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Abstract: No abstract text available
Text: resistors R X A isolated resistor networks EU features • • • • dimensions and construction Q20 Dimensions inches (mm) L W p .193 .236 .025 (4.90) (5.99) (0.635) .341 .236 .025 (8.66) (5.99) (0.635) Q24 .341 (8.66) .236 (5.99) .025 (0.635) Q28 .39 (9.9)
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100k3
510K3
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RIA Q20
Abstract: No abstract text available
Text: resistors R X A isolated resistor networks EU features • • • • dimensions and construction Dimensions inches (mm) L W p .193 .236 .025 (4.90) (5.99) (0.635) .341 .236 .025 (8.66) (5.99) (0.635) Size Code Q16 L Bonding Wire Q20 Q24 .341 (8.66) .236
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rba q16
Abstract: 12w sot-23 MIL-R-55342 sot-23 12w rba q20
Text: bussed resistor networks KOA’s thin film termination networks provide the ideal solution for demanding high speed/high frequency data applications by offering high performance while reducing cost and saving space. Compared to thick film networks, these thin film resistors provide reliability and stability
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pull10
MIL-R-55342
MIL-STD-202
rba q16
12w sot-23
sot-23 12w
rba q20
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rba q16
Abstract: rba q20 sot 23 W16 rba sot 23 W16 sot 23
Text: bussed resistor networks KOA’s thin film termination networks provide the ideal solution for demanding high speed/high frequency data applications by offering high performance while reducing cost and saving space. Compared to thick film networks, these thin film resistors provide reliability and stability
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MIL-R-55342
MIL-STD-202
rba q16
rba q20
sot 23 W16
rba sot 23
W16 sot 23
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Untitled
Abstract: No abstract text available
Text: R X A resistors isolated resistor networks EU features • • • • Thin film on silicon Electrical and mechanical stability High integration (up to 12 terminating lines per package) Products with lead-free terminations meet EU RoHS and China RoHS requirements
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W16 sot 23
Abstract: rza series 51 ria 40 rba sot 23 sot 23 W16 Q-16
Text: R X A resistors isolated resistor networks features • • • • Thin film on silicon Electrical and mechanical stability High integration (up to 12 terminating lines per package) Products with lead-free terminations meet RoHS requirements applications
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RIA Q16
Abstract: No abstract text available
Text: R X A resistors isolated resistor networks features • • • • Thin film on silicon Electrical and mechanical stability High integration (up to 12 terminating lines per package) Products with lead-free terminations meet RoHS requirements applications
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rba q16
Abstract: rza series
Text: resistors R X A isolated resistor networks EU features • • • • Thin film on silicon Electrical and mechanical stability High integration Products with lead-free terminations meet EU RoHS and China RoHS requirements applications • Series termination
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RIA Q16
Abstract: RIA N08
Text: R X A resistors isolated resistor networks features • Thin film on silicon • Electrical and mechanical stability • High integration (up to 12 terminating lines per package) applications • Series termination • Pull-up/pull-down • Current limiting
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Abstract: No abstract text available
Text: R X A resistors isolated resistor networks features • Thin film on silicon • Electrical and mechanical stability • High integration (up to 12 terminating lines per package) applications • Series termination • Pull-up/pull-down • Current limiting
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rza series
Abstract: appendix T16 KOA A-1002B RIA Q16
Text: 1733 Reader's Spreads pg1-203:document 1/27/09 4:07 PM Page 80 R X A resistors isolated resistor networks EU features • • • • Thin film on silicon Electrical and mechanical stability High integration Products with lead-free terminations meet EU RoHS
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pg1-203
rza series
appendix T16 KOA
A-1002B
RIA Q16
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Untitled
Abstract: No abstract text available
Text: R X A resistors isolated resistor networks features • Thin film on silicon • Electrical and mechanical stability • High integration (up to 12 terminating lines per package) applications • Series termination • Pull-up/pull-down • Current limiting
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rnx Q24
Abstract: No abstract text available
Text: RB X , RD(X), RT(X), RNX resistors integrated passive components EU features • Thin film (metal film) resistor array on silicon wafer • Excellent resistance matching, TCR tracking and stabilities • Custom circuits are available with flexible layout (Different
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OT-23
C/-55Â
rnx Q24
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Abstract: No abstract text available
Text: NETWORKS KOA´S INTEGRATED PASSIVE COMPONENTS 3 THIN FILM ON SILICON TFOS KPC STRUCTURE 2 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 4 IDENTIFICATION Specifications given herein may be changed at any time without prior notice.
