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    QFP JUNCTION TO AMBIENT RESISTANCE Search Results

    QFP JUNCTION TO AMBIENT RESISTANCE Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    PS7804-1A-A Renesas Electronics Corporation Low On-state Resistance, , / Visit Renesas Electronics Corporation
    PS7804-1A-F3-A Renesas Electronics Corporation Low On-state Resistance, , / Visit Renesas Electronics Corporation
    PS710BL-1A-E3-A Renesas Electronics Corporation Low On-state Resistance, , / Visit Renesas Electronics Corporation
    PS710BL-1A-A Renesas Electronics Corporation Low On-state Resistance, , / Visit Renesas Electronics Corporation

    QFP JUNCTION TO AMBIENT RESISTANCE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    D7503AGF

    Abstract: D70108C D70320L d77c20ac D78C10 D70116C D75306GF D77C25C D70208L D70216
    Text: NEC ELECTRONICS INC. MAY 1999 TRQ-99-05-323 QUARTERLY MICROPROCESSOR/MICROCOMPUTER RELIABILITY REPORT This report contains reliability data on microprocessor and microcomputer devices fabricated at NEC Roseville and assembled at NEC Roseville or NEC Singapore.


    Original     		PDF TRQ-99-05-323 PD70216 68-pin PD70335 84-pin D7503AGF D70108C D70320L d77c20ac D78C10 D70116C D75306GF D77C25C D70208L D70216

    QFP PACKAGE thermal resistance

    Abstract: SPRA953 Theta-JC plcc qfp132
    Text: Application Report SPRA953 − December 2003 IC Package Thermal Metrics SC Packaging Development ABSTRACT Many thermal metrics exist for IC packages ranging from θja to Ψjt. Often, these thermal metrics are misapplied by customers who try to use them to estimate junction temperatures


    Original     		PDF SPRA953 QFP PACKAGE thermal resistance Theta-JC plcc qfp132

    G30-88

    Abstract: Theta JB QFP PACKAGE thermal resistance die down JC15-1 G-38-87 G38-87 Theta-J 32 QFP PACKAGE thermal resistance 2500AN QFP PACKAGE thermal resistance
    Text: Thermal Measurement Report Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC Assembled: ANAM Die: PST6 - 10.16 mm Square


    Original     		PDF 2500AN 7304LC G38-87 115x102 RXMN60 RBDT20 G30-88 Theta JB QFP PACKAGE thermal resistance die down JC15-1 G-38-87 Theta-J 32 QFP PACKAGE thermal resistance 2500AN QFP PACKAGE thermal resistance

    68hc26

    Abstract: 68HC05C4 68hc705p9 68HC05B6 JPC3400 68hc805b6 68705r3 68HC05C12 68HC705B5 68HC68SE
    Text: CSIC Microcontroller Division Reliability and Quality Quarter 2, 1996 Report MOTOROLA INC., 1996 CSIC MICROCONTROLLER DIVISION RELIABILITY AND QUALITY REPORT TECHNICAL INFORMATION . 1-1 RELIABILITY DATA BY TECHNOLOGY. 2-1


    Original     		PDF

    SO20-300

    Abstract: QFP PACKAGE thermal resistance SO14-150 MBK360 SOT411 QFP-80-14 die bond diode handbook MBK368 QFP120
    Text: CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 Junction temperature 6-2 Factors affecting Rth j-a 6-2 Thermal resistance test methods 6-3 Test procedure 6-3 Forced air factors for thermal resistance 6-4 Thermal resistance data - assumptions and precautions


    Original     		PDF OT111-1 OT157-2 DBS13P OT141-6 DBS17P OT243-1 DBS23P OT411-1 HSOP20 OT418-2 SO20-300 QFP PACKAGE thermal resistance SO14-150 MBK360 SOT411 QFP-80-14 die bond diode handbook MBK368 QFP120

    Theta JB

    Abstract: JC15-1 G30-88 G38-87
    Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC


