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    Coolgear Inc CM-100404RDBSTK

    7Ft Cat5E UTP Ethernet Network N
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    DigiKey CM-100404RDBSTK 766 1
    • 1 $3.72
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    Coolgear Inc CM-100416RDBSTK

    0.5Ft Cat5E UTP Ethernet Network
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    DigiKey CM-100416RDBSTK 715 1
    • 1 $1.24
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    Coolgear Inc CM-100402RDBSTK

    3Ft Cat5E UTP Ethernet Network N
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    DigiKey CM-100402RDBSTK 681 1
    • 1 $2.32
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    Coolgear Inc CM-100504RDBSTK

    5Ft Cat5E UTP Ethernet Network B
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    DigiKey CM-100504RDBSTK 464 1
    • 1 $3.2
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    Coolgear Inc CM-100807RDBSTK

    15Ft Cat6 Shielded (SSTP) Ethern
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CM-100807RDBSTK 262 1
    • 1 $22.56
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    RDBS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint for reflow soldering of RDBS27P package 2 SOT878-1 1 27 1 2.54 26 hole diameter min. 0.92 2 ∅ 0.08 M Dimensions in mm SOT878-1_fr PDF sot878-1_fr Koninklijke Philips Electronics N.V. 2006. All rights reserved.


    Original     		PDF RDBS27P OT878-1 OT878-1 sot878-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads non-concave SOT462-2 Dh x D Eh view B: mounting base side A2 d B j E Q A L c 1 e2 13 e1 Z bp e L1 w M 5 v M 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF RDBS13P: OT462-2

    sot462

    Abstract: No abstract text available
    Text: PDF: 1999 Dec 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e v M L1 w M bp 5 10 mm scale


    Original     		PDF RDBS13P: OT462-1 OT462-1 sot462

    RDBS17P

    Abstract: sot668
    Text: PDF: 2001 Jan 05 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL reverse bent power package; 17 leads (row spacing 2.54 mm) SOT668-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A Q L c 17 1 e1 Z w M bp e L1


    Original     		PDF RDBS17P: OT668-2 RDBS17P sot668

    RDBS17P

    Abstract: sot577
    Text: PDF: 2001 Jan 05 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads row spacing 2.54 mm SOT577-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 e2 17 e1 Z w M bp e c v M 5 Q L1 10 mm


    Original     		PDF RDBS17P: OT577-2 RDBS17P sot577

    Untitled

    Abstract: No abstract text available
    Text: Package outline RDBS23P: plastic rectangular-DIL-bent-SIL reverse bent power package; 23 leads (row spacing 2.54 mm) SOT889-1 non-concave D Dh x Eh view B: mounting base side d A2 β A5 A4 B j E E1 A L 1 c 23 e2 Q e1 Z w M bp e v M L1 5 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF RDBS23P: OT889-1

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E Q A L c 1 e2 13 e1 Z e L1 w M bp 5 v M 10 mm scale


    Original     		PDF RDBS13P: OT462-2

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions


    Original     		PDF RDBS13P: OT528-2

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e v M L1 w M bp 5 10 mm scale


    Original     		PDF RDBS13P: OT462-1

    SOT889-1

    Abstract: RDBS23P sot889
    Text: Package outline Philips Semiconductors RDBS23P: plastic rectangular-DIL-bent-SIL reverse bent power package; 23 leads (row spacing 2.54 mm) SOT889-1 non-concave D Dh x Eh view B: mounting base side d A2 β A5 A4 B j E E1 A L 1 c 23 e2 Q e1 Z w M bp e v M


    Original     		PDF RDBS23P: OT889-1 SOT889-1 RDBS23P sot889

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2000 Mar 16 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e v M L1 w M bp 5 10 mm scale


    Original     		PDF RDBS13P: OT462-1

    SOT462-2

    Abstract: sot462
    Text: PDF: 2000 Oct 19 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL reverse bent power package; 13 leads SOT462-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E Q A L c 1 e2 13 e1 Z e L1 w M bp 5 v M 10 mm scale


    Original     		PDF RDBS13P: OT462-2 SOT462-2 sot462

    LC7074M

    Abstract: DIP18 LA2230 LC7074
    Text: Ordering number:ENN4789 CMOS IC LC7074, 7074M Synchronous Error Correction IC for RDS Applications Overview Package Dimensions The LC7074 and the LC7074M are ICs for the RDS radio data system implemented by the EBU (European Broadcasting Union) and the RDBS (radio broadcast data system) implemented by the NRSC (National Radio System


    Original     		PDF ENN4789 LC7074, 7074M LC7074 LC7074M LA2230 LC7074/M DIP18

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 Q c 13 1 e1 Z e v M w M bp 5 L1 10 mm scale DIMENSIONS mm are the original dimensions


    Original     		PDF RDBS13P: OT528-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 Q c 13 1 e1 Z e v M w M bp 5 L1 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A2


    Original     		PDF RDBS13P: OT528-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline RDBS17P: plastic rectangular-DIL-bent-SIL reverse bent power package; 17 leads (row spacing 2.54 mm) non-concave SOT668-2 Dh x D Eh view B: mounting base side A2 d B j E A Q L c 17 1 e1 Z w M bp e L1 5 e2 v M 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF RDBS17P: OT668-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A2


    Original     		PDF RDBS13P: OT528-2

    RDBS17P

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads row spacing 2.54 mm SOT577-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L 1 e1 Z w M bp e c e2 17 v M 5 Q L1 10 mm


    Original     		PDF RDBS17P: OT577-2 RDBS17P

    RDBS17P

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL reverse bent power package; 17 leads (row spacing 2.54 mm) SOT668-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A Q L c 17 1 e1 Z w M bp e L1


    Original     		PDF RDBS17P: OT668-2 RDBS17P

    RDBS27P

    Abstract: SOT-878 sot878
    Text: Package outline Philips Semiconductors RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT878-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm


    Original     		PDF RDBS27P: OT878-1 RDBS27P SOT-878 sot878

    Untitled

    Abstract: No abstract text available
    Text: Package outline RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT920-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF RDBS27P: OT920-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT878-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A 1 L 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm scale Dimensions (mm are the original dimensions)


    Original     		PDF RDBS27P: OT878-2 sot878-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads row spacing 2.54 mm SOT577-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L 1 e1 Z w M bp e c e2 17 v M 5 Q L1 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF RDBS17P: OT577-2

    SOT577-1

    Abstract: RDBS17P sot577
    Text: PDF: 2000 Mar 16 Philips Semiconductors Package outline RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads row pitch 2.54 mm SOT577-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 e2 17 e1 Z w M bp e Q c v M L1 5 10 mm


    Original     		PDF RDBS17P: OT577-1 SOT577-1 RDBS17P sot577