post burn-in
Abstract: AN007 Reliability Test Methods for Packaged Devices
Text: Application Note AN-007 Nitronex Device Burn-in Introduction Packaged Device Burn-In Procedure Nitronex performs 100% burn-in of packaged devices to remove most of the shift of VT and IMAX over the device’s lifetime. Due to the difficultly of consistently
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AN-007
post burn-in
AN007
Reliability Test Methods for Packaged Devices
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JEDEC J-STD-020C
Abstract: JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 AMD reflow soldering profile BGA J-STD-035 semiconductors cross reference ipc-sm-786A
Text: IPC/JEDEC J-STD-020C July 2004 Supersedes IPC/JEDEC J-STD-020B July 2002 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public
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J-STD-020C
J-STD-020B
1-580987-46-X
JEDEC J-STD-020C
JESD47
Reliability Test Methods for Packaged Devices
Infineon moisture sensitive package
JESD-47
JESD22-A120
AMD reflow soldering profile BGA
J-STD-035
semiconductors cross reference
ipc-sm-786A
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maxim CODE TOP MARKING
Abstract: Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code
Text: Maxim > App Notes > 1-Wire Devices General Engineering Topics Keywords: flip, chip, scale, wafer, level, package, packages, packaging, wlp, ucsp, fchip, wlcsp, pb free, rohs, topmark, bump, die Apr 18, 2007 APPLICATION NOTE 4002 Understanding Flip-Chip and Chip-Scale Package Technologies and
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DS2482-101:
DS2502:
DS2762:
com/an4002
AN4002,
APP4002,
Appnote4002,
maxim CODE TOP MARKING
Pb95Sn5
maxim TOP MARKING
garrou wafer-level packaging has arrived
Maxim ic date code
ANALOG DEVICES ASSEMBLY DATE CODE
philip IC marking
Maxim date code DS2431
dALLAS MARKING CODE
maxim assembly of code
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Untitled
Abstract: No abstract text available
Text: PR33MA11NTZF PR33MA11NTZF IT rms ≤0.3A, Non-Zero Cross type DIP 6pin SSD •Description ■Agency approvals/Compliance PR33MA11NTZF Solid State Device (SSD) are an integration of an infrared emitting diode (IRED), a Phototriac Detector. These devices are ideally suited for controlling high
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PR33MA11NTZF
PR33MA11NTZF
OP13017EN
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Untitled
Abstract: No abstract text available
Text: PR33MA11NTZF PR33MA11NTZF IT rms ≤0.3A, Non-Zero Cross type DIP 6pin SSR •Description ■Agency approvals/Compliance PR33MA11NTZF Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector. These devices are ideally suited for controlling high
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PR33MA11NTZF
PR33MA11NTZF
OP13017EN
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reliability data analysis
Abstract: No abstract text available
Text: 1 GENERAL INFORMATION Reliability INTRODUCTION Vantis’ and AMD’s Qualification Maintenance Program QMP is used to measure the reliability of all process technologies on a regular basis. This is an extensive effort that is aimed at providing generic fab process coverage for all fab process technologies. Typically about 30,000 devices per
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MIL-STD-883 Method 2010
Abstract: No abstract text available
Text: DICE PRODUCTS INTRODUCTION Linear Technology Corporation LTC offers a wide variety of precision linear ICs in die form. It is our intent to offer dice electrically tested to levels which can be expected to yield the best possible performance in hybrid circuits.
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MIL-STD-883 Method 2010
Abstract: No abstract text available
Text: DICE PRODUCTS INTRODUCTION Linear Technology Corporation LTC offers a wide variety of precision linear ICs in die form. It is our intent to offer dice electrically tested to levels which can be expected to yield the best possible performance in hybrid circuits.
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MIL-STD-883 Method 2010
Abstract: No abstract text available
Text: DICE PRODUCTS INTRODUCTION Linear Technology Corporation LTC offers a wide variety of precision linear ICs in die form. It is our intent to offer dice electrically tested to levels which can be expected to yield the best possible performance in hybrid circuits.
