nec 44 pin LQFP

Abstract: nec 44-pin qfp nec 44-pin LQFP P100G transistor 3s4 P160G P100GF-65-3LA-2 65122 P64G-80-22-2 jbt1
Contextual Info: : Available, : Under development Plastic QFP Nominal Dimensions mm 10 x 10 12 × 12 Lead Pitch Classification (mm) 0.65 QFP 0.8 QFP 0.65 LQFP QFP 0.65 LQFP 14 × 14 0.8 QFP 1.0 QFP 0.8 QFP 1.0 QFP 0.65 QFP 0.8 QFP 32 × 32 0.65 QFP 40 × 40 0.65 QFP 0.65

QFP-48A

Contextual Info: Package MITSUMI Packages QFP Series Units : mm QFP-32A QFP-44B QFP-48A QFP-56B QFP-64B QFP-64E 0.15+0.10 -0.06 33 48 49 52 14.0±0.20 17.9±0.40 32 64 32 0.8±0.20 33 14.0±0.2 16.0±0.3 51 0.6±0.2 0.15+0.10 -0.05 20 17 64 19 1 0.15 M 0~10° 16 14.0±0.2

A2 diode

Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Contextual Info: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5

QFP-80B

Contextual Info: パッケージ MITSUMI パッケージ （QFPシリーズ） 単位：mm QFP-44B QFP-48A QFP-56B QFP-64B QFP-64E 0.15＋0.10 −0.05 51 49 32 20 0.15 M 2.8 ＋0.20 −0.15 0.10 0.4±0.1 0.1＋0.10 −0.15 1.0 1 14.0±0.2 16.0±0.3 0.8 0.01 0.37＋0.10 −0.07

PA-QFE160SC-C-S-01

Contextual Info: 1 20 39 47 64 81 98 115 123 142 142 123 115 98 80 97 114 122 141 160 160 141 122 114 81 64 47 39 20 1 97 80 63 46 38 19 Pin 1 19 38 46 63 Top View- QFP QFP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Bottom View- Base Base QFP Base QFP Base QFP

132 pin PGA socket

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

100-PGM13069-30

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

132 pin PGA socket

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

95-132I25

Abstract: ASTM-B16-85
Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

132 pin PGA socket

Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

2648f

Abstract: IC BOSCH QFP Hitachi DSA0076 16x16-bit H8S/2638f Hitachi motor stepper Lauterbach SH7047F QFP-100 QFP-128
Contextual Info: HCAN Microcontrollers The Embedded CAN solution ❚ Overview Dashboard/Gateway Body/EPS/Motor Control Dashboard/Metering SH7047F 256KB/12KB QFP-100 SH7049M 128KB/8KB QFP-100 SMD x 4 HCAN x 2 H8S/2638F/39F 256KB/16KB QFP-128 H8S/2636F, M 128KB/4KB QFP-128 H8S/2648F

ASTM-B16-85

Abstract: MIL-T-10727 QQN-290
Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

95-132I25

Abstract: ASTM-B16-85 MIL-T-10727
Contextual Info: Part No. 95-132I25 - QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch FEATURES: •Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

d5888

Abstract: 5888 C 5888
Contextual Info: Pomona Model 5888 & 5888-2 64 Lead QFP Test Clip 0.80mm Lead Pitch These new test clips provide an easy means to connect instrumentation to fine pitch QFP chip leads. • Interfaces with high density QFP surface mount chips. • Two-stage alignment assures positive connections.

16 x 2 LCD display lcd display

Abstract: LCD KS0070B driver chip 5x7 LCD 80 segment driver 5x7 driver KS0035 lcd scientific calculator display ks0066 4-bit
Contextual Info: LCD PRODUCTS DEVICE KS0035 KS0063 KS0065B PACKAGE Bare chip 100 QFP or Bare chip 64 QFP or Bare chip FUNCTION 53 segment Static driver Dot matrix LCD segment driver with 80 channel output Dot matrix LCD common/segment driver with 40 channel output KS0066 80 QFP

Contextual Info: PA552-QFP Data Sheet 80 pin QFP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Wiring This adapter allows programming of the Philips 87C552 and 87C554 in a QFP package on 40 pin DIP programmers capable of programming the 87C51Fx. The following chart shows the connections from the QFP device

YAMAICHI ic357

Abstract: IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:

cxd 158

Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
Contextual Info: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage: