QFP64-H1
Abstract: No abstract text available
Text: PACKAGE DIMENSIONS QFP64-H1 12.0±0.2 0 ~ 10° 10.0±0.2 32 64 17 10.0±0.2 0.2±0.1 0.08 1.4±0.2 +0.1 0.15- 0.05 1.25TYP 0.5 M 0.5±0.2 16 1 1.85MAX 1.25TYP 49 12.0±0.2 33 48 Mold Base +0.15 0.1- 0.1 0.1 11.0±0.2 UNIT : mm Ver.2003-08-29
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QFP64-H1
25TYP
85MAX
QFP64-H1
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Untitled
Abstract: No abstract text available
Text: パッケージ外形図 QFP64-N1 12. 0 ±0. 1 0 ~10 ﾟ 10. 0 ±0. 1 32 64 17 10 .0 ±0. 1 49 1 0.5 12 .0 ±0. 1 33 48 16 0 .2 ±0 .1 1. 6 MA X 0 .1 5 TY P 1. 4 ± 0 .0 5 0 .0 76 0.6 ±0 .1 0. 1 ±0 .0 5 ﾓ-ﾙ ﾄﾞ 底 面 単位 : mm Ver.2008-04-09
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QFP64-N1
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP64 package SOT393-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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QFP64
OT393-1
OT393-1
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QFP64-P-1414-0
Abstract: SDIP64-P-750-1
Text: APPENDIX 3.6 Package outline 3.6 Package outline 64P6N-A Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 Lead Material Alloy 42 MD e JEDEC Code – HD 49 b2 64 ME D 1 48 I2 HE E Recommended Mount Pad Symbol A A1 A2 b c D
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64P6N-A
64pin
1414mm
QFP64-P-1414-0
64P4B
LQFP64-P-1414-0
SDIP64-P-750-1
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QFP64-G1
Abstract: QFP64 package
Text: PACKAGE DIMENSIONS QFP64-G1 0~10° 16.0±0.4 14.0±0.3 33 32 64 17 14.0±0.3 49 16.0±0.4 48 16 0.35±0.1 0.12 +0.1 0.15 - 0.05 1.4±0.1 0.8 M 1.7MAX 1 0.5 0.10 +0.1 0.1 - 0.05 Mold Base UNIT : mm
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QFP64-G1
QFP64-G1
QFP64 package
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QFP64-P-1414-0
Abstract: No abstract text available
Text: 64P6N-B Plastic 64pin 14✕14mm body QFP EIAJ Package Code QFP64-P-1414-0.80 Weight g 1.11 JEDEC Code – Lead Material Alloy 42 MD e HD 49 b2 64 ME D 1 48 I2 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 33 16 A 32 L1 A2 17 c F e A1 b
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64P6N-B
64pin
QFP64-P-1414-0
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MO-108
Abstract: QFP64
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm; high stand-off height SOT393-2 c y X A 48 33 49 32 ZE e A A2 E HE A1 (A 3) θ wM pin 1 index Lp bp L 17 64 detail X
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QFP64:
OT393-2
MO-108
MO-108
QFP64
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HC49
Abstract: QFP64 GOAL SEMICONDUCTOR
Text: VMX1020-C16/I16 VERSA MIX System Design Notes Description This application note is intended to provide hands-on information about the hardware requirements for a VERSA MIX based system. VMX1020 Pin configuration The VMX1020 is available in standard QFP64 package.
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VMX1020-C16/I16
VMX1020
QFP64
VMX1020.
VMX1020
16MHz
HC49
GOAL SEMICONDUCTOR
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Untitled
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm SOT393-1 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 θ wM Lp bp pin 1 index L 17 64 detail X 16 1 w M bp e v M A
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QFP64:
OT393-1
OT393-1
MS-022
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sot393
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.6 mm ; body 14 x 14 x 2.7 mm; high stand-off height SOT393-2 c y X A 48 33 49 32 ZE e A A2 E HE A1 (A 3) θ wM Lp bp L pin 1 index 17 64 detail X
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QFP64:
OT393-2
OT393-2
MO-108BD-1
sot393
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Untitled
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 1.95 mm ; body 14 x 20 x 2.8 mm SOT319-2 c y X 51 A 33 52 32 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 20 64 detail X 19 1 ZD wM bp e v M A
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QFP64:
OT319-2
OT319-2
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qfp64
Abstract: QFP-64 sot208-1 14X20
Text: Philips Semiconductors Package outlines QFP64: plastic quad flat package; 64 leads lead length 2.35 mm ; body 14 x 20 x 2.75 mm 1995 Feb 04 SOT208-1
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QFP64:
OT208-1
qfp64
QFP-64
sot208-1
14X20
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FP-64H
Abstract: PRQP0064GC-A
Text: JEITA Package Code P-QFP64-14x14-0.80 RENESAS Code PRQP0064GC-A Previous Code FP-64H/FP-64HV MASS[Typ.] 1.2g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 48 33 49 32 bp c c1 HE *2 E b1 Reference
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P-QFP64-14x14-0
PRQP0064GC-A
FP-64H/FP-64HV
FP-64H
PRQP0064GC-A
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QFP64
Abstract: DIL48 BEEPROG qfp-64 labprog LabProg-48LV 68HC-2 68HC BEEPROG DIL48 QFP64 DIL48/QFP64
Text: Conv DIL48/QFP64 Z 68HC-2 - специализированный адаптер c ZIF колодкой для микроконтроллеров серии 68HC с корпусом QFP64, используется совместно с программаторами JetProg, BeeProg, LabProg+
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DIL48/QFP64
68HC-2
QFP64,
LabProg-48LV.
