RC03A
Abstract: No abstract text available
Text: 3 Lead Molded TO-226 NS Package Number RC03A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
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O-226
RC03A
RC03A
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TO-226
Abstract: Transistor to 226 TO226 diode 226 TRANSISTOR Outlines transistor outline package 3 RC03A RC03B RC03C RC03D
Text: Transistor Outline TO-226 3 Lead Molded TO-226 NS Package Number RC03A 1999 National Semiconductor Corporation MS101174 www.national.com Transistor Outline (TO-226) May 1999 3 Lead Molded TO-226 NS Package Number RC03B 3 Lead Molded TO-226 NS Package Number RC03C
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O-226)
O-226
RC03A
MS101174
RC03B
RC03C
TO-226
Transistor to 226
TO226
diode 226
TRANSISTOR Outlines
transistor outline package 3
RC03A
RC03B
RC03C
RC03D
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SmD TRANSISTOR a42
Abstract: TRANSISTOR BC 136 TRANSISTOR BC 157 transistor BC 945 TRANSISTOR BC 187 SNA10A TRANSISTOR BC 413 MO-220-WGGD-2 pdf on BC 187 TRANSISTOR MO-220-WKKD-2
Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages
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LM607
Abstract: F08b f08b103 F08B103A DAC1230 LM11A ZENER variable frequency drive block diagram allen bradley LM369N LM369DRC g20ppm
Text: LM169 LM369 Precision Voltage Reference General Description Features The LM169 LM369 are precision monolithic temperaturecompensated voltage references They are based on a buried zener reference as pioneered in the LM199 references but do not require any heater as they rely on special temperature-compensation techniques Patent Pending The
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LM169
LM369
LM199
LM607
F08b
f08b103
F08B103A
DAC1230
LM11A ZENER
variable frequency drive block diagram allen bradley
LM369N
LM369DRC
g20ppm
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vjp44a
Abstract: MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd
Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages
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MS011798
vjp44a
MO-16B-AB
TA11B
TF11B
cu50
ad 153 transistor
transistor bd 905
transistor BC 185
mkt 344
MS-026-bcd
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f08b103
Abstract: LM607 LM369CN LM11A ZENER f08b103a g2018 lm369b
Text: LM169,LM369 LM169 LM369 Precision Voltage Reference Literature Number: SNVS779A LM169 LM369 Precision Voltage Reference General Description Features The LM169 LM369 are precision monolithic temperaturecompensated voltage references They are based on a buried zener reference as pioneered in the LM199 references
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LM169
LM369
LM369
SNVS779A
f08b103
LM607
LM369CN
LM11A ZENER
f08b103a
g2018
lm369b
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iso 1043-1
Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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MS011809-4
MS011809-1
MS011809-5
MS011809-2
MS011809-6
MS011809-3
MS011809-7
MS011809
iso 1043-1
DIN 6120
iso 1043-1 polypropylene
j1344
sae j1344
W28B
D1972
DIN6120
d24j
TA11A
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iso 1043-1
Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container
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MS011809-4
MS011809-1
MS011809-5
MS011809-2
MS011809-6
MS011809-3
MS011809-7
MS011809
iso 1043-1
DIN 6120
sae j1344
j1344
w28c
iso 1043-1 polypropylene
bga Shipping Trays
MEC34
BGA OUTLINE DRAWING
TSOP package tray
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T03A
Abstract: TO-202 transistor mkt 344 Cu50 TRANSISTOR BC 136 MTL 728 MS-026-bcd M03A BD 669 V84A
Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages
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