QLA2200
Abstract: QLA2100 QL2200 QL220
Text: QLDIRECT QLogic Optimizing and Multipath Driver For Windows NT V4.0 and Windows 2000 Contents = OS Support Hardware Support Supported Features Release History Installing the Driver Replacing QLFILTER with QLDIRECT Reinstalling the Driver Registry Parameters
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FT2232H
Abstract: ft4232 FT4232H COM16 motherboard diagram g41
Text: Future Technology Devices International Ltd. Application Note AN_132 Re-Assigning COM Port Numbers Using the Windows Registry Document Reference No.: FT_000196 Version 1.0 Issue Date: 2009-11-06 This application note illustrates how to re-assign automatically assigned FTDI COM port numbers using
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SC136640
FT2232H
ft4232
FT4232H
COM16
motherboard diagram g41
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PCCU32
Abstract: 2101125-AE ABB COLD START
Text: Data Sheet 2101125-AE DESCRIPTION Registry is a term that refers to a collection of data that describes the system level software and hardware reference information for an XSeries product. This information is stored in a protected area of the on-board 32K E2PROM S Drive and is
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2101125-AE
PCCU32
2101125-AE
ABB COLD START
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toshiba 8GB
Abstract: AP-UM008GN40CG-T Toshiba slc toshiba flash memory 8gb 180D apacer
Text: RoHS Compliant USB-Disk ModuleⅡPlus Specification May 24, 2011 Version 1.1 Apacer Technology Inc. th 4 Fl., 75 Hsin Tai Wu Rd., Sec.1, Hsichih, New Taipei City, Taiwan 221 Tel: +886-2-2698-2888 www.apacer.com Fax: +886-2-2698-2889 USB-Disk ModuleⅡPlus
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Temperature08-586-1291
toshiba 8GB
AP-UM008GN40CG-T
Toshiba slc
toshiba flash memory 8gb
180D
apacer
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X09-009PK
Abstract: PLC modem europe XH9-009PK X24-019PK XStream-PKG-RRS-232 009P "routing tables"
Text: XStream-PKG-E Ethernet RF Modem XStream Ethernet RF Modem System Setup RF Modem Operation RF Modem Configuration RF Communication Modes Appendices Product Manual v5.x00 For XStream RF Modem Part Numbers X09-001PK…-E… X24-009PK…-E. XH9-001PK…-E.
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X09-001PK.
X24-009PK.
XH9-001PK.
X09-009PK.
X09-019PK.
X24-019PK.
XH9-009PK.
XH9-019PK.
M100110
X09-009PK
PLC modem europe
XH9-009PK
X24-019PK
XStream-PKG-RRS-232
009P
"routing tables"
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MC9SO8QE32
Abstract: XBee-PRO ZB S2B Xbee Pro Series 2 Ember EM357 Ember EM357 SPI register Xbee Pro ZS2010 ZigBee Cluster Library Specification Xbee zb smt pin diagram and of xbee
Text: XBee /XBee-PRO® ZB SMT RF Modules ZigBee RF Modules by Digi International Models: XBEE S2C, PRO S2C Hardware: S2C Firmware: 401x Digi International Inc. 11001 Bren Road East Minnetonka, MN 55343 877 912-3444 or 952 912-3444 http://www.digi.com 90002002_A
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ARM926T
Abstract: ic str 6454 s11 stopping compound motorola 7824 BT OSC26M CNC DRIVES ptc temperature sensor 400c 4*4 matrix keypad 17521 rca SAMSUNG NAND FLASH K9F5608
Text: i.MX21 Applications Processor Reference Manual Document Number: MC9328MX21RM Rev. 3 04/2007 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370
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MC9328MX21RM
CH370
ARM926T
ic str 6454
s11 stopping compound
motorola 7824 BT
OSC26M
CNC DRIVES
ptc temperature sensor 400c
4*4 matrix keypad
17521 rca
SAMSUNG NAND FLASH K9F5608
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XDS510
Abstract: XDS510USB XDS510-USB 2.2X C2000 C6000 XDS510USB PLUS JTAG EMULATOR Spectrum Digital
Text: XDS510 USB JTAG Emulator Set-up Instructions The XDS510 USB contains: XDS510 USB USB Cable System Hardware and Software Requirements These operating platform requirements are necessary to install the Code Composer Studio CCS integrated Development Environment and support the XDS510-USB
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XDS510
XDS510-USB
600MB
640x480)
500MB
XDS510USB
XDS510USB
XDS510-USB
2.2X
C2000
C6000
XDS510USB PLUS JTAG EMULATOR
Spectrum Digital
