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    J-STD-020D

    Abstract: No abstract text available
    Text: Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-Y2C-A0L1M2V0B-3T-AM Lead Pb Free Product - RoHS Compliant Feature ‧ ‧ ‧ ‧ ‧ ‧ ‧ ‧ RoHS compliant. Chip LED package. Colorless clear resin Wide viewing angle 140o. Brightness:11.2 to 28.0 mcd at 5 mA.


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    17-21-Y2C-A0L1M2V0B-3T-AM AEC-Q101. DSE-0002823 J-STD-020D PDF

    17-21SYGC-S530

    Abstract: 17-21SYGC
    Text: EVERLIGHT ELECTRONICS CO.,LTD. DATA SHEET PART NO. DATE : 17-21SYGC/S530-E2/TR8 : 2005.08.17 . SZIE DEPARTMENT: REVISION : 2 RECEIVED •MASS PRODUCTION □ PRELIMINARY □ CUSTOMER DESIGN DEVICE NUMBER : SZ DSE-171-024 PAGE : 9 CUSTOMER DESIGNER Meng Yali


    Original
    17-21SYGC/S530-E2/TR8 DSE-171-024 17-21SYGC/S530-XX/TR8 17-Aug-2005 17-21SYGC-S530 17-21SYGC PDF

    Untitled

    Abstract: No abstract text available
    Text: EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet 0805 Package Chip LEDs 17-21SYGC/S530-XX/TR8 Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process.


    Original
    17-21SYGC/S530-XX/TR8 DSE-171-024 17-Aug-2005 PDF

    Untitled

    Abstract: No abstract text available
    Text: O P T O E L E C T R O N IC S lighting:theway 0805 SMD TYPE LED VAOL-S8GT4 Features • Fit automatic placement equipment. • Fit Compatible with infrared and vapor phase reflow solder process. • Pb-free. • RoHS compliant. Descriptions • • • •


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    po111

    Abstract: No abstract text available
    Text: O PTO ELECTR O N ICS lighting:theway 0805 SMD TYPE LED VAOL-S8GT4 Features • Fit automatic placement equipment. • Fit Compatible with infrared and vapor phase reflow solder process. • Pb-free. • RoHS compliant. Descriptions • • • • • For higher packing density .


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    92ub9 po111 PDF

    Untitled

    Abstract: No abstract text available
    Text: 0805 SMD TYPE LED O PTO ELECTRO N ICS lightingrtheway VAOL-S8GT4 Features • Fit automatic placement equipment. • Fit Compatible with infrared and vapor phase reflow solder process. • Pb-free. • RoHS compliant. Descriptions • • • • • For higher packing density .


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