CRM1076DJ
Abstract: CRM-1076DJ-G crm1076 SUMITOMO g600f LQFP-100 footprint ABLEBONd 84-1 Holt 3717p 100LQFP CRM*1076
Text: 44-Lead Quad Flat Pack QFP Footprint & Package Change Product Change Notice PCN1102 (v1.0) December 01, 2011 Overview This notice describes the footprint and package changes to the 44 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC family of devices.
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44-Lead
PCN1102
QR-1003
100-Lead
QR-1131
CRM1076DJ
CRM-1076DJ-G
crm1076
SUMITOMO g600f
LQFP-100 footprint
ABLEBONd 84-1
Holt
3717p
100LQFP
CRM*1076
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XC3000
Abstract: CB100
Text: Package Drawings Ceramic Brazed QFP Packages - CB100 XC3000 Version 10-44 November 13, 1997 (Version 1.2)
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CB100
XC3000
CB100
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on823
Abstract: TigerJet Network oN-823 tigerjet
Text: TigerJet Network Application Note TigerJet 100 pin QFP Package Outline Modification The new package dimension for 100 pin QFP will have shorter pin outline. It will be changed from 4.8mm to 3.2mm. Figure 1 shows the detail drawing of the difference in new pin outline. The new 100 pin package will have smaller L and L1 value. Table
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CRM-1076DJ-G
Abstract: CRM*1076 CRM-1076 SUMITOMO g600f CRM1076DJ sumitomo crm 1076dj ABLEBONd 84-1 sumitomo crm
Text: 52-Lead Quad Flat Pack QFP Package Change & Transfer Product Change Notice PCN1103 (v1.0) December 01, 2011 Overview This notice describes the package changes to the 52 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC 429, MILSTD 1553, and LCD Display Driver family of devices.
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52-Lead
PCN1103
QR-1003
100-Lead
QR-1131
44-Lead
CRM-1076DJ-G
CRM*1076
CRM-1076
SUMITOMO g600f
CRM1076DJ
sumitomo crm 1076dj
ABLEBONd 84-1
sumitomo crm
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XC4000
Abstract: CB100 CB164
Text: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings Ceramic Brazed QFP Packages - CB100, CB164, CB196 (XC4000 Version) 10-46 November 13, 1997 (Version 1.2)
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CB100,
CB164,
CB196
XC4000
CB100
CB164
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lQFP256
Abstract: TEQFP208 QFP PACKAGE thermal resistance SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY BGA and QFP Package LQFP-256
Text: Technical Analysis Low-Cost Packaging Technology Using QFP Low-Cost Packaging Technology Using QFP The combination of bus bar technology and TEQFP technology is currently receiving attention in the development of a semiconductor package that realizes function
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CA-QFE144SC-L-Z-01
Abstract: SF-QFE144SC-L-01 0836
Text: 1 Material: 0.0625" ± 0.007" Fr4/G10 Pins: shell material- Brass; finish2 10µ" Gold over 50µ" Nickel min. . 1.75" 2.05" 1.023" 1.148" Assembled 1 SF-QFE144SC-L-01 2 QFP SM emulator foot 0.5mm pitch 0.836" Description: Package converter Carrier adaptor; 2 piece, 144 position (0.5 mm. pitch) QFP ZIF socket adaptor with female connector to plug onto QFP
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Fr4/G10
SF-QFE144SC-L-01
CA-QFE144SC-L-Z-01
SF-QFE144SC-L-01
0836
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SF-QFE44SH-L-01
Abstract: No abstract text available
Text: Emulates QFP package: 10.0mm body 12.6mm Tip to Tip 11.86mm [0.467"] sqr. 0.80mm typ. [0.031"] QFP Pin 1 Pad Detail 0.89mm [0.035"] 10.08mm [0.397"] 0.51mm [0.020"] Ø 0.45mm dia. [Ø 0.0177"] Top View 0.46mm [0.018"] 1.27mm typ. [0.050"] A compatible target board
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FR4/G10
SF-QFE44SH-L-01
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CL-QFE44SE-T-01
Abstract: 08mm
Text: 28mm 12mm 12mm 26mm 8mm 10mm 0.8mm typ. 10mm 0.15mm 1.07mm min to 3.2mm (max) 0.8mm Package Specification Top View 20.47mm 8.85mm 1.5mm Pins compress 1.0 mm to make contact 3.35mm 8.94mm 12mm 13.5mm 0.85mm Side View Description: Probe Board (PB), QFP 44 position 0.8mm QFP to headers.
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CL-QFE44SE-T-01
08mm
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QFP Package 128 lead .5mm
Abstract: QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 A54SX72A-CQ256 BGA 256 PACKAGE thermal resistance A54SX72A-FG484
Text: 3.16mm [0.124"] 3.54mm [0.139"] 1 39.3mm [1.547"] 41.9mm [1.650"] 32.23mm [1.269"] 41.9mm [1.650"] 27mm 15.67mm [0.617"] DETAIL A Lead coplanarity 0.005" max. Side View 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket 1.00mm centers, 26X26 array, 27X27mm body to 256 QFP, 0.5mm
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26X26
27X27mm
PC-BGA/QFP-SX72A-Z-01
A54Sx72A-CQ256
A54SX72A-FG484
SI-SX72-ACQ256SFG484
QFP Package 128 lead .5mm
QFP 128 lead .5mm
BGA reflow guide
SI-SX72-ACQ256SFG484
BGA 256 PACKAGE thermal resistance
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100405-1
Abstract: TQPACK100SD Eletech Electronics AXS4643R195C AXS4803M19 IC61-0644-052 IC61-0644-053 IC61-080-079 IC61-080-081 IC61-0804-046
Text: Appendix A Reference Dimensional Drawing for Common 64-pin 0.8mm-pitch QFP Foot Pattern Package type name Manufacturer's name and package classification 64P6N-A Renesas MCU package type name IC61-0644-052 IC61-0644-053 Yamaichi Electronics Co., Ltd. IC socket type name
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64-pin
64P6N-A
IC61-0644-052
IC61-0644-053
IC61-0644-088
AXS4643R195C
AXS4643R195C
TQPACK080SD
TQPACK080SB
100405-1
TQPACK100SD
Eletech Electronics
AXS4803M19
IC61-0644-052
IC61-0644-053
IC61-080-079
IC61-080-081
IC61-0804-046
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Untitled
Abstract: No abstract text available
Text: M3T-DUMMY64 Dummy IC for 64-pin 0.8mm-pitch QFP 64P6N-A Dimensions Function This accessory tool connects the probe of an emulation pod and the target, or an MCU and the target. Its dimensions are the same as those of the MCU for the 64-pin 0.8mm-pitch QFP (64P6N-A) package.
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M3T-DUMMY64
64-pin
64P6N-A)
M3T-DUMMY64
M3T-DUMMY64.
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80P6NA
Abstract: pin diagram of 08 80p6n-a
Text: M3T-DUMMY80 Dummy IC for 80-pin 0.8mm-pitch QFP 80P6N-A Dimensions Function This accessory tool connects the probe of an emulation pod and the target, or an MCU and the target. Its dimensions are the same as those of MCU for the 80-pin 0.8mm-pitch QFP (80P6N-A) package.
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M3T-DUMMY80
80-pin
80P6N-A)
M3T-DUMMY80
M3T-DUMMY80.
80P6NA
pin diagram of 08
80p6n-a
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C4228
Abstract: No abstract text available
Text: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.
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26X26X5
C4228
PC-BGA/QFP-SX32A-S-01
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pst 39
Abstract: XCS A MCF5307 PP10 PP12 PP15
Text: REVISION NO: 1.0 REVISION DATE: 6/18/98 PAGES AFFECTED: PAGES 19-11 THROUGH 19-13 ADDED CASE DRAWINGS SECTION 19 MECHANICAL DATA 19.1 PACKAGE The MCF5307 package is a 208-pin, thermally enhanced QFP. Thermal characteristics are not yet included in this documentation.
