It is separated into seven fabrication processes: 1 Standard


    Original     		PDF

    max785

    Abstract: DG302 to220 DG301 to220 st 9635 st 9548 MAX232 integrated chips max232 MTBF calculation MAX232 mtbf MAX333 equivalent MAX232ACPE
    Text: December 1997 RR-1K Product Reliability Report This report presents the product reliability data for Maxim’s analog products. The data was acquired from extensive reliability stress testing performed in 1996. It is separated into seven fabrication processes: 1 Standard


    Original     		PDF

    DG302 to220

    Abstract: MAX724 equivalent 9532 zener MAX233 application notes MAX7219 equivalent MAX232CPE application sheet MAX238 MX7226 MAX249 MAX485 application notes
    Text: November 1, 1996 RR-1J Product Reliability Report This report presents the product reliability data for Maxim’s analog products. The data was acquired from extensive reliability stress testing performed in 1995. It is separated into seven fabrication processes: 1 Standard


    Original     		PDF

    MAX202, MAX232

    Abstract: LTC902 icl8069 equivalent MAX8212 equivalent MAX705 equivalent 7912 TO3 PACKAGE MAX832 MX7543 Ic 9430 MAX232
    Text: May 1, 1995 RR-1I Product Reliability Report This report presents the product reliability data for Maxim’s analog products. This data is a result of extensive reliability stress testing that we performed in 1994. It is separated into six fabrication processes: 1


    Original     		PDF

    Mil-Std-883 Wire Bond Pull Method 2011

    Abstract: MIL-STD-883 Method 2010 pHEMT transistor RF MESFET S parameters MESFET 0.15 phemt p-hemt TGA8310 MIL-STD-883 method 2011 GaAs 0.15 pHEMT
    Text: GaAs MMIC Space Qualification GaAs MMIC Testing TriQuint Semiconductor has advanced Lot Acceptance Testing LAT for High Reliability Applications of GaAs MMICs. A flowchart depicting the entire MMIC processing flow, including the Quality Conformance Inspection


    Original     		PDF

    MAX7845

    Abstract: MAX232 MAX232 mtbf mar 9109 MAX333 equivalent MAX9690 equivalent scr 9117 maxim 9114 max232 specification MAX252 8 pin
    Text: RR-1G Product Reliability Report This report presents the product reliability data for Maxim’s analog products. This data is a result of extensive reliability stress testing that we performed from 1990 to 1992. It is separated into four groups: Metal Gate


    Original     		X10-9 MAX7845 MAX232 MAX232 mtbf mar 9109 MAX333 equivalent MAX9690 equivalent scr 9117 maxim 9114 max232 specification MAX252 8 pin PDF

    ic 9033

    Abstract: MAX232 MAX333 equivalent max232 MTBF calculation MAX232 mtbf MAX7845 mar 9109 MAX9690 equivalent maxim 9114 MAX690CPA
    Text: RR-1G Product Reliability Report This report presents the product reliability data for Maxim’s analog products. This data is a result of extensive reliability stress testing that we performed from 1990 to 1992. It is separated into four groups: Metal Gate


    Original     		X10-9 ic 9033 MAX232 MAX333 equivalent max232 MTBF calculation MAX232 mtbf MAX7845 mar 9109 MAX9690 equivalent maxim 9114 MAX690CPA PDF

    MAX232

    Abstract: MAX1074 LTC902 MAX252 8 pin max232 MTBF calculation max232 specification MAX9687 38544 MAX9690 equivalent analog devices dg508 die
    Text: December 1, 1994 RR-1H Product Reliability Report This report presents the product reliability data for Maxim’s analog products. This data is a result of extensive reliability stress testing that we performed from January 1990 to January 1994. It is separated into six


    Original     		PDF

    MAX232

    Abstract: max232 specification MAX252 8 pin MAX9690 equivalent MAX584 max-232 38544 LTC902 max232 MTBF calculation MAX9687
    Text: December 1, 1994 RR-1H Product Reliability Report This report presents the product reliability data for Maxim’s analog products. This data is a result of extensive reliability stress testing that we performed from January 1990 to January 1994. It is separated into six


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Engineering Manual HF212 Solder Paste Suitable for use with: Standard SAC Alloys High Reliability 90iSC Alloy Low Ag Alloys Contents 1. Product Description 2. Features & Benefits 3. Print Process Window 4. Print Abandon Time Testing 5. Slump Testing 6. Tack-Life Force


    Original     		HF212 90iSC HF212: IPC-TM-650 34/EN14582 ANSI/J-STD-004 PDF

    Untitled

    Abstract: No abstract text available
    Text: High Reliability Chip - X7R 16Vdc to 10kVdc A range of MLC chip capacitors in Stable EIA Class II dielectric with special testing for long term reliability. They are designed for optimum reliability; burned in at elevated voltage and temperature, and 100% physically and electrically inspected


