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    RECOMMENDED LAND PATTERN FOR SOIC Search Results

    RECOMMENDED LAND PATTERN FOR SOIC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    RECOMMENDED LAND PATTERN FOR SOIC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    footprint WSON

    Abstract: WSON WSON socket S72030-00-000 soic 16 Jedec package outline DSAE003956 land pattern wson
    Text: Recommended Land Pattern for SST’s SOIC and WSON Packages Design Versatility of the Ultra-thin, Small Outline No-lead WSON Package Application Note May 2002 INTRODUCTION SOIC PACKAGE SST introduces an innovative, ultra-thin package for it’s Serial Flash family of devices.


    Original     		PDF SOIC/150 MS-012 08-wson-soic-3 S72030-00-000 footprint WSON WSON WSON socket S72030-00-000 soic 16 Jedec package outline DSAE003956 land pattern wson

    S25FL128* spansion

    Abstract: uson 8 land pattern S25FL128 EDR-7320 S25FL016* spansion soic16 land pattern land pattern for Uson spansion Packing and Packaging Handbook land pattern uson SOA008
    Text: Recommended Land Patterns for Spansion SPI Flash Devices Application Note By: Ted Eiden 1. Abstract The Spansion Serial Peripheral Interface SPI Flash Product Family devices are available in the most popular industry standard packages. These include 8-pin and 16-pin SOIC packages and the very thin 8contact WSON and USON packages.


    Original     		PDF 16-pin S25FL128* spansion uson 8 land pattern S25FL128 EDR-7320 S25FL016* spansion soic16 land pattern land pattern for Uson spansion Packing and Packaging Handbook land pattern uson SOA008

    SI8502-C-IS

    Abstract: SI8513-C-IS Si85xx Full-bridge converter vde 0110 timer Si85 Si850x Si851x SOIC-20 VDE0884
    Text: Si85xx Si85 XX U N ID I R E C TI ON A L A C C URRENT S ENSORS Features     50 kHz to 1 MHz input frequency range  FAULT output to safeguard operation  Large 2 VPP min output at full scale Pin Assignments: See page 24 20-Pin SOIC  High-side or low-side current sensing


    Original     		PDF Si85xx Si85xx 20-Pin SI8502-C-IS SI8513-C-IS Full-bridge converter vde 0110 timer Si85 Si850x Si851x SOIC-20 VDE0884

    RF3809

    Abstract: UMTS transceiver cdma800 DCS1800 GSM900 PCS1900 RF3809PCK-410 RF3809PCK-411 RF3809PCK-412 rogers
    Text: RF3809 RF3809GaAs HBT Pre-Driver Amplifier GaAs HBT PRE-DRIVER AMPLIFIER Package Style: SOIC-8 Features „ High Output Power of 2.0 W P1dB „ High Linearity „ High Power-Added Efficiency „ Thermally-Enhanced Packaging „ Broadband Platform Design Approach, 450 MHz to 2500 MHz


    Original     		PDF RF3809 RF3809GaAs RF3809 high3809 DS090504 UMTS transceiver cdma800 DCS1800 GSM900 PCS1900 RF3809PCK-410 RF3809PCK-411 RF3809PCK-412 rogers

    RF3807

    Abstract: RF3807TR13 DCS1800 GSM900 PCS1900 RF3807PCK-410 RF3807PCK-411 RF3807PCK-412 UMTS2100
    Text: RF3807 RF3807GaAs HBT Pre-Driver Amplifier GaAs HBT PRE-DRIVER AMPLIFIER Package Style: SOIC-8 Features „ Output Power > 0.5 W P1dB „ High Linearity „ High Power-Added Efficiency „ Thermally-Enhanced Packaging „ Broadband Platform Design Approach, 450 MHz to 2700 MHz


    Original     		PDF RF3807 RF3807GaAs RF3807 high3807 DS090504 RF3807TR13 DCS1800 GSM900 PCS1900 RF3807PCK-410 RF3807PCK-411 RF3807PCK-412 UMTS2100

    2100 106

    Abstract: nelco
    Text: AH11 High Dynamic Range Dual Amplifier Applications • Mobile Infrastructure  Defense / Homeland Security  Fixed Wireless SOIC-8 package Product Features Functional Block Diagram  150 – 3000 MHz  +44 dBm OIP3 1900 MHz, balanced circuit  Single-ended performance:


    Original     		PDF

    LPC2468 reflow solder profile

    Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,


    Original     		PDF AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross

    C1316C

    Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
    Text: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface


    Original     		PDF IPC-SM-782. SC-70 10/02A C1316C LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10

    PCB layout guidelines for NXP MCUs in BGA packages

    Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,


    Original     		PDF AN10778 LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, PCB layout guidelines for NXP MCUs in BGA packages LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern

    qfn 32 land pattern

    Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782

    SOD-323 land pattern

    Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
    Text: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. SoD-323 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern

    200123K

    Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These


    Original     		PDF IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern

    tssop 16 exposed pad stencil

    Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 tssop 16 exposed pad stencil C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern

    IPC-7527

    Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
    Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2


    Original     		PDF

    FC1410

    Abstract: jack p2 3.5 mm C2633
    Text: RF3807 RF3807GaAs HBT Pre-Driver Amplifier GaAs HBT PRE-DRIVER AMPLIFIER RoHS Compliant & Pb-Free Product Package Style: SOIC-8 Features „ Output Power>0.5W P1dB „ High Linearity „ High Power-Added Efficiency „ Thermally-Enhanced Packaging „ VREF 1 NC


