REFLOW PROFILE FOR LGA COMPONENTS Search Results
REFLOW PROFILE FOR LGA COMPONENTS Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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DF2B5M4ASL |
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TVS Diode (ESD Protection Diode), Bidirectional, +/-3.6 V, SOD-962 (SL2) | |||
74HC4053FT |
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CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC | |||
TK190U65Z |
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MOSFET, N-ch, 650 V, 15 A, 0.19 Ohm@10V, TOLL | |||
TK7R0E08QM |
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MOSFET, N-ch, 80 V, 64 A, 0.0070 Ohm@10V, TO-220AB | |||
TCR5RG28A |
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LDO Regulator, Fixed Output, 2.8 V, 500 mA, WCSP4F |
REFLOW PROFILE FOR LGA COMPONENTS Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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pcb warpage in ipc standard
Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029
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AN-1028 AN-1029. pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029 | |
LGA rework
Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
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AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework | |
IPC-7527
Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
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101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT | |
LGA voiding
Abstract: NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D
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AN2920 LGA voiding NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D | |
picor
Abstract: LGA rework JEDEC Drawing LGA reflow profile FOR LGA COMPONENTS MLCC rework PI2121 LGA Application Notes
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AN3281
Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
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AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate | |
LGA voiding
Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
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AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale | |
LGA voiding
Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
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LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325 | |
reflow profile FOR LGA COMPONENTS
Abstract: LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion
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EN53x0D reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion | |
X-RAY INSPECTION
Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
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AN2265/D 26mm-0 X-RAY INSPECTION LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance | |
Heraeus paste profile
Abstract: PD922 reflow profile FOR LGA COMPONENTS J-STD-033 J-STD-033A hot air bga IPC-9701 heraeus
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AN007-0001, AN07-001: Heraeus paste profile PD922 reflow profile FOR LGA COMPONENTS J-STD-033 J-STD-033A hot air bga IPC-9701 heraeus | |
EN53x0D
Abstract: AN-101 EN5310 an101 Teflon 25um
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EN53x0D AN-101 EN5310, EN5330, EN5360 -EN5310 -EN5330 -EN5360 AN-101 EN5310 an101 Teflon 25um | |
lga16 land pattern
Abstract: LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97
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TN0018 lga16 land pattern LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97 | |
IPC-7527
Abstract: IPC-7525 koki solder paste IPC7527
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101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527 | |
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Untitled
Abstract: No abstract text available
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LP0603 900MHz-5 | |
Untitled
Abstract: No abstract text available
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LP0603 900MHz | |
2S110
Abstract: lp0603a1880antr 535056 LP0603
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LP0603 2S110 lp0603a1880antr 535056 | |
LP0603A0947ANTR
Abstract: LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR LP0603 thin film filter
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LP0603 900MHz LP0603A0947ANTR LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR thin film filter | |
5050 ir led
Abstract: gps 5350 LP0603A0947ANTR LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR LP0603
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LP0603 900MHz 5050 ir led gps 5350 LP0603A0947ANTR LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR | |
LP0603A0947ANTR
Abstract: LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR LP0603
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LP0603 900MHz LP0603A0947ANTR LP0603A1747ANTR LP0603A1842ANTR LP0603A1880ANTR LP0603A1950ANTR LP0603A2140ANTR LP0603A2442ANTR | |
Untitled
Abstract: No abstract text available
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LP0603 900MHz | |
Untitled
Abstract: No abstract text available
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LP0603 900MHz | |
SiCr
Abstract: SMD 100 6n cap ceramic pin grid array package wire bond AVX 9151 high current pogo pin 400nF 300V avx 0201 CX-101F CX-2520SB KT21
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S-RFMSF10M1205-N SiCr SMD 100 6n cap ceramic pin grid array package wire bond AVX 9151 high current pogo pin 400nF 300V avx 0201 CX-101F CX-2520SB KT21 | |
LP0402N
Abstract: LP0603 142-0701-841 LP0402N5200ANTR
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LP0402N 0402en LP0603 142-0701-841 LP0402N5200ANTR |