208-PIN
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01) 31.64±0.30SQ (1.246±.012) 28.00±0.30SQ (1.102±.012) 25.50(1.004)
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FPT-208C-A01
208-pin
FPT-208C-A01)
F208009SC-1-3
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01) 31.64±0.30SQ (1.246±.012) 28.00±0.30SQ
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FPT-208C-A01
208-pin
FPT-208C-A01)
F208009SC-1-3
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-A01 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Metal seal FPT-208C-A01 208-pin ceramic QFP (FPT-208C-A01)
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FPT-208C-A01
208-pin
FPT-208C-A01)
F208009SC-1-3
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP FPT-208P-M04 208-pin plastic QFP (FPT-208P-M04) Lead pitch 0.50 mm Package width x package length 28.0 × 28.0 mm Lead shape Gullwing Sealing method Plastic mold
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FPT-208P-M04
208-pin
FPT-208P-M04)
F208020S-c-3-4
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FPT-208C-C02
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-208C-C02 208-pin ceramic QFP (FPT-208C-C02)
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FPT-208C-C02
208-pin
FPT-208C-C02)
F208007SC-3-3
FPT-208C-C02
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nitride
Abstract: Aluminum nitride QFP method 208
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C03 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-208C-C03 208-pin ceramic QFP (FPT-208C-C03)
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FPT-208C-C03
208-pin
FPT-208C-C03)
F208013SC-2-3
nitride
Aluminum nitride QFP
method 208
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FPT-208C-C02
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC FPT-208C-C02 208-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-208C-C02 208-pin ceramic QFP
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FPT-208C-C02
208-pin
FPT-208C-C02)
F208007SC-3-3
FPT-208C-C02
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nitride
Abstract: Aluminum nitride QFP C1995
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN CERAMIC FPT-208C-C04 Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic material Aluminum nitride 208-pin ceramic QFP FPT-208C-C04 208-pin ceramic QFP (FPT-208C-C04)
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FPT-208C-C04
208-pin
FPT-208C-C04)
FFPT-208C-C04
nitride
Aluminum nitride QFP
C1995
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QFP20
Abstract: QFP208-P-2828-1
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC FPT-208P-M01 EIAJ code : ∗QFP208-P-2828-1 208-pin plastic QFP Lead pitch 0.50mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold FPT-208P-M01 208-pin plastic QFP (FPT-208P-M01)
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FPT-208P-M01
QFP208-P-2828-1
208-pin
FPT-208P-M01)
QFP20
QFP208-P-2828-1
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footprint plcc 208
Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
Text: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC
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SXT6051
SXT6251
SXT6282
144-Pin
LXT300Z/301Z
28-Pin
LXT304A
footprint plcc 208
PLASTIC QUAD FLAT PACK 160 PINS DIMENSION
LXT304A
LXT305A
LXT307
LXT310
LXT317
LXT318
LXT325
A 3120 8 Pins ICs
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IC198-208-2100
Abstract: IC198-208-2101
Text: IC198 Series SMT 208 Pins QFP - (52 x 52) 0.5 mm pitch Socket Dimensions Quad Flat Package (QFP) - 208 pins Specifications Current Rating: Rated Voltage: Contact Resistance: 0.3 A 50V DC 30mΩ max. at 10mA and 20mV max. Insulation Resistance: 500MΩ min. at 500V DC
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IC198
250Veff
UL94V-0)
IC198-112-210x
IC198-208-2100
IC198-208-2101
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footprint pga 208
Abstract: ASTM-B16-85 MIL-T-10727
Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-208M50
96-208M50
-or96-208M50-P
208-PGM17039-30
footprint pga 208
ASTM-B16-85
MIL-T-10727
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Untitled
Abstract: No abstract text available
Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-208M50
36figurations
-or96-208M50-P
208-PGM17039-30
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A2 diode
Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Text: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5
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S176GM-50-3EU,
S176GM-50-8EU-2
S208GD-50-5ML-2
S208GD-50-5EL-1
P208GD-50-LML,
S208GD-50-8EU-2
S216GM-40-8EV
P240GN-50-LMU,
S256GD-40-LMV,
S272GP-50-LMU,
A2 diode
transistor A2
3eb data
lmu a2
TQFP 32 PACKAGE
272-pin
TQFP 100 Pitch 0,4
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footprint pga 208
Abstract: ASTM-B16-85
Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-208M50
96-208M50
-or96-208M50-P
208-PGM17039-30
footprint pga 208
ASTM-B16-85
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footprint pga 208
Abstract: No abstract text available
Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-208M50
-or96-208M50-P
208-PGM17039-30
footprint pga 208
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Untitled
Abstract: No abstract text available
Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-208M50
36or96-208M50-P
208-PGM17039-30
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Untitled
Abstract: No abstract text available
Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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96-208M50
-or96-208M50-P
208-PGM17039-30
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footprint pga 208
Abstract: AMS-QQ-N-29
Text: P/N 96-208M50 QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adapter FEATURES • Convert surface-mount QFP packages to a 17x17 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries’ patented process,
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96-208M50
208-Position,
17x17
C36000,
96-208M50
96-208M50-P
208-PGM17039-30
footprint pga 208
AMS-QQ-N-29
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ADV9505
Abstract: No abstract text available
Text: June 22, 1995 Dear Customer: Altera has established procedures to ship FLEX 8000 208-, 240-, and 304-pin Power Quad Flat Packs RQFP in dry pack immediately. Dry packing of other QFP packages will follow and a schedule will be published shortly. Dry packing enhances the current QFP shipping process by placing all QFP devices in
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304-pin
ADV9505
ADV9505
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Untitled
Abstract: No abstract text available
Text: P/N 96-208M50 QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adapter FEATURES • Convert surface-mount QFP packages to a 17x17 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries’ patented process,
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96-208M50
208-Position,
17x17
C36000,
B16/B16Mroduction.
96-208M50-P
208-PGM17039-30
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823B
Abstract: DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook
Text: MOTOROLA SEMICONDUCTOR GENERAL INFORMATION Packaging & Case Information 84-Pin PLCC CASE 780A-01 ISSUE A FN SUFFIX 181-Pin PGA CASE 795A–02 ISSUE A HI SUFFIX 128-Pin QFP CASE 862A-02 ISSUE B DD SUFFIX 208-Pin QFP CASE 872A-01 ISSUE TBD DK SUFFIX 160-Pin QFP
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84-Pin
80A-01
181-Pin
128-Pin
62A-02
208-Pin
72A-01
160-Pin
64A-03
224-Pin
823B
DL201
motorola handbook
84 pin plcc ic base
Reliability and quality handbook
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QFP PACKAGE thermal resistance
Abstract: 208-PIN
Text: QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC FPT-208P-M04 208-pin plastic QFP Lead pitch 0.50mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type available FPT-208P-M04
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FPT-208P-M04
208-pin
FPT-208P-M04)
F208020S-1C-1
QFP PACKAGE thermal resistance
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208-PIN
Abstract: No abstract text available
Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index FPT-208C-C04 208-pin ceramic QFP Lead pitch 0.5 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.5 mm Base ceramic
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FPT-208C-C04
208-pin
FPT-208C-C04)
F208014SC-1-3
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