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MCF5307
208-pin,
pst 39
XCS A
PP10
PP12
PP15
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10X10
Abstract: SF-QFE100SC-L-01
Text: 1.91mm [0.075"] 1.91mm [0.075"] 15.24mm [0.600"] 13.97mm [0.550"] 0.50mm typ. 1.27mm typ. [0.050"] 13.97mm [0.550"] 15.24mm [0.600"] Top View 0.46mm dia. typ. [0.018"] 2 6.35mm [0.250"] 1 Recommended target board land dimensions QFP Package Emulated not to scale
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FR4/G10
10X10
SF-QFE100SC-L-01
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PCI1510ZGU
Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 TPS2211A QFP Package 144 lead
Text: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package
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PCI1510
SLLA229
144-terminal
209-terminal
16-bit
TPS2211A
PCI1510ZGU
82365SL
PCI1510GGU
PCI1510PGE
PCI1510PGEG4
QFP Package 144 lead
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82365SL
Abstract: PCI1510 PCI1510GGU PCI1510GVF PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A MTQF017A
Text: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package
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PCI1510
SLLA229
144-terminal
209-terminal
16-bit
TPS2211A
82365SL
PCI1510GGU
PCI1510GVF
PCI1510PGE
PCI1510PGEG4
PCI1510ZGU
MTQF017A
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SLLA229
Abstract: No abstract text available
Text: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package
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PCI1510
SLLA229
144-terminal
209-terminal
16-bit
TPS2211A
SLLA229
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Untitled
Abstract: No abstract text available
Text: QFP, PQFP, & LCC IC51/IC53 Series FEATURES • Any kind of SMT type or IC package type SOP & QFP Available. • High reliability, durability and temperature range. • Custom made also available for high pin count and fine-pitch packages. CHARACTERISTICS
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IC51/IC53
000MQ
10mA/20mV
IC51-064
I50CC
-55CC
IC51-2084-1509
IC51-2404-1655-3
IC51-3044-1471-5
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Untitled
Abstract: No abstract text available
Text: QFP, PQFP, & TQFP IC51/IC53 Series FEATURES • Any kind of SMT type or IC package type QFP Available. • High reliability, durability and temperature range. • Custom made also available for high pin count and fine-pitch packages. CHARACTERISTICS I n s u la tio n R e s is ta n c e
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IC51/IC53
000MQ
10mA/20mV
IC51-064
IC51-2084-1509
28x28
IC51-2404-1655-3
32x32
IC51-3044-1471-5
40x40
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Untitled
Abstract: No abstract text available
Text: SEC pPD72002 Ordering Information 44-Pln P lastic QFP Package Part Number fiPD72002CZ-11 40-pln plastic DIP pPD72002GB-113B4 44-pln plastic QFP jttPD72002LM-11 44-pin plastic leaded chip carrier PLCC Q I k | < l i ic/> 2 il t l b lE lg z lo l o ld l o O is 13 IS la. la.
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pPD72002
44-Pln
fiPD72002CZ-11
40-pln
pPD72002GB-113B4
jttPD72002LM-11
44-pin
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Untitled
Abstract: No abstract text available
Text: NEC /¿PD70236A 16. PACKAGE DRAWINGS 120 PIN PLASTIC QFP D28 0100010001020123020000010001230100 90 61 91 01000100010001008901000102010201 60 detail of lead end 31 120 30 1 ! ! !?! @,"!"!"!P h D\ N PI 20GD-80-5BB-3 MOTE ITEM MILLIMETERS INCHES 32.0±0.4 1.260±0.016
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uPD70236A
20GD-80-5BB-3
014taoo5
079to
006t3oo3
X132R-100A-1
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4572 smd 8pin
Abstract: 100 PIN "PGA" ALTERA DIMENSION CMGA17-P100E 02D-00194 altera 24pin dip drawing
Text: Altera Device Package Outlines March 1995, ver. 5 In tro d u c tio n Data Sheet This data sheet provides package outlines for all Altera devices. Package outlines are listed here in ascending pin count order. Table 1 summarizes the maximum lead coplanarity for Altera J-lead and QFP packages:
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304-Pin
560-Pin
4572 smd 8pin
100 PIN "PGA" ALTERA DIMENSION
CMGA17-P100E
02D-00194
altera 24pin dip drawing
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