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Untitled
Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK Standard & Custom Products, DC to 110 GHz! Analog, Digital & Mixed-Signal ICs, Modules, Subsystems & Instrumentation
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AS9100
MIL-PRF-38534-K
MIL-PRF-38535-S
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Untitled
Abstract: No abstract text available
Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK Space Qualified Processes, People & Facilities! Analog, Digital & Mixed-Signal ICs, Modules, Subsystems & Instrumentation
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AS9100
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Reflow
Abstract: JEDEC J-STD-020d.1 JEP-140 JEP140 J-STD-035 JESD22-B112 JEDEC J-STD-020d JESD47 JESD22-B108 IPC-020d-5-1
Text: IPC/JEDEC J-STD-020D.1 March 2008 Supersedes IPC/JEDEC J-STD-020D August 2007 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public
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J-STD-020D
J-STD-020D
Reflow
JEDEC J-STD-020d.1
JEP-140
JEP140
J-STD-035
JESD22-B112
JEDEC J-STD-020d
JESD47
JESD22-B108
IPC-020d-5-1
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Moisture Sensitivity Level Rating
Abstract: JESD22-A113 moisture sensitive handling and packaging moisture sensitivity s2083 JEDEC J-STD-033 moisture handling and packaging S2080 J-STD-033
Text: Moisture Effects on the Soldering of Plastic Encapsulated Devices S2080 V4 Introduction Improper packaging, storage, and handling of plastic encapsulated devices PED’s can trap moisture within the devices and lead to damage during reflow soldering to printed circuit boards. As part of reliability qualification
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S2080
Moisture Sensitivity Level Rating
JESD22-A113
moisture sensitive handling and packaging
moisture sensitivity
s2083
JEDEC J-STD-033
moisture handling and packaging
S2080
J-STD-033
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b1415
Abstract: GAAS FET CROSS REFERENCE gaas fet 70 mil micro-X Package power fet 70 mil micro-X Package EPA240BV N5 micro-X Package EPA060B-70 MIXER EMA 0.5w ,GaAs FET EPA480C-SOT89
Text: RTC/5/01/PSINTRO EXCELICS SEMICONDUCTOR, INC. PRODUCT SELECTION GUIDE Products Excelics Semiconductor, Inc. was founded in 1995 to become a world wide leading merchant supplier of high performance R.F. and microwave semiconductor discrete devices and integrated circuits ICs
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RTC/5/01/PSINTRO
24-hour
200oC,
275oC
b1415
GAAS FET CROSS REFERENCE
gaas fet 70 mil micro-X Package
power fet 70 mil micro-X Package
EPA240BV
N5 micro-X Package
EPA060B-70
MIXER EMA
0.5w ,GaAs FET
EPA480C-SOT89
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electrolytic ELITE
Abstract: No abstract text available
Text: QUALITY ASSURANCE and RELIABILITY PROGRAM 1. Introduction Samsung utilizes rigorous qualification and reliability programs to monitor the integrity of its devices. All industry stan dard {and various non-standard} stresses are run. Testing is done not only to collect data, but also to detect trends
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KSC945
KSD288
KSD288
168HRS)
200CYC)
electrolytic ELITE
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GA1A1S100WP
Abstract: GA1A1S100 eiaj-c3 ga1a
Text: ED-07G020 ay 25,2007 H E R E S OPTO-ANALOG DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION f DEVICE SPECIFICATION FOR OPIC LIGHTDETECTOR MODEL No. GA1A1S100WP Specified for Enclosed please find copies of the Specifications which consists of 17 pages including cover.
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ED-07G020
GA1AIS100WP
GA1A1S100WP
000pcs
GA1A1S100WP
GA1A1S100
eiaj-c3
ga1a
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Untitled
Abstract: No abstract text available
Text: Known Good Die: The Challenge of the Technology M ark Lippold and Sherburne Bridges National Semiconductor, Inc. South Portland, M aine Abstract The challenges of supplying high yield, high quality, cost effective Known Good Die KGD are discussed in detail. A review of the history behind die supply processing and technology drivers provide insight into the
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3SF11
Abstract: CA95323 E64380
Text: SHARP OPTO-ELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION f DEVICE SPECIFICATION FOR PHOTOTRIAC COUPLER MODEL No. 3SF11 Business dealing name o PC3SF11NTZBF PC3SF11YTZBF Specified for Enclosed please find copies of the Specifications which consists of 14 pages including cover.