    Original     		PDF 2500AN 7304LC G38-87 115x102 RXMN60 RBDT20 Theta JB JC15-1 G30-88

    68HC11L6

    Abstract: 68hc11ka4 68HC11PH8 68HC11a1 527 MOSFET TRANSISTOR motorola D65C 68HC05N4 nippon denso 68HC05B6 128 QFP 14x20
    Text: CMRQS/D REV 10 MOTOROLA MICROCONTROLLER TECHNOLOGIES GROUP RELIABILITY AND QUALITY MONITOR REPORT Quarter 1, 1997 Semiconductor Product Sector Test results contained herein are for information only. This report does not alter MotorolaÕs standard warranty or product speciÞcations.


    Original     		PDF

    68hc11pa8

    Abstract: 68hc11kg4 68B09E 68HC11PH8 HC711KG4 68HC11KA4 68HC57 68HC11L6 HC705B16 motorola 68hc11kg4
    Text: MCTG RELIABILITY AND QUALITY 1996 ANNUAL REPORT MRQSY96/D Microcontroller Technologies Group Reliability and Quality 1996 Annual Report To Our Valued Customers: Thank you for selecting Motorola as your preferred supplier of Microcontroller products. We in Motorola’s


    Original     		PDF MRQSY96/D 68hc11pa8 68hc11kg4 68B09E 68HC11PH8 HC711KG4 68HC11KA4 68HC57 68HC11L6 HC705B16 motorola 68hc11kg4

    D65012GF

    Abstract: d65031 d65012 NEC JAPAN d65632 nec 2401 D65022L d65632 d65013gf d65025l D65025
    Text: NEC ELECTRONICS INC. July 1999 TRQ-99-07-330 QUARTERLY ASIC RELIABILITY REPORT This report contains reliability data on the following Application-Specific Integrated Circuit families assembled by NEC Electronics Inc. in Roseville, California fabricated by NEC Japan or NEC Electronics Roseville as specified .


    Original     		PDF TRQ-99-07-330 D83901S1 320-pin D65012GF d65031 d65012 NEC JAPAN d65632 nec 2401 D65022L d65632 d65013gf d65025l D65025

    SPRA953A

    Abstract: Theta-JC QFP die down Theta-JC plcc Theta-JC qfp Theta-JC 28 PLCC mgmt coolant temperature sensor outline of the heat sink for Theta JC dead bug heat slugs attach QFP PACKAGE thermal resistance
    Text: Application Report SPRA953A – June 2007 IC Package Thermal Metrics Darvin Edwards. ABSTRACT Many thermal metrics exist for integrated circuit IC packages ranging from θja to Ψjt.


    Original     		PDF SPRA953A SPRA953A Theta-JC QFP die down Theta-JC plcc Theta-JC qfp Theta-JC 28 PLCC mgmt coolant temperature sensor outline of the heat sink for Theta JC dead bug heat slugs attach QFP PACKAGE thermal resistance

    IC51-0804-394

    Abstract: yamaichi IC51-0562-1387 IC51-0804-808 QFP PACKAGE thermal resistance tqfp 64 socket 32PIN TQFP TEXAS IC51-0644-807 IC51-0644-807 Datasheet TQFP 80 socket Yamaichi TQFP
    Text: FIFO Surface-Mount Package Information First-In, First-Out Technology Tom Jackson and Mary Helmick Advanced System Logic – Semiconductor Group SSPA001A 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor


    Original     		PDF SSPA001A IC51-0804-394 yamaichi IC51-0562-1387 IC51-0804-808 QFP PACKAGE thermal resistance tqfp 64 socket 32PIN TQFP TEXAS IC51-0644-807 IC51-0644-807 Datasheet TQFP 80 socket Yamaichi TQFP