    Original     		16Vdc 10kVdc MIL-PRF-55681, MIL-PRF-123, MIL-PRF-49467, MIL-PRF-55681 MIL-PRF-123 PDF

    Untitled

    Abstract: No abstract text available
    Text: High Reliability Chip - X7R 16Vdc to 10kVdc A range of MLC chip capacitors in Stable EIA Class II dielectric with special testing for long term reliability. They are designed for optimum reliability; burned in at elevated voltage and temperature, and 100% physically and electrically inspected to


    Original     		16Vdc 10kVdc MIL-PRF-55681, MIL-PRF-123, MILPRF-49467, MIL-PRF-55681 MIL-PRF-123 PDF

    103jg1k

    Abstract: 103jg thermistor
    Text: Reliability Testing HIGH TEMPERATURE STORAGE « Previous Continue » THERMISTOR/THERMISTOR ASSEMBLY ENVIRONMENTAL TEST REPORT Part Number: 103JG1K Part Description: Thermistor Test Identification Number: SO#: 37213 Test Specification: HIGH TEMPERATURE SOAK


    Original     		103JG1K C/R25 103jg1k 103jg thermistor PDF

    Untitled

    Abstract: No abstract text available
    Text: High Reliability Chip - C0G 16Vdc to 10kVdc A range of MLC chip capacitors in Ultra stable EIA Class I C0G, or NP0, dielectric with special testing for long term reliability. They are designed for optimum reliability; burned in at elevated voltage and temperature, and 100% physically and electrically


    Original     		16Vdc 10kVdc MIL-PRF-55681, MIL-PRF-123, MIL-PRF-49467, MIL-PRF-55681 MIL-PRF-123 PDF

    Untitled

    Abstract: No abstract text available
    Text: High Reliability Chip - C0G 16Vdc to 10kVdc A range of MLC chip capacitors in Ultra stable EIA Class I C0G, or NP0, dielectric with special testing for long term reliability. They are designed for optimum reliability; burned in at elevated voltage and temperature, and 100% physically and electrically inspected


    Original     		16Vdc 10kVdc MIL-PRF-55681, MIL-PRF-123, MILPRF-49467, MIL-PRF-55681 MIL-PRF-123 PDF

    report on PLCC

    Abstract: 7B9742 3G0329 TSOP Package MIL-M-38535 0B0027 2G0232
    Text: PAGE 1 OF 6 ATMEL CORPORATION Tel: 408 441-0311 Fax:(408)436-4200 AT-27BV020 EPROM RELIABILITY DATA - 125°C OPERATING LIFE TEST (PLASTIC) - 150°C RETENTION BAKE (PLASTIC) - EXTENDED THERMAL SHOCK - 15 PSIG PRESSURE POT - EXTENDED TEMPERATURE CYCLING * This report was generated from AT-27BV020 reliability testing.


    Original     		AT-27BV020 MIL-M-38535 AT-27BV040 AT-27BV020 4C2629 4C9501 6A0980-1 9B9930 1C0144 report on PLCC 7B9742 3G0329 TSOP Package 0B0027 2G0232 PDF

    MIL-M-38535

    Abstract: No abstract text available
    Text: PAGE 1 OF 6 ATMEL CORPORATION Tel: 408 441-0311 Fax:(408)436-4200 AT-27BV256 EPROM RELIABILITY DATA - 125°C OPERATING LIFE TEST (PLASTIC) - 150°C RETENTION BAKE (PLASTIC) - 15 PSIG PRESSURE POT - EXTENDED TEMPERATURE CYCLING - EXTENDED THERMAL SHOCK * This report was generated from AT-27BV256 reliability testing.


    Original     		AT-27BV256 MIL-M-38535 AT-27BV010 AT-27BV020 AT-27BV256 5B1402 5B9552 7D3024B 7D9813 PDF

    USP2373

    Abstract: No abstract text available
    Text: Reliability Testing SALT WATER IMMERSION « Previous Continue » THERMISTOR/THERMISTOR ASSEMBLY ENVIRONMENTAL TEST REPORT Part Number: USP2373 Part Description: Thermistor Probe Test Identification Number: SO#: 31538 Test Specification: SPECIAL Test Condition s :


    Original     		USP2373 C/R25 USP2373 PDF

    Untitled

    Abstract: No abstract text available
    Text: No.:T1091 RELIABILITY TEST REPORT TEST REPORT Company ：RAIO TECHNOLOGY INC. Model Name ：RA8806 Date Received ：2008.01.21 Date Tested ：2008.01.29 TESTING LABORATORY IS ACCREDITED BY: IEC/IECQ 17025 certificate of independent test laboratory approval


    Original     		T1091 RA8806 L0835-060321 HS0801210029A RAC9700250-E PDF