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MS-026
Abstract: MT55L256L32P MT55L256L36P MT55L256V32P MT55L256V36P MT55L512L18P MT55L512V18P
Text: 8Mb: 512K x 18, 256K x 32/36 PIPELINED ZBT SRAM 8Mb ZBT SRAM MT55L512L18P, MT55L512V18P, MT55L256L32P, MT55L256V32P, MT55L256L36P, MT55L256V36P 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • • • •
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MT55L512L18P,
MT55L512V18P,
MT55L256L32P,
MT55L256V32P,
MT55L256L36P,
MT55L256V36P
100-Pin
119-Pin
165-pin
MT55L512L18P
MS-026
MT55L256L32P
MT55L256L36P
MT55L256V32P
MT55L256V36P
MT55L512V18P
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MT55L256L18P1T-10A
Abstract: MS-026 MT55L128L32P1 MT55L128L36P1 MT55L128V32P1 MT55L128V36P1 MT55L256L18P1 MT55L256L18P1T-10 MT55L256V18P1 84 FBGA thermal
Text: PRELIMINARY 4Mb: 256K x 18, 128K x 32/36 PIPELINED ZBT SRAM 4Mb ZBT SRAM MT55L256L18P1, MT55L256V18P1, MT55L128L32P1, MT55L128V32P1, MT55L128L36P1, MT55L128V36P1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • •
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MT55L256L18P1,
MT55L256V18P1,
MT55L128L32P1,
MT55L128V32P1,
MT55L128L36P1,
MT55L128V36P1
August/7/00
119-pin
165-pin
MT55L256L18P1
MT55L256L18P1T-10A
MS-026
MT55L128L32P1
MT55L128L36P1
MT55L128V32P1
MT55L128V36P1
MT55L256L18P1T-10
MT55L256V18P1
84 FBGA thermal
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A67L7332
Abstract: A67L7336 A67L8316 A67L8318
Text: A67L8316/A67L8318/ A67L7332/A67L7336 Series 256K X 16/18, 128K X 32/36 Preliminary LVTTL, Pipelined DBA SRAM Document Title 256K X 16/18, 128K X 32/36 LVTTL, Pipelined DBA SRAM Revision History Rev. No. 0.0 PRELIMINARY History Issue Date Remark Initial issue
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A67L8316/A67L8318/
A67L7332/A67L7336
100MHz)
A67L7332
A67L7336
A67L8316
A67L8318
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pwr4525
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material Number PWR4525 SURFACE MOUNT WIREWOUND RESISTOR Product Line Compliance Date 1/1/2000 RoHS Compliant YES No. Construction Element subpart 1 LEAD WIRE 2 LEAD WIRE PLATING 3 END CAPS 4 RESISTANCE WIRE 5 EPOXY ENCAPSULANT
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PWR4525
pwr4525
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Untitled
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material Number PWR2615 SURFACE MOUNT WIREWOUND RESISTOR Product Line Compliance Date 1/1/2000 RoHS Compliant YES No. Construction Element subpart 1 LEAD WIRE 2 LEAD WIRE PLATING 3 END CAPS 4 RESISTANCE WIRE 5 EPOXY Headquarters Riverside CA
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PWR2615
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3050b
Abstract: TISP7350H3SL-S Bourns Sip IT 8572
Text: MATERIAL DECLARATION SHEET 3-SIP Package Type Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the component part number e.g. TISP7350H3SL-S
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TISP7350H3SL-S
3050b
TISP7350H3SL-S
Bourns Sip
IT 8572
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QLA2200
Abstract: No abstract text available
Text: COMPUTER SYSTEMS GROUP PRODUCT: TYPE: TITLE: PREVIOUS VERSION: SEVERITY: REMAINING ISSUES: RELEASE NOTICE DATE: July 24, 2000 QLA2200 Software/Driver QLA2200 NETWARE 4/5 DRIVER V5.40S/2.01.14 V5.14N Suggested Change None Identified CORRECTED ISSUES: * Added 2 error cases to Mailbox_ISR to handle loopback
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QLA2200
QLA2200
40S/2
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26.6M
Abstract: CT-26-6M copper chromium CA 5668
Text: MATERIAL DECLARATION SHEET Material Number CT-26-6M Product Line Dials Compliance Date January 1995 RoHS Compliant Yes No. 1 2 3 4 Construction Element subpart External Housing Brake Bushing Gearwheel Housing Headquarters Riverside CA MSL Homogeneous Material
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CT-26-6M
26.6M
CT-26-6M
copper chromium
CA 5668
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DAD 5
Abstract: TO 92 leadframe 3050b TISP4240M3LMFR-S TISP4350H3LM-S
Text: MATERIAL DECLARATION SHEET Package Type DO-92 Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the part number e.g. TISP4350H3LM-S or TISP4240M3LMFR-S.
