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    REFLOW PROFILE FOR LGA COMPONENTS Search Results

    REFLOW PROFILE FOR LGA COMPONENTS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DF2B5M4ASL Toshiba Electronic Devices & Storage Corporation TVS Diode (ESD Protection Diode), Bidirectional, +/-3.6 V, SOD-962 (SL2) Visit Toshiba Electronic Devices & Storage Corporation
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    TK190U65Z Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 650 V, 15 A, 0.19 Ohm@10V, TOLL Visit Toshiba Electronic Devices & Storage Corporation
    TK7R0E08QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 64 A, 0.0070 Ohm@10V, TO-220AB Visit Toshiba Electronic Devices & Storage Corporation
    TCR5RG28A Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 2.8 V, 500 mA, WCSP4F Visit Toshiba Electronic Devices & Storage Corporation

    REFLOW PROFILE FOR LGA COMPONENTS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    pcb warpage in ipc standard

    Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029
    Text: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page Introduction .1


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    PDF AN-1028 AN-1029. pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029

    LGA rework

    Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
    Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules


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    PDF AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework

    IPC-7527

    Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
    Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


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    PDF 101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT

    LGA voiding

    Abstract: NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D
    Text: Freescale Semiconductor Application Note Document Number: AN2920 Rev. 2, 12/2008 Manufacturing with the Land Grid Array Package by Networking & Multimedia Group Freescale Semiconductor, Inc. Austin, TX Freescale has introduced the High Coefficient of Thermal


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    PDF AN2920 LGA voiding NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D

    picor

    Abstract: LGA rework JEDEC Drawing LGA reflow profile FOR LGA COMPONENTS MLCC rework PI2121 LGA Application Notes
    Text: Recommended PCB Design & Surface Mount Guidelines for Picor Corporation’s LGA Packages Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1 Receiving PCB Footprint. . . . . . . . . . . . . . . . . . . . . . Page 1


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    PDF

    AN3281

    Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


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    PDF AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate

    LGA voiding

    Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


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    PDF AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale

    LGA voiding

    Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
    Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print


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    PDF LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325

    reflow profile FOR LGA COMPONENTS

    Abstract: LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion
    Text: Enpirion, Inc. EN53x0D AN103_R0.9 Soldering Module Packages Having Large Asymmetric Pads 1.0 INTRODUCTION Enpirion’s power converter packages utilize module package technology to form Land Grid Array LGA packages. LGA module package technology provides additional


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    PDF EN53x0D reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion

    X-RAY INSPECTION

    Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
    Text: Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc. by Thomas Koschmieder and Michael Leoni Introduction The Land Grid Array LGA is an area array matrix package that uses solder paste as


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    PDF AN2265/D 26mm-0 X-RAY INSPECTION LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance

    Heraeus paste profile

    Abstract: PD922 reflow profile FOR LGA COMPONENTS J-STD-033 J-STD-033A hot air bga IPC-9701 heraeus
    Text: Application Note June 21, 2008 Document No. : AN007-0001, Ver. 1.21 PDF Name: TLynx_Mfgr_Guide.pdf Application Guidelines for Non-Isolated Converters AN07-001: Manufacturing Guidelines for TLynx Series Modules Introduction The TLynxTM series modules are SMT DC/DC nonisolated converters, that feature a pinless interconnect


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    PDF AN007-0001, AN07-001: Heraeus paste profile PD922 reflow profile FOR LGA COMPONENTS J-STD-033 J-STD-033A hot air bga IPC-9701 heraeus

    EN53x0D

    Abstract: AN-101 EN5310 an101 Teflon 25um
    Text: Application Note EN53x0D AN-101 January 2006 Rev 1.2 Power Converter Module Package Process Specification for EN5310, EN5330, and EN5360 Converter Modules Introduction This applications note addresses the following topics: • PCB Design Recommendations: o Pad Layout


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    PDF EN53x0D AN-101 EN5310, EN5330, EN5360 -EN5310 -EN5330 -EN5360 AN-101 EN5310 an101 Teflon 25um

    lga16 land pattern

    Abstract: LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97
    Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. Note: April 2008 Data provided in this document are to be intended as reference for PCB design and


