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    QUAD FLAT J-LEADED PACKAGE Search Results

    QUAD FLAT J-LEADED PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    NBSG53AMNG Rochester Electronics LLC 53 SERIES, LOW SKEW CLOCK DRIVER, 1 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), QCC16, 3 X 3 MM, LEAD FREE, QFN-16 Visit Rochester Electronics LLC Buy
    EL9112ILZ Renesas Electronics Corporation Triple Differential Receiver/Equalizer, QFN, /Tube Visit Renesas Electronics Corporation
    ISL59445IRZ Renesas Electronics Corporation 1GHz Triple Multiplexing Amplifiers, QFN, /Tube Visit Renesas Electronics Corporation
    ISL99125BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation
    ISL99135BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation

    QUAD FLAT J-LEADED PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN CERAMIC To Top / Package Lineup / Package Index QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50 mil Package width x package length 650 × 650 mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01


    Original     		PDF QFJ-44C-C01 44-pin QFJ-44C-C01) J44001SC-4-2

    QFJ-32C-C01

    Abstract: No abstract text available
    Text: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC QFJ-32C-C01 32-pin ceramic QFJ Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape J bend Sealing method Cerdip QFJ-32C-C01 32-pin ceramic QFJ (QFJ-32C-C01)


    Original     		PDF QFJ-32C-C01 32-pin QFJ-32C-C01) J32001SC-3-2 QFJ-32C-C01

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 32 PIN CERAMIC To Top / Package Lineup / Package Index QFJ-32C-C01 32-pin ceramic QFJ Lead pitch 50 mil Package width x package length 450 × 550 mil Lead shape J bend Sealing method Cerdip QFJ-32C-C01


    Original     		PDF QFJ-32C-C01 32-pin QFJ-32C-C01) J32001 J32001SC-3-2

    QFJ-44C-C01

    Abstract: No abstract text available
    Text: QUAD FLAT J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50 mil Package width x package length 650 × 650 mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01)


    Original     		PDF QFJ-44C-C01 44-pin QFJ-44C-C01) J44001SC-4-2 QFJ-44C-C01

    quad flat j-leaded package

    Abstract: QFJ-44C-C01
    Text: QUAD FLAT J-LEADED PACKAGE 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50mil Package width x package length 650 × 650mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01) 17.53±0.13SQ (.690±.005) +0.25


    Original     		PDF QFJ-44C-C01 50mil 650mil 44-pin QFJ-44C-C01) J44001SC-4-2 quad flat j-leaded package QFJ-44C-C01

    SM84PG-ACTEL

    Abstract: A1240XL SM-10 SM68P-ACTEL SM160PQ-ACTEL SM132CQ-ACTEL A42MX36 1200XL SM176TQ-ACTEL A1010DXV
    Text: Silicon Sculptor - Adapter Module Selector Guide Page 1 of 3 BACK Adapter Module Selector Guide Package Types: BG - Plastic Ball Grid Array CQ - Ceramic Quad Flat Pack PG - Ceramic Pin Grid Array PL - Plastic J-Leaded Chip Carrier Device Type A1010B A1010B


    Original     		PDF A1010B A1010DXV A1020B SM84PG-ACTEL A1240XL SM-10 SM68P-ACTEL SM160PQ-ACTEL SM132CQ-ACTEL A42MX36 1200XL SM176TQ-ACTEL

    QFJ-32C-C01

    Abstract: No abstract text available
    Text: QUAD FLAT J-LEADED PACKAGE 32 PIN CERAMIC QFJ-32C-C01 Lead pitch 50mil Package width x package length 450 × 550mil Lead shape J bend Sealing method Cerdip 32-pin ceramic QFJ QFJ-32C-C01 32-pin ceramic QFJ (QFJ-32C-C01) 3.44±0.35 (.135±.014) 2.11(.083)REF


    Original     		PDF QFJ-32C-C01 50mil 550mil 32-pin QFJ-32C-C01) J32001SC-3-2 QFJ-32C-C01

    52887

    Abstract: 44 pins CQFPJ 81F64842B Qr Code young
    Text: 28 pins CQFPJ Ceramic Quad Flat Pack J Leaded CQFPJ Package Outlines Code:QI Date: 17/04/97 Rev. B – 23-Aug-01 1 CQFLJ 44 pins CQFPJ Code:QL Date: 18/10/96 2 Rev. B – 23-Aug-01 52 pins CQFPJ Code:Q3 Date: 29/11/91 3 CQFLJ Rev. B – 23-Aug-01 CQFLJ 68 pins CQFPJ


