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    QFP 208 Search Results

    QFP 208 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    8501002YC Rochester Electronics LLC Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    8501001YA Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    NG82370-16 Rochester Electronics LLC Multifunction Peripheral, CMOS, PQFP100, PLASTIC, QFP-100 Visit Rochester Electronics LLC Buy
    MQ80C196KB-12 Rochester Electronics LLC Microcontroller, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    TMC2081KBC Rochester Electronics LLC Consumer Circuit, PQFP128, METRIC, PLASTIC, QFP-128 Visit Rochester Electronics LLC Buy
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    QFP 208 Price and Stock

    onsemi R5C486-LQFP208

    - Bulk (Alt: R5C486-LQFP208)
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    Avnet Americas R5C486-LQFP208 Bulk 4 Weeks 21
    • 1 $17.81
    • 10 $17.81
    • 100 $16.74
    • 1000 $15.14
    • 10000 $15.14
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    onsemi R5C476II-LQFP208R

    - Bulk (Alt: R5C476II-LQFP208R)
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    Avnet Americas R5C476II-LQFP208R Bulk 4 Weeks 76
    • 1 $4.84
    • 10 $4.84
    • 100 $4.55
    • 1000 $4.12
    • 10000 $4.12
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    Dataman DIL48/QFP208 ZIF STM32-DSI-1

    The Dataman Dil48/Qfp208 Zif Stm32-Dsi-1 Is A Device Specific Adapter For Stmicroelectronics Stm32 Devices With Mipi-Dsi Unit In Qfp208. |Dataman DIL48/QFP208 ZIF STM32-DSI-1
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark DIL48/QFP208 ZIF STM32-DSI-1 Bulk 1
    • 1 $749.32
    • 10 $728.36
    • 100 $686.44
    • 1000 $686.44
    • 10000 $686.44
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    OKI Semiconductor MSM30R0440-LQFP208

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Bristol Electronics MSM30R0440-LQFP208 13
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    Amkor Technology A-QFP208-28MM-.5MM-2.6-DC-LF

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Bristol Electronics A-QFP208-28MM-.5MM-2.6-DC-LF 10
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    Find more QFP 208 price and stock on Findchips.com

    QFP 208 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    QFP208-P-2828A Panasonic Digital RGB Processor LSI Original PDF

    QFP 208 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    nec 44 pin LQFP

    Abstract: nec 44-pin qfp nec 44-pin LQFP P100G transistor 3s4 P160G P100GF-65-3LA-2 65122 P64G-80-22-2 jbt1
    Text: : Available, : Under development Plastic QFP Nominal Dimensions mm 10 x 10 12 × 12 Lead Pitch Classification (mm) 0.65 QFP 0.8 QFP 0.65 LQFP QFP 0.65 LQFP 14 × 14 0.8 QFP 1.0 QFP 0.8 QFP 1.0 QFP 0.65 QFP 0.8 QFP 32 × 32 0.65 QFP 40 × 40 0.65 QFP 0.65


    Original     		PDF P80GF-80-3L9-2 S94GJ-80-5BG-3 P100G-65-12-2 P100GF-65-3BA1-3 S100GF-65-3BA-3 P100GF-65-3LA-2 S100GF-65-8ET S100GF-65-JBT-1 P120GD-80-5BB-3 P120GD-80-LBB, nec 44 pin LQFP nec 44-pin qfp nec 44-pin LQFP P100G transistor 3s4 P160G P100GF-65-3LA-2 65122 P64G-80-22-2 jbt1

    A2 diode

    Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
    Text: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5


    Original     		PDF S176GM-50-3EU, S176GM-50-8EU-2 S208GD-50-5ML-2 S208GD-50-5EL-1 P208GD-50-LML, S208GD-50-8EU-2 S216GM-40-8EV P240GN-50-LMU, S256GD-40-LMV, S272GP-50-LMU, A2 diode transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4

    ND-1420-2

    Abstract: QFP JEDEC tray 304-Pin 304 QFP
    Text: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		PDF 304-pin 100-Pin ND-1420-2 QFP JEDEC tray 304 QFP

    TO-220 JEDEC

    Abstract: ND-1420-2 QFP Package 80 lead 4-0308 4040 data sheet 9 pin socket nd-3232-3.4 parts detail of 5.1 sound pcb QFP 100 pin QFP Shipping Trays
    Text: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		PDF 304-pin 100-Pin TO-220 JEDEC ND-1420-2 QFP Package 80 lead 4-0308 4040 data sheet 9 pin socket nd-3232-3.4 parts detail of 5.1 sound pcb QFP 100 pin QFP Shipping Trays

    QFP JEDEC tray

    Abstract: ND-3232-3 ND-2828-3 304-pin dimensions
    Text: QFP Carrier & Development Socket January 1998, ver. 12 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		PDF 304-pin QFP JEDEC tray ND-3232-3 ND-2828-3 304-pin dimensions

    QFP Shipping Trays

    Abstract: ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray
    Text: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		PDF 304-pin 100-Pin QFP Shipping Trays ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray

    QFP JEDEC tray

    Abstract: No abstract text available
    Text: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical


    Original     		PDF 304-pin QFP JEDEC tray

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-208M50 36figurations -or96-208M50-P 208-PGM17039-30

    footprint pga 208

    Abstract: ASTM-B16-85 MIL-T-10727
    Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-208M50 96-208M50 -or96-208M50-P 208-PGM17039-30 footprint pga 208 ASTM-B16-85 MIL-T-10727

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. •Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-208M50 QQ-B-626. -or96-208M50-P

    footprint pga 208

    Abstract: ASTM-B16-85
    Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-208M50 96-208M50 -or96-208M50-P 208-PGM17039-30 footprint pga 208 ASTM-B16-85

    footprint pga 208

    Abstract: No abstract text available
    Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-208M50 -or96-208M50-P 208-PGM17039-30 footprint pga 208

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-208M50 36or96-208M50-P 208-PGM17039-30

    Untitled

    Abstract: No abstract text available
    Text: Part No. 96-208M50 - QFP to PGA Adapter for EIAJ 208 Position, .0197 [.50] Pitch FEATURES: • Convert surface mount QFP packages to a 17 x 17 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


    Original     		PDF 96-208M50 -or96-208M50-P 208-PGM17039-30

    YAMAICHI ic357

    Abstract: IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004
    Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:


    Original     		PDF 10mA/20mV Dep51-820-2 KS-9376 YAMAICHI ic357 IC51-1284-1702 IC51-0644-1972 IC357-0484-078 IC357 ic51-1284-1702-2 IC500-1444-002P-2 YAMAICHI ic500 IC51-2084-1052-36 IC500-1004-004

    cxd 158

    Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
    Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage:


    Original     		PDF 10mA/20mV cxd 158 ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003

    823B

    Abstract: DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook
    Text: MOTOROLA SEMICONDUCTOR GENERAL INFORMATION Packaging & Case Information 84-Pin PLCC CASE 780A-01 ISSUE A FN SUFFIX 181-Pin PGA CASE 795A–02 ISSUE A HI SUFFIX 128-Pin QFP CASE 862A-02 ISSUE B DD SUFFIX 208-Pin QFP CASE 872A-01 ISSUE TBD DK SUFFIX 160-Pin QFP


    Original     		PDF 84-Pin 80A-01 181-Pin 128-Pin 62A-02 208-Pin 72A-01 160-Pin 64A-03 224-Pin 823B DL201 motorola handbook 84 pin plcc ic base Reliability and quality handbook

    IC51-1284-1433

    Abstract: IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158
    Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:


    Original     		PDF 10mA/20mV IC51-0644-820-4 IC51-820-2 KS-9376 IC51-1284-1433 IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158

    SIGNETICS

    Abstract: QFP minimum pitch size qfp 0.4mm lead frame QFP lead frame gold wire MQFP
    Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics QFP Signetics MQFP, MQFP LOC, MQFP H/S, LQFP, LQFP Sensor, QFP EPP, and TQFP The Signetics QFP package family is a lead frame based package with gull wing style leads on four sides. Signetics offers an array of QFP’s including standard MQFP,


    Original     		PDF

    footprint pga 208

    Abstract: AMS-QQ-N-29
    Text: P/N 96-208M50 QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adapter FEATURES • Convert surface-mount QFP packages to a 17x17 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries’ patented process,


    Original     		PDF 96-208M50 208-Position, 17x17 C36000, 96-208M50 96-208M50-P 208-PGM17039-30 footprint pga 208 AMS-QQ-N-29

    PCN0504

    Abstract: EME-G700 SUMITOMO G700 SUMIKON EME-G700 SUMITOMO EME G700 MPM7128 EME-G700 datasheet G700 SUMItomo EME-G700 Sumikon
    Text: PROCESS CHANGE NOTICE PCN0504 STANDARDIZED EME-G700 SERIES MOLD COMPOUND FOR QFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound in Altera’s quad flat pack QFP packages. All QFP packages assembled at ASE in Malaysia and Amkor in


    Original     		PDF PCN0504 EME-G700 MP8000 EME-6300HJ EPF8452A, EPF8636A, EPF8820A, PCN0504 SUMITOMO G700 SUMIKON EME-G700 SUMITOMO EME G700 MPM7128 EME-G700 datasheet G700 SUMItomo EME-G700 Sumikon

    ADV9505

    Abstract: No abstract text available
    Text: June 22, 1995 Dear Customer: Altera has established procedures to ship FLEX 8000 208-, 240-, and 304-pin Power Quad Flat Packs RQFP in dry pack immediately. Dry packing of other QFP packages will follow and a schedule will be published shortly. Dry packing enhances the current QFP shipping process by placing all QFP devices in


    Original     		PDF 304-pin ADV9505 ADV9505

    Untitled

    Abstract: No abstract text available
    Text: P/N 96-208M50 QFP-to-PGA EIAJ 208-Position, 0.0197 [0.50] Pitch Adapter FEATURES • Convert surface-mount QFP packages to a 17x17 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries’ patented process,


    Original     		PDF 96-208M50 208-Position, 17x17 C36000, B16/B16Mroduction. 96-208M50-P 208-PGM17039-30

    ASE QFP

    Abstract: No abstract text available
    Text: QFP Carrier & Development Socket Features • ■ ■ ■ ■ General Description Q u ad flat pack QFP carriers protect fragile leads on QFP devices d u rin g shipping and device handling. QFP developm ent sockets allow on-board electrical and m echanical


    OCR Scan     		PDF 304-pin ASE QFP