    Original     		PDF RF3807GaAs RF3807 450MHz 2500MHz RF3807 DS050912 RF3807415 2140MHz FC1410 jack p2 3.5 mm C2633

    Untitled

    Abstract: No abstract text available
    Text: SPA2118Z SPA2118Z 850MHz 1 Watt Power Amplifier with Active Bias 850MHz 1 WATT POWER AMPLIFIER WITH ACTIVE BIAS Package: Exposed Pad SOIC-8 Product Description Features RFMD’s SPA2118Z is a high efficiency GaAs Heterojunction Bipolar Transistor HBT amplifier housed in a low-cost surface-mountable plastic


    Original     		PDF SPA2118Z 850MHz SPA2118Z MCR03 ECB-101161 DS121024

    Untitled

    Abstract: No abstract text available
    Text: SPA2118Z SPA2118Z 850MHz 1 Watt Power Amplifier with Active Bias 850MHz 1 WATT POWER AMPLIFIER WITH ACTIVE BIAS Package: Exposed Pad SOIC-8 Product Description Features RFMD’s SPA2118Z is a high efficiency GaAs Heterojunction Bipolar Transistor HBT amplifier housed in a low-cost surface-mountable plastic


    Original     		PDF SPA2118Z 850MHz SPA2118Z MCR03 ECB-101161 DS110720

    GSM850MHz

    Abstract: UMTS transceiver
    Text: RF3809 RF3809GaAs HBT Pre-Driver Amplifier GaAs HBT PRE-DRIVER AMPLIFIER RoHS Compliant & Pb-Free Product Package Style: SOIC-8 Features „ High Output Power of 2.0W P1dB „ High Linearity „ High Power-Added Efficiency „ Thermally-Enhanced Packaging „ VREF


    Original     		PDF RF3809GaAs RF3809 450MHz 2500MHz RF3809 DS060607 RF3809415 GSM850MHz UMTS transceiver

    Untitled

    Abstract: No abstract text available
    Text: SPA1118Z SPA1118Z 850MHz 1Watt Power Amplifier with Active Bias 850MHz 1WATT POWER AMPLIFIER WITH ACTIVE BIAS NOT FOR NEW DESIGNS Package: Exposed Pad SOIC-8 Product Description Features RFMD’s SPA1118Z is a high efficiency GaAs Heterojunction Bipolar Transistor HBT amplifier housed in a low-cost surface-mountable plastic


    Original     		PDF SPA1118Z 850MHz 850MHz SPA1118Z MCH18 100nH, 1008HQ

    Untitled

    Abstract: No abstract text available
    Text: SPA1118Z SPA1118Z 850MHz 1Watt Power Amplifier with Active Bias 850MHz 1WATT POWER AMPLIFIER WITH ACTIVE BIAS NOT FOR NEW DESIGNS Package: Exposed Pad SOIC-8 Features Optimum Technology Matching Applied • VCC InGaP HBT N/C VBIAS SiGe BiCMOS Active Bias


    Original     		PDF SPA1118Z 850MHz SPA1118Z 106K020R MCH18

    1watt wireless amplifier schematic

    Abstract: No abstract text available
    Text: SPA1118Z SPA1118Z 850MHz 1Watt Power Amplifier with Active Bias 850MHz 1WATT POWER AMPLIFIER WITH ACTIVE BIAS Package: Exposed Pad SOIC-8 Product Description Features RFMD’s SPA1118Z is a high efficiency GaAs Heterojunction Bipolar Transistor HBT amplifier housed in a low-cost surface-mountable plastic


    Original     		PDF SPA1118Z 850MHz SPA1118Z 100nH, MCH18 106K020R 1watt wireless amplifier schematic

    Untitled

    Abstract: No abstract text available
    Text: SPA1118Z SPA1118Z 850MHz 1Watt Power Amplifier with Active Bias 850MHz 1WATT POWER AMPLIFIER WITH ACTIVE BIAS NOT FOR NEW DESIGNS Package: Exposed Pad SOIC-8 Product Description Features Optimum Technology Matching Applied GaAs HBT VCC GaAs MESFET N/C InGaP HBT


    Original     		PDF SPA1118Z 850MHz SPA1118Z DS111217 ECB-101161

    si87xx

    Abstract: LGA8 si8710 SI8710CD-B-IS si8711 GW marking code diode K 2611 MOSFET VOLTAGE RATING HCPL-261X ACPL-W611 Pin-compatible, drop-in upgrades for popular
    Text: Si87xx 5 K V L E D E M U L A T O R I N P U T , O P E N C O LL EC TO R OUTPUT ISOLATORS Features  Pin-compatible, drop-in upgrades for  popular high-speed digital  optocouplers   Performance and reliability  advantages vs. optocouplers Resistant to temperature, age and 


    Original     		PDF Si87xx si87xx LGA8 si8710 SI8710CD-B-IS si8711 GW marking code diode K 2611 MOSFET VOLTAGE RATING HCPL-261X ACPL-W611 Pin-compatible, drop-in upgrades for popular

    CPC7583

    Abstract: GR-1089-CORE
    Text: CPC7583 Line Card Access Switch Features Description • Small 20-pin or 28-pin SOIC or 28-pin DFN • DFN version provides 65% PCB area reduction over 4th generation EMRs • Monolithic IC reliability • Low, matched, RON • Eliminates the need for zero-cross switching


    Original     		PDF CPC7583 20-pin 28-pin CPC7583 10-pole DS-CPC7583 GR-1089-CORE