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D-25578
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Abstract: No abstract text available
Text: RB X , RD(X), RT(X), RNX resistors integrated passive components EU features • Thin film (metal film) resistor array on silicon wafer • Excellent resistance matching, TCR tracking and stabilities • Custom circuits are available with flexible layout (Different
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OT-23
C/-55Â
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DNA 1002
Abstract: RNX W16 marking s14 sot23 KPC T16 DNA MARKING CODE KOA KPC T16 Packaging marking code 8 lead soic-n package analog devices MARKING W16 SOT23 CODE DIODE
Text: NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS)
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D-25578
DNA 1002
RNX W16
marking s14 sot23
KPC T16
DNA MARKING CODE
KOA KPC T16 Packaging
marking code 8 lead soic-n package analog devices
MARKING W16 SOT23
CODE DIODE
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rnx w16
Abstract: 471j CAPACITOR w16 sot23 511j CAPACITOR KPC T16 12w SOT23-3 appendix T16 KOA KPC appendix KOA KPC T16
Text: 抵抗器 Resistors R/C NETWORKS KPC 表面実装形薄膜抵抗/コンデンサネットワーク KOA’s Integrated Passive Components •構造図 Construction ② ① ③ ① シリコンウェハ Si wafer ② ボンディングワイヤ Bonding wire
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SOICQSOPTSSOPSOT23
30min.
rnx w16
471j CAPACITOR
w16 sot23
511j CAPACITOR
KPC T16
12w SOT23-3
appendix T16 KOA KPC
appendix KOA KPC T16
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DNA 1002
Abstract: rnx w16 dn5 marking packaging resistor MARKING W16 SOT23 rnx Q24 DN6 marking diode
Text: NETWORKS TECHNOLOGY OF TOMORROW RESISTORS / CAPACITORS / DIODES 3 2 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC STRUCTURE 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 NETWORKS (PASSIVE COMPONENTS)
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Fiel70
D-25578
DNA 1002
rnx w16
dn5 marking
packaging resistor
MARKING W16 SOT23
rnx Q24
DN6 marking diode
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TE-5001
Abstract: MARKING W16 SOT23 HBM W20 rnx w16 DNA 1002 TVC 2 HB IEEE resistor color code RDA Q20 W16 sot 23 acd marking code
Text: NETWORKS Resistors / capacitors / diodes 3 THIN FILM ON SILICON TFOS INTEGRATED PASSIVE COMPONENTS KPC 2 1 STRUCTURE 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold resin Gold wire bonding 6 5 4 IDENTIFICATION TYPE COATING COLOR MARKING
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OT-23
D-25578
TE-5001
MARKING W16 SOT23
HBM W20
rnx w16
DNA 1002
TVC 2 HB
IEEE resistor color code
RDA Q20
W16 sot 23
acd marking code
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Untitled
Abstract: No abstract text available
Text: NETWORKS KPC EU RoHS 表面実装形薄膜抵抗ネットワークシリーズ KOA’s Integrated Passive Components •構造図 Construction ② ① ③ ① シリコンウェハ Si wafer ② ボンディングワイヤ Bonding wire ③ ダイパッド Die pad
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rnx Q24
Abstract: No abstract text available
Text: NETWORKS KPC EU RoHS 表面実装形薄膜抵抗ネットワークシリーズ KOA’s Integrated Passive Components •構造図 Construction ② ① ③ ① シリコンウェハ Si wafer ② ボンディングワイヤ Bonding wire ③ ダイパッド Die pad
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rnx Q24
Abstract: No abstract text available
Text: NETWORKS KPC EU RoHS 表面実装形薄膜抵抗ネットワークシリーズ KOA’s Integrated Passive Components •構造図 Construction ② ① ③ ① シリコンウェハ Si wafer ② ボンディングワイヤ Bonding wire ③ ダイパッド Die pad
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MD334
Abstract: quanta quanta computer hannstar quanta BL HSD150PK12 diode B8 ac2 cdi 100u 27p Z0301 470P-0402
Text: 5 D 4 Model REV ZW1L MB 3A 3 2 1 MODEL CHANGE LIST FIRST RELEASED. 3B Reference ECN E200305-3099 3C Reference ECN E200306-2080 ZW1L Page C B F ro m 1 3A 2 3A 3 3A 4 3A 5 3A 6 3A 7 3A 8 3A 9 3A 10 3A 11 3A 12 3A 13 3A 14 3A 15 3A 16 3A 17 3A 18 3A 19 3A 20
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E200305-3099
E200306-2080
31ZW1MB0
H-R176X102D094X47PT
H-R176X102DO94X47PT
H-R241X165D094X47PT
H-R241X165DO94X47PT
PAD-RE294X88
PAD-RE294X88
HOLEC323D165P2
MD334
quanta
quanta computer
hannstar
quanta BL
HSD150PK12
diode B8
ac2 cdi 100u 27p
Z0301
470P-0402
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rnx w16
Abstract: No abstract text available
Text: KOA THIN FILM KOA's Integrated Passive Components SPEER ELECTRONICS, INC. General Description & Background Information These thin film passive components are designed for EMI/RFI filtering and impedance matching applications. The integrated passive components are produced using a silicon based technology that
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504b0A7
300mm
350mm
CZl16
150mm
300mm/min
rnx w16
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