J-STD-020D
Abstract: No abstract text available
Text: Technical Data Sheet 0805 Package Chip LED Preliminary 17-21-Y2C-A0L1M2V0B-3T-AM Lead Pb Free Product - RoHS Compliant Feature ‧ ‧ ‧ ‧ ‧ ‧ ‧ ‧ RoHS compliant. Chip LED package. Colorless clear resin Wide viewing angle 140o. Brightness:11.2 to 28.0 mcd at 5 mA.
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17-21-Y2C-A0L1M2V0B-3T-AM
AEC-Q101.
DSE-0002823
J-STD-020D
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17-21SYGC-S530
Abstract: 17-21SYGC
Text: EVERLIGHT ELECTRONICS CO.,LTD. DATA SHEET PART NO. DATE : 17-21SYGC/S530-E2/TR8 : 2005.08.17 . SZIE DEPARTMENT: REVISION : 2 RECEIVED •MASS PRODUCTION □ PRELIMINARY □ CUSTOMER DESIGN DEVICE NUMBER : SZ DSE-171-024 PAGE : 9 CUSTOMER DESIGNER Meng Yali
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17-21SYGC/S530-E2/TR8
DSE-171-024
17-21SYGC/S530-XX/TR8
17-Aug-2005
17-21SYGC-S530
17-21SYGC
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Untitled
Abstract: No abstract text available
Text: EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet 0805 Package Chip LEDs 17-21SYGC/S530-XX/TR8 Features ․Package in 8mm tape on 7〞diameter reel. ․Compatible with automatic placement equipment. ․Compatible with infrared and vapor phase reflow solder process.
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17-21SYGC/S530-XX/TR8
DSE-171-024
17-Aug-2005
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Untitled
Abstract: No abstract text available
Text: O P T O E L E C T R O N IC S lighting:theway 0805 SMD TYPE LED VAOL-S8GT4 Features • Fit automatic placement equipment. • Fit Compatible with infrared and vapor phase reflow solder process. • Pb-free. • RoHS compliant. Descriptions • • • •
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po111
Abstract: No abstract text available
Text: O PTO ELECTR O N ICS lighting:theway 0805 SMD TYPE LED VAOL-S8GT4 Features • Fit automatic placement equipment. • Fit Compatible with infrared and vapor phase reflow solder process. • Pb-free. • RoHS compliant. Descriptions • • • • • For higher packing density .
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92ub9
po111
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PDF
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Untitled
Abstract: No abstract text available
Text: 0805 SMD TYPE LED O PTO ELECTRO N ICS lightingrtheway VAOL-S8GT4 Features • Fit automatic placement equipment. • Fit Compatible with infrared and vapor phase reflow solder process. • Pb-free. • RoHS compliant. Descriptions • • • • • For higher packing density .
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