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    PDF TN0018 lga16 land pattern LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97

    IPC-7527

    Abstract: IPC-7525 koki solder paste IPC7527
    Text: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


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    PDF 101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527

    Untitled

    Abstract: No abstract text available
    Text: Thin-Film Low Pass Filter LP0603 Lead-Free LGA Type GENERAL DESCRIPTION APPLICATIONS The LP0603 ITF Integrated Thin Film Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high


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    PDF LP0603 900MHz-5

    Untitled

    Abstract: No abstract text available
    Text: Thin-Film Low Pass Filter LP0603 Lead-Free LGA Type GENERAL DESCRIPTION APPLICATIONS The LP0603 ITF Integrated Thin Film Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high


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    PDF LP0603 900MHz

    2S110

    Abstract: lp0603a1880antr 535056 LP0603
    Text: Thin-Film Low Pass Filter LP0603 Lead-Free LGA Type GENERAL DESCRIPTION APPLICATIONS The LP0603 ITF Integrated Thin Film Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high


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    PDF LP0603 2S110 lp0603a1880antr 535056

    LP0603A0947ANTR

    Abstract: LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR LP0603 thin film filter
    Text: Thin-Film Low Pass Filter LP0603 Lead-Free LGA Type GENERAL DESCRIPTION APPLICATIONS The LP0603 ITF Integrated Thin Film Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high


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    PDF LP0603 900MHz LP0603A0947ANTR LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR thin film filter

    5050 ir led

    Abstract: gps 5350 LP0603A0947ANTR LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR LP0603
    Text: Thin-Film Low Pass Filter LP0603 Lead-Free LGA Type GENERAL DESCRIPTION APPLICATIONS The LP0603 ITF Integrated Thin Film Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high


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    PDF LP0603 900MHz 5050 ir led gps 5350 LP0603A0947ANTR LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR

    LP0603A0947ANTR

    Abstract: LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR LP0603
    Text: Thin-Film Low Pass Filter LP0603 Lead-Free LGA Type GENERAL DESCRIPTION APPLICATIONS The LP0603 ITF Integrated Thin Film Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high


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    PDF LP0603 900MHz LP0603A0947ANTR LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR

    Untitled

    Abstract: No abstract text available
    Text: Thin-Film Low Pass Filter LP0603 Lead-Free LGA Type GENERAL DESCRIPTION APPLICATIONS The LP0603 ITF Integrated Thin Film Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high


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    PDF LP0603 900MHz

    Untitled

    Abstract: No abstract text available
    Text: Thin-Film Low Pass Filter LP0603 Lead-Free LGA Type GENERAL DESCRIPTION APPLICATIONS The LP0603 ITF Integrated Thin Film Lead-Free LGA Low Pass Filter is based on thin-film multilayer technology. The technology provides a miniature part with excellent high


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    PDF LP0603 900MHz

    SiCr

    Abstract: SMD 100 6n cap ceramic pin grid array package wire bond AVX 9151 high current pogo pin 400nF 300V avx 0201 CX-101F CX-2520SB KT21
    Text: IMAGINATION. CREATION. INNOVATION. AVX RF/Microwave Short Form RF Microwave Products Application Guide APPLICATIONS PRODUCTS System Frequency High Directivity Couplers 0402, 0603 Couplers (0603, 0805) 3dB Couplers KNA Filter Low Pass Filter 0805 Low Pass Filter 0603


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    PDF S-RFMSF10M1205-N SiCr SMD 100 6n cap ceramic pin grid array package wire bond AVX 9151 high current pogo pin 400nF 300V avx 0201 CX-101F CX-2520SB KT21

    LP0402N

    Abstract: LP0603 142-0701-841 LP0402N5200ANTR
    Text: Thin-Film Low Pass Filter LP0402N Series Harmonic Lead-Free LGA Termination RFAP TECHNOLOGY APPLICATIONS The LP0402N Series Harmonic Low Pass Filter is based on the proprietary RFAP Thin-Film multilayer technology. The technology provides a miniature part with excellent high


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    PDF LP0402N 0402en LP0603 142-0701-841 LP0402N5200ANTR