    Original     		PDF 23-Aug-01 52887 44 pins CQFPJ 81F64842B Qr Code young

    P80C32

    Abstract: P80C52 ROMless P80C31 80C51 P-80C31 p80c32 16 p80c32 philips
    Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P8 X CX X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window) N = Plastic Dual In-Line


    Original     		PDF P80C31, P80C32 P80C87, P80C52 12MHz 16MHz 20MHz 32kHz 12MH12 P80C32 P80C52 ROMless P80C31 80C51 P-80C31 p80c32 16 p80c32 philips

    footprint plcc 208

    Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
    Text: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC


    Original     		PDF SXT6051 SXT6251 SXT6282 144-Pin LXT300Z/301Z 28-Pin LXT304A footprint plcc 208 PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs

    sqfp 14x20

    Abstract: 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes
    Text: Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES GENERAL DESCRIPTION • Wide temperature range The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has


    Original     		PDF 30MHz 80C51 sqfp 14x20 74ALSXX P51XA-G3 OTP-e PC 74 HCT 32 P sQFP 14X14 TDA1308 equivalent SG 2368 tqfp 14x14 tray TDA1308 application notes

    Z8PE003PZ010SC

    Abstract: 124 008r
    Text: Packaging Product Specification PS007203-0101 ZiLOG Worldwide Headquarters • 910 E. Hamilton Avenue • Campbell, CA 95008 Telephone: 408.558.8500 • Fax: 408.558.8300 • www.ZiLOG.com This publication is subject to replacement by a later edition. To determine whether


    Original     		PDF PS007203-0101 Z8PE003PZ010SC 124 008r

    16v8 PLD

    Abstract: 48C101 7c63000a 7C128 2061A B1225 CERAMIC QUAD FLATPACK CQFP
    Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256L 7C245L 7C09389V 7C4292V 7B991 C = CMOS B = BiCMOS SUFFIX -45 D M B -70 S C -35 P C -15 J C -25 AS C -5 J C FAMILY CMOS SRAM - FAST


    Original     		PDF 7C128 62256L 7C245L 7C09389V 7C4292V 7B991 MIL-STD-883C 48C101, W42C31, 231XNZ 16v8 PLD 48C101 7c63000a 2061A B1225 CERAMIC QUAD FLATPACK CQFP

    7C245

    Abstract: b1225 CERAMIC QUAD FLATPACK CQFP 22V10 PAL CMOS device 228X 16R8 7B991 PAL20 7C404 7C128
    Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256 7C245 7C006 7C404 7B991 C = CMOS B = BiCMOS SUFFIX -45 D L-70 S L-35 P V-15 J -25 D -5 J MB C C C MB C FAMILY CMOS SRAM - FAST CMOS SRAM - SLOW


    Original     		PDF 7C128 7C245 7C006 7C404 7B991 MIL-STD-883C T229X, W42C31, 231XNZ WB1330, 7C245 b1225 CERAMIC QUAD FLATPACK CQFP 22V10 PAL CMOS device 228X 16R8 7B991 PAL20 7C404 7C128

    NATIONAL SEMICONDUCTOR MARKING CODE sot

    Abstract: national marking code NATIONAL SEMICONDUCTOR MARKING CODE DEVICE MARKING CODE table sot-23 MARKING CODE ZA On semiconductor date Code dpak YEAR A national top marking codes national marking date code national marking code sot sot23 mark code KS
    Text: Device Marking Conventions National Semiconductor marks devices sold in order to provide device identification and manufacturing traceablility information. The method of presenting the information marked on the device is dependent on the size of the device package


    Original     		PDF CSP-9-111S2) CSP-9-111S2. NATIONAL SEMICONDUCTOR MARKING CODE sot national marking code NATIONAL SEMICONDUCTOR MARKING CODE DEVICE MARKING CODE table sot-23 MARKING CODE ZA On semiconductor date Code dpak YEAR A national top marking codes national marking date code national marking code sot sot23 mark code KS

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS - XA Example: Philips 80C51 extended Architecture P51XA G3 7 K B A J Derivative Nam e- - — J ; Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) BD = Thin Quad Rat Pack (TQFP)