    AN1232

    Abstract: QFP PACKAGE thermal resistance micromechanical
    Text: MOTOROLA Order this document by AN1232/D SEMICONDUCTOR TECHNICAL DATA AN1232 Thermal Performance of Plastic Ball Grid Array PBGA Packages for Next Generation FSRAM Devices Prepared by: Shailesh Mulgaonker (APDC, Phoenix, AZ) and Bennett Joiner (APDPL, Austin, TX)


    Original     		PDF AN1232/D AN1232 AN1232/D* AN1232 QFP PACKAGE thermal resistance micromechanical

    180I

    Abstract: GS82032A GS82032AT-133 GS82032AT-166 GS82032AT-180 GS82032AT-200 GS82032AT-4 GS82032AT-5 QFP PACKAGE thermal resistance gs82032
    Text: GS82032AT/Q-200/180/166/133/100 TQFP, QFP Commercial Temp Industrial Temp 200 MHz–100 MHz 7.5 ns–12 ns 3.3 V VDD 3.3 V and 2.5 V I/O 64K x 32 2M Synchronous Burst SRAM Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipelined


    Original     		PDF GS82032AT/Q-200/180/166/133/100 GS82032AT-4 GS82032AT-6 GS82032AT-4I GS82032AT-6I GS82032AQ-4 GS82032AQ-6 GS82032AQ-4I GS82032AQ-6I 180I GS82032A GS82032AT-133 GS82032AT-166 GS82032AT-180 GS82032AT-200 GS82032AT-4 GS82032AT-5 QFP PACKAGE thermal resistance gs82032

    GS820H32T-133

    Abstract: GS820H32T-138 GS820H32T-150 820H32
    Text: GS820H32T/Q-150/138/133/117/100/66 64K x 32 2M Synchronous Burst SRAM TQFP, QFP Commercial Temp Industrial Temp Features Flow Through / Pipeline Reads • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation.


    Original     		PDF GS820H32T/Q-150/138/133/117/100/66 GS820H3218/361 2000C 820H3218/361 2000D GS820H32T-133 GS820H32T-138 GS820H32T-150 820H32

    GS82032

    Abstract: GS820322T-138 GS82032T-133 GS82032T-150 GS82032T-4 GS82032T-5 GS82032T-6
    Text: Preliminary GS82032T/Q-150/138/133/117/100/66 TQFP, QFP Commercial Temp Industrial Temp 64K x 32 2M Synchronous Burst SRAM Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation


    Original     		PDF GS82032T/Q-150/138/133/117/100/66 1999B; 1/2000C GS820321 2000C 2/2000D 2/2000D; GS82032 GS820322T-138 GS82032T-133 GS82032T-150 GS82032T-4 GS82032T-5 GS82032T-6

    820E32A

    Abstract: GS820E32A GS820E32AT-133 GS820E32AT-150 GS820E32AT-4 ld 33v
    Text: GS820E32AT/Q-150/138/133/117/100/66 64K x 32 2M Synchronous Burst SRAM TQFP, QFP Commercial Temp Industrial Temp Features Flow Through / Pipeline Reads • FT pin for user configurable flow through or pipelined operation. • Dual Cycle Deselect DCD Operation.


    Original     		PDF GS820E32AT/Q-150/138/133/117/100/66 GS82032 2000D GS820321 3/2000E 82032T/Q, 820E32TQ, 820H32TQ 820E32A GS820E32A GS820E32AT-133 GS820E32AT-150 GS820E32AT-4 ld 33v

    GS81032A2T-138

    Abstract: GS81032AT-133 GS81032AT-150 GS81032AT-4 GS81032AT-5 GS81032AT-6
    Text: GS81032AT/Q-150/138/133/117/100/66 TQFP, QFP Commercial Temp Industrial Temp Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS81032AT/Q-150/138/133/117/100/66 100-lead 81032A GS81032A2T-138 GS81032AT-133 GS81032AT-150 GS81032AT-4 GS81032AT-5 GS81032AT-6

    Untitled

    Abstract: No abstract text available
    Text: GS81032T/Q-150/138/133/117/100/66 TQFP, QFP Commercial Temp Industrial Temp Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS81032T/Q-150/138/133/117/100/66 100-lead

    Untitled

    Abstract: No abstract text available
    Text: GS82032T/Q-150/138/133/117/100/66 64K x 32 2M Synchronous Burst SRAM TQFP, QFP Commercial Temp Industrial Temp Features Flow Through / Pipeline Reads • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation.