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DO-92
TISP4350H3LM-S
TISP4240M3LMFR-S.
DAD 5
TO 92 leadframe
3050b
TISP4240M3LMFR-S
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Untitled
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material Number 85L CP Dual Cup Product Line Panel Control Compliance Date September 30, 2005 RoHS Compliant Yes MSL N/A Subpart mass of total wt. (%) 72 Material Mass % of total unit wt. 3.920 25 1.361 5.455 7440-50-08 3 0.163
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MATERIAL DECLARATION inductor
Abstract: PM1008 material declaration MATERIAL DECLARATION SHEET inductor
Text: MATERIAL DECLARATION SHEET Material Number PM1008 Series Product Line Chip Inductor Compliance Date 01-January-2006 RoHS Compliant Yes MSL 2a No. Construction Element subpart Homogeneous Material Material Weight [g] Homogeneous Material Substance 1 Core
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PM1008
01-January-2006
01-November-2006
MATERIAL DECLARATION inductor
material declaration
MATERIAL DECLARATION SHEET inductor
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TAG 8926
Abstract: Lpg 899 SDC 2921 TF 6221 HEN LED display 12V+RELAY+1+C/8 pin ic sdc 3733
Text: MCIMX31 and MCIMX31L Multimedia Applications Processors Reference Manual MCIMX31RM Rev. 1 2/2006 How to Reach Us: USA/Europe/Locations Not Listed: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-521-6274 or 480-768-2130
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MCIMX31
MCIMX31L
MCIMX31RM
IOIS16
IOIS16/WP
MCIMX31L
TAG 8926
Lpg 899
SDC 2921
TF 6221 HEN LED display
12V+RELAY+1+C/8 pin ic sdc 3733
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CRT0603 marking
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material Number Model CRT0603 Product Line Chip Resistors Compliance Date 18-June-2009 RoHS Compliant Yes MSL 1 Construction Element subpart Homogeneou s Material Material weight [g] Homogeneous Material\ Substances Ceramic Substrate
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CRT0603
18-June-2009
CRT0603 marking
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Untitled
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material Number SRU3014 Series Product Line Shielded Power Inductor Compliance Date 01-November-2006 RoHS Compliant No. 1 2 3 Construction Element subpart Core Yes MSL Homogeneous Material Ferrite Ni-Zn Series Solder Bar Solder
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SRU3014
01-November-2006
Sn100%
01-March-2007
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diode marking 226
Abstract: marking 7c fiber glass
Text: MATERIAL DECLARATION SHEET Material # CMF-RD Product Line PTC resistors Date 01/13/2009 Version A/0 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] 0.674 Materials CAS if applicable Average mass [%] Barium
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Untitled
Abstract: No abstract text available
Text: MATERIAL DECLARATION SHEET Material Number SRR6028 Series Product Line SHIELDED SMD POWER INDUCTOR Compliance Date 01-July-2007 RoHS Compliant Yes No. 1 Construction Element subpart CORE MSL Homogeneous Material 1 Material weight [mg] FERRITE CORE 414.1
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SRR6028
01-July-2007
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