com/pics/convert/con0089b
com/pics/qfp/qfp64-630-47m
QFP64
DIL48
BEEPROG
qfp-64
labprog
LabProg-48LV
68HC
BEEPROG DIL48 QFP64
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QFP64 package
Abstract: QFP64
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP64: plastic quad flat package; 64 leads lead length 2.35 mm ; body 14 x 20 x 2.8 mm SOT319-3 c y X 51 A 33 52 32 ZE e E HE A A2 (A 3) A1 θ wM Lp pin 1 index bp L 20 64 detail X 19 1 w M bp e ZD v M A
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QFP64:
OT319-3
QFP64 package
QFP64
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QFP64-D1
Abstract: No abstract text available
Text: パッケージ外形図 QFP64-D1 12.0±0.4 0 ~10ﾟ 10.0±0.3 32 64 17 10.0±0.3 49 16 0.2±0.05 0.15 1.75±0.1 0.5 M 2.05M AX 1 +0.1 0.15 - 0.05 12.0±0.4 33 48 0.5±0.2 0.1±0.1 ﾓｰﾙﾄﾞ 底 面 単位 : mm
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QFP64-D1
QFP64-D1
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diode b3
Abstract: QFP64 package QFP64-B3
Text: PACKAGE DIMENSIONS QFP64-B3 0 ~ 12° 16.8±0.4 14.0±0.3 48 32 64 17 14.0±0.3 49 1 16.8±0.4 33 16 0.35±0.15 0.16 M +0.1 0.15 - 0.05 3.0MAX 0.8 0.6±0.3 0.15 +0.1 0.1 - 0.05 Mold Base UNIT : mm
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QFP64-B3
diode b3
QFP64 package
QFP64-B3
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QFP64 package
Abstract: QFP64-C2
Text: PACKAGE DIMENSIONS QFP64-C2 23.9±0.4 20.0±0.3 64 20 1 17.9±0.4 32 2.7±0.1 52 14.0±0.3 33 3.0M AX 51 ~ 10º 19 +0.15 0.4 - 0.1 +0.1 0.15 - 0.05 1.0 0.12 M 0.8±0.2 0.15 0.1±0.1 Mold Base UNIT : mm
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QFP64-C2
QFP64 package
QFP64-C2
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QFP64-H1
Abstract: QFP64 package
Text: PACKAGE DIMENSIONS QFP64-H1 PRELIMINARY 12.0±0.2 0 ~ 10° 10.0±0.2 32 64 17 10.0±0.2 0.2±0.1 0.08 1.4±0.2 +0.1 0.15- 0.05 M Mold Base 0.1 11.0±0.2 +0.15 0.1- 0.1 1.25TYP 0.5 0.5±0.2 16 1 1.85MAX 1.25TYP 49 12.0±0.2 33 48 UNIT : mm
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QFP64-H1
25TYP
85MAX
QFP64-H1
QFP64 package
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QFP64-N1
Abstract: No abstract text available
Text: パッケージ外形図 QFP64-N1 12 .0 ±0 .1 0 ～10ﾟ 10 .0 ±0 .1 32 64 17 1 0.0 ±0 .1 49 1 0.5 1 2.0 ±0 .1 33 48 16 0.2 ±0. 1 1.6 M AX 0. 15 TY P 1.4 ±0 .05 0.07 6 MI N 0.6 ±0.1 0. 1 ± 0.0 5 ﾓ -ﾙﾄﾞ 底 面 単位 : mm
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QFP64-N1
QFP64-N1
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PRQP0064JA-A
Abstract: 3BPX
Text: JEITA Package Code P-QFP64-10x14-0.65 RENESAS Code PRQP0064JA-A Previous Code 64P6S-A MASS[Typ.] 0.8g HD *2 D 50 33 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. ZE *1 E 32 HE 51 64 19 1 ZD Reference
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P-QFP64-10x14-0
PRQP0064JA-A
64P6S-A
PRQP0064JA-A
3BPX
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Untitled
Abstract: No abstract text available
Text: TOSHIBA TMP93CS32 Low Voltage / Low Pow er CM OS 16-bit Microcontrollers TM P93C S3 2F 1. O utline and Device Characteristics The TM P9 3C S32 is high-speed, advanced 16-bit m icrocontroller developed for controlling m edium to large-scale equipm ent. The TM P9 3C S32 is housed in 64-pin fla t package P-QFP64-1414-0.80A .
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TMP93CS32
16-bit
64-pin
P-QFP64-1414-0
900/L
TLCS-90
16M-byte
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QFP80-P-1420-0
Abstract: 80H-F
Text: TOSHIBA 8 0 h f> Q F P Flat Package mm QFP80-P-1420-0.80B (N PKG900-1 TOSHIBA /\"7 > r - v - ! 64 tf > QFP (Flat Package) QFP64-P-1420-1.00A : mm o o o 4. n o (N PKG900-2
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QFP80-P-1420-0
PKG900-1
QFP64-P-1420-1
PKG900-2TOSHIBA
PKG900-2
80H-F
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ba5991
Abstract: BA5991FP
Text: M o n o lith ic IC s •C D -G decoder Part No. & BU 9340K Supply Features voltage V 4 .5 -5 .5 Package Linear RGB high speed DAC. Reset on disk change. No microcontroller required QFP64 Note : £:Under development •V C O for CD-ROM Part No. Supply voltage (V)
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9340K
QFP64
BA7042
BA7082F
HSOP28
HSOP25
DIP16/HSOP25
HSOP28/HSOP25
ba5991
BA5991FP
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