    Original     		PDF GS82032T/Q-150/138/133/117/100/66

    ld 33v

    Abstract: GS820E32T-133 GS820E32T-138 GS820E32T-150 1999A
    Text: GS820E32T/Q-150/138/133/117/100/66 64K x 32 2M Synchronous Burst SRAM TQFP, QFP Commercial Temp Industrial Temp Features Flow Through / Pipeline Reads • FT pin for user configurable flow through or pipelined operation. • Dual Cycle Deselect DCD Operation.


    Original     		PDF GS820E32T/Q-150/138/133/117/100/66 GS820E3218/361 2000C 820E3218/361 2000D ld 33v GS820E32T-133 GS820E32T-138 GS820E32T-150 1999A

    820E32A

    Abstract: GS820E32A GS820E32AT-133 GS820E32AT-150 GS820E32AT-4
    Text: GS820E32AT/Q-150/138/133/117/100/66 64K x 32 2M Synchronous Burst SRAM TQFP, QFP Commercial Temp Industrial Temp Features Flow Through / Pipeline Reads • FT pin for user configurable flow through or pipelined operation. • Dual Cycle Deselect DCD Operation.


    Original     		PDF GS820E32AT/Q-150/138/133/117/100/66 GS82032 2000D GS820321 3/2000E 82032T/Q, 820E32TQ, 820H32TQ 820E32A GS820E32A GS820E32AT-133 GS820E32AT-150 GS820E32AT-4

    GS82032A

    Abstract: GS82032AT-133 GS82032AT-166 GS82032AT-180 GS82032AT-4 GS82032AT-5 GS82032AT-6
    Text: GS82032AT/Q-180/166/133/100 TQFP, QFP Commercial Temp Industrial Temp Features Flow Through/Pipeline Reads • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply


    Original     		PDF GS82032AT/Q-180/166/133/100 100-lead 82032A GS82032AT-4 GS82032AT-6 GS82032AT-4I GS82032AT-6I GS82032AQ-4 GS82032AQ-6 GS82032A GS82032AT-133 GS82032AT-166 GS82032AT-180 GS82032AT-4 GS82032AT-5 GS82032AT-6

    d65641gd

    Abstract: D65656 D65801GD D65806 D65808 D65640GC nec 44-pin LQFP d65611gb D65625GC d65626gf D65672GL
    Text: NEC ELECTRONICS INC. October 1999 TRQ-99-10-335 QUARTERLY ASIC RELIABILITY REPORT This report contains reliability data on the following application-specific integrated circuit families fabricated and assembled by NEC Japan BiCMOS-4/4A BiCMOS-5 ECL-2 ECL-3/3A/3B


    Original     		PDF TRQ-99-10-335 304-pin d65641gd D65656 D65801GD D65806 D65808 D65640GC nec 44-pin LQFP d65611gb D65625GC d65626gf D65672GL

    820H32

    Abstract: GS820H32T-133 GS820H32T-138 GS820H32T-150 hd2023
    Text: GS820H32T/Q-150/138/133/117/100/66 64K x 32 2M Synchronous Burst SRAM TQFP, QFP Commercial Temp Industrial Temp Features Flow Through / Pipeline Reads • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation.


    Original     		PDF GS820H32T/Q-150/138/133/117/100/66 GS820H3218/361 2000C 820H3218/361 2000D 820H32 GS820H32T-133 GS820H32T-138 GS820H32T-150 hd2023