    OCR Scan     		PDF 80C51 P51XA 25MHz 30MHz

    Untitled

    Abstract: No abstract text available
    Text: M _a cl t PIN N U M B ER REF. O N LY D E TA IL G / / 0.1 c 2.2 2.0 i /4\ | ^ | q.05Tc j FREESCALE SEMICONDUCTOR, ALL RIGHTS RESERVED. TITLE: n SEATING PLAN 0.05 DETAIL G INC. MECHANICAL OUTLINE POWER QUAD FLAT NON-LEADED PACKAGE PWR QFN 23 TERMINAL, 0.9 PITCH(1 2X12X2.1 )


    OCR Scan     		PDF 2X12X2 98ENG03008D 5M-1994.

    p80c32

    Abstract: p80c32 16 P80C52
    Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: P 8 X C X X X E B P N - T 0 = ROMLESS 5 = Bond-Out emulation 3 = ROM 7 = O T P -E P R O M 9 = FEEPROM (FLASH) J T T T , | | ] | j r Philips North America Package Code A = Plastic Leaded Chip Carrier (PLCC)


    OCR Scan     		PDF P80C31, P80C32 P90C87, P80C52 33MHz, P51XA 80C51 125cC 16MHz 20MHz p80c32 p80c32 16 P80C52

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductors Ordering Information MICROCONTROLLER PRODUCTS Example: 5 3 7 9 = = = = = P8 X C X X X E B P N Philips North America Package Code A = Plastic Leaded Chip Carrier PLCC B = Quad Flat Pack (QFP) FA = Hermetic Cerdip (window) KA = CerQuad (window)


    OCR Scan     		PDF P80C31, P80C32 P80C87, P80C52 24MHz, 33MHz, P51XA 80C51

    Untitled

    Abstract: No abstract text available
    Text: Package Name T y pe Inserted Stand ard P ackag e nam e Sym bol D escription I I P DUAL IN -L IN E PA CKA GE S P SIN G LE IN -L IN E PA CKA GE Z P ZIG-ZAG IN -L IN E PA CK A G E PG A PIN GRID A R RA Y PIGGY BACK PIGGY BACK SD IP Shrink SZIP Q FP S tan d ard flat


    OCR Scan     		PDF 100MIL) 778mm

    Untitled

    Abstract: No abstract text available
    Text: GLOSSARY OF PACKAGING ABBREVIATIONS CLCC Ceramic Leaded Chip Carrier. Solder sealed, mul­ tilayer ceramic. COB Chip on Board. CQFP Glass sealed Ceramic Quad Flat Pack with gull wing leads. Also called CERQUAD or CQUAD. CQUAD Same as CQFP. DPAK Small power transistor package for surface mount.


    OCR Scan     		PDF O-220)

    motorola case 711-03

    Abstract: No abstract text available
    Text: General Release Specification — MC68HC05C4A Section 14. M echanical Specifications 14.1 Contents 14.2 Introduction. . 131 14.3 40-Pin Plastic Dual In-Line DIP Package (Case 711-03). . 132


    OCR Scan     		PDF MC68HC05C4A 40-Pin 42-Pin 44-Lead 24A-01) MC68HC05C4A motorola case 711-03

    Untitled

    Abstract: No abstract text available
    Text: Sony Package Product Name . . Features P a c k a g e name D e s c r ip t io n Symbol Material* DUAL I I P «ifi* IN LI NK PACKAGE P 2. 54m m I10UMIL) C SINGLE IN L I N E S I P 2.54mm P ÍJ 0 0 M Í L ) PACKAGE 2.54mm ZIG ZAG Z Standard 1 P IN L I N E


    OCR Scan     		PDF I10UMIL) I100MIL) 778mlat V50MIL) 50MIL

    p80c652ifp

    Abstract: A11P p2U marking S87C652 p80c652
    Text: Phlips Semiconductors Product spécification CMOS single-chip 8-bit microcontrollers PIN CONFIGURATIONS DESCRIPTION The P80C652/83C652 Single-Chip 8-Bit Microcontroller is manufactured in an advanced CMOS process and is a derivative of the 80C51 microcontroller family. The


    OCR Scan     		PDF 80C652/83C652 P80C652/83C652 80C51 80C652/83C652 80C51. 83C652 80C652 87C652 8XC652 p80c652ifp A11P p2U marking S87C652 p80c652