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3SF11
PC3SF11NTZBF
PC3SF11YTZBF
ED-04P101
PC3SF11NT2BF
3SF11
CA95323
E64380
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HCC242
Abstract: JAN2N2907A
Text: @ OPTEK High-Reliability Devices High-reliability requirements demand that products be able to function under abnormally severe levels of mechanical, environmental, and electrical stress. This challenge has been met by Optek with prod uct designs and process control techniques that ensure high reliability and, thus, long life.
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MIL-STD-750
MIL-PRF-19500
MIL-PRF-19500
HCC242
JAN2N2907A
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Untitled
Abstract: No abstract text available
Text: SHARP OPTO-ELECTRONIC DEVICES DIVISION ELECTRO N IC COM PONENTS GROUP SHARP CORPORATION SPECIFICATION D EV ICE SPECIFICATION FO R PHOTOCOUPLER M O D EL No. PC815 Business dealing name PC815XJ0000F PC815XYJ000F Specified for Enclosed please find copies o f the Specifications which consists o f 14 pages including cover.
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PC815
PC815XJ0000F
PC815XYJ000F
171mm
PC815XYJOOOF)
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schematic WELDER
Abstract: gold melting furnace ultrasonic bond
Text: Bonding and Handling Procedures for Chip Devices DISCUSSION Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last few years. Today's circuit designer is faced with a multiplicity of alter natives in the selection of diodes and packaging with each
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OT-23
schematic WELDER
gold melting furnace
ultrasonic bond
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eiaj-c3
Abstract: GA1A1S201WP ED-06G070
Text: SPEC. No. ED-06G070 ISSUE October 12,2006 SHARP OPTO-ANALOG DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION “ DEVICE SPECIFICATION FOR OPIC LIGHT DETECTOR MODEL No. GA1A1S201WP Specified for Enclosed please find copies of the Specifications which consists of 14 pages including cover.
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ED-06G070
GA1A1S201WP
5to30Â
eiaj-c3
GA1A1S201WP
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PC123Y82FZ0F
Abstract: PC123Y92FZ0F PC123Y12FZ0F PC123Y22FZ0F pc123y22 PC123Y82 PC123Y52FZ0F pc123y52 PC123 VDE PC123 pin out
Text: I S H A R P I' jfU. SPEC. No. ED-04P126A p. ’:U ; .‘ '>>' J'V/ ^ " fP JSSUE -November24,200| OPTO-ELECTRONTC DEVICES DIVISION ELECTR O N IC CO M PO N EN TS GROUP SH A RP CORPORATION SPECIFICATION DEV ICE SPECIFICATION FO R PHOTOCOUPLER M O D EL No. PC123
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PC123Y12FZ0F
PC123Y22FZ0F
PC123Y52FZ0F
PC123Y82FZ0F
PC123Y92FZ0F
PC123Y82FZ0F
PC123Y92FZ0F
PC123Y12FZ0F
PC123Y22FZ0F
pc123y22
PC123Y82
PC123Y52FZ0F
pc123y52
PC123 VDE
PC123 pin out
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PC123 VDE
Abstract: PC123X PC123X2YFZ0F High operating temp Photocoupler PC123XNYFZ0F PC123X2YF20F PC123 pin out PC123X9 PC123X1YFZ0F PC 123 photocoupler
Text: SHARP OPTO-ELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR PHOTOCOUPLER MODEL No. PC 123 Business dealing name PC123XNNFZ0F PC123XNYFZ0F PC123X1NFZ0F PC123X1YFZ0F PC123X2NFZ0F PCI 23X2YFZOF PC123X5NFZ0F
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PC123XNNFZ0F
PC123XNYFZ0F
PC123X1NFZ0F
PC123X1YFZ0F
PC123X2NFZ0F
PC123X2YFZ0F
PC123X5NFZ0F
PC123X5YFZ0F
PC123X8NFZ0F
PC123X9NFZ0F
PC123 VDE
PC123X
PC123X2YFZ0F
High operating temp Photocoupler
PC123XNYFZ0F
PC123X2YF20F
PC123 pin out
PC123X9
PC123X1YFZ0F
PC 123 photocoupler
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