nec 44 pin LQFP
Abstract: nec 44-pin qfp nec 44-pin LQFP P100G transistor 3s4 P160G P100GF-65-3LA-2 65122 P64G-80-22-2 jbt1
Text: : Available, : Under development Plastic QFP Nominal Dimensions mm 10 x 10 12 × 12 Lead Pitch Classification (mm) 0.65 QFP 0.8 QFP 0.65 LQFP QFP 0.65 LQFP 14 × 14 0.8 QFP 1.0 QFP 0.8 QFP 1.0 QFP 0.65 QFP 0.8 QFP 32 × 32 0.65 QFP 40 × 40 0.65 QFP 0.65
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P80GF-80-3L9-2
S94GJ-80-5BG-3
P100G-65-12-2
P100GF-65-3BA1-3
S100GF-65-3BA-3
P100GF-65-3LA-2
S100GF-65-8ET
S100GF-65-JBT-1
P120GD-80-5BB-3
P120GD-80-LBB,
nec 44 pin LQFP
nec 44-pin qfp
nec 44-pin LQFP
P100G
transistor 3s4
P160G
P100GF-65-3LA-2
65122
P64G-80-22-2
jbt1
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cxd 158
Abstract: ot 239 IC51-128 OT 306 IC51-2564-1668-6 IC51-0444-467 IC51-1764 socket Yamaichi ic234 IC51-1764-1505-10 IC217-1444-003
Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Speci cations Insulation Resistance: Dielectric Withstanding Voltage:
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10mA/20mV
cxd 158
ot 239
IC51-128
OT 306
IC51-2564-1668-6
IC51-0444-467
IC51-1764
socket Yamaichi ic234
IC51-1764-1505-10
IC217-1444-003
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IC51-1284-1433
Abstract: IC51-807 IC51-0484-806 IC51-1444-1354-7 IC51-0644-1240 IC51-2564-1668-6 OT 306 IC51-128 IC217-2404-007 cxd 158
Text: Series Overview *QFP Quad Flat Packages, Gullwing Leads SMT Devices *QFP variations e.g. BQFP. Series IC51 (Clamshell) QFP, PQFP, TQFP and MQUAD 0.4mm to 1.27 Pitch Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage:
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IC51-0644-820-4
IC51-820-2
KS-9376
IC51-1284-1433
IC51-807
IC51-0484-806
IC51-1444-1354-7
IC51-0644-1240
IC51-2564-1668-6
OT 306
IC51-128
IC217-2404-007
cxd 158
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PA-QFE160SC-C-S-01
Abstract: No abstract text available
Text: 1 20 39 47 64 81 98 115 123 142 142 123 115 98 80 97 114 122 141 160 160 141 122 114 81 64 47 39 20 1 97 80 63 46 38 19 Pin 1 19 38 46 63 Top View- QFP QFP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Bottom View- Base Base QFP Base QFP Base QFP
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PA-QFE160SC-C-S-01
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144 QFP body size
Abstract: ASTM-B16-85
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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-or97-68340-P
145-PGM15024-30
144 QFP body size
ASTM-B16-85
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Untitled
Abstract: No abstract text available
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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145-PGM15024-30
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144 QFP body size
Abstract: No abstract text available
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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145-PGM15024-30
144 QFP body size
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F2MC-16
Abstract: MB2147-01
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71045-1E F2MC-16 Family EMULATOR QFP-100P PROBE HEADER MB2147-583 OPERATION MANUAL PREFACE Thank you for purchasing the QFP-100P *1 probe header MB2147-583 for the F2MC*2 -16 familyemulator. The QFP-100P probe header is used to connect the F2MC-16L/16LX emulator (MB2147-01*3)and
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SS01-71045-1E
F2MC-16
QFP-100P
MB2147-583
QFP-100P
MB2147-583)
F2MC-16L/16LX
MB2147-01
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P40G-80-F-2
Abstract: P44G-80-22 P48GH-80-2A5-4
Text: e Mounting pad of QFP The nominal dimensions of QFP (quad flat package) are determined by the dimensions of the plastic body. For example, “64-pin 14 x 20 QFP” means that the body dimensions are 14 mm × 20 mm. In designing the mounting pads of this package, therefore, the body dimensions and pin dimensions
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64-pin
P120GD-80-5BB-3
P120GD-80-LBB,
P136GD-65-5BC-3
P160GD-65-5BD-3
P160GD-65-LBD,
S160GD-65-LGD,
P184GN-65-LGT-1
S208GL-65-6GL-1
C10943X)
P40G-80-F-2
P44G-80-22
P48GH-80-2A5-4
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ZIF pga 84
Abstract: PGA 145 socket QFP 128 pin Socket PA-QFJ172SB-P-Z-01 ZIF qfp 172
Text: Page 1 of 2 Use if QFP Pin 1 is lower left when device is placed on ZIF socket Top ViewQFP Socket 129 87 86 130 44 172 QFP PIN 1in lower left corner QFP PIN 1 43 A1 Top ViewPGA Base A17 126 125 129 128 127 121 113 110 109 103 97 91 88 87 90 89 85 130 123
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PA-QFJ172SB-P-Z-01
ZIF pga 84
PGA 145 socket
QFP 128 pin Socket
ZIF qfp 172
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Motorola MC6805 pin diagram
Abstract: MC6805 motorola a00a a06b 848B AN1066 AN442 MC145003 MC145004 MC6805
Text: MOTOROLA Order this document by MC145003/D SEMICONDUCTOR TECHNICAL DATA MC145003 MC145004 Product Preview 128 Segment LCD Drivers CMOS 1 ORDERING INFORMATION MC145003FU MC145004FU QFP QFP PIN ASSIGNMENT FP32 FP31 FP30 FP29 FP28 FP27 FP26 FP25 FP24 FP23 FP22
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MC145003/D
MC145003
MC145004
MC145003FU
MC145004FU
MC145003/D*
Motorola MC6805 pin diagram
MC6805 motorola
a00a
a06b
848B
AN1066
AN442
MC145003
MC145004
MC6805
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PA-QFE160SA-C-Z-02
Abstract: No abstract text available
Text: 1 26 47 64 81 98 115 136 136 115 98 81 64 47 26 1 25 46 63 80 97 114 135 160 160 135 114 97 80 63 46 25 Pin 1 Top View- QFP QFP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 BASE 8 31 50 32 9 51 58 33 10 52 69 34 11 53 70 35 12 54 71 36 QFP 21 22 23 24
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PA-QFE160SA-C-Z-02
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QFP JEDEC tray
Abstract: 7404 JEDEC TRAY QFP
Text: UNIT : mm 74.04 30.93 35.2 37.02 135.9 OT-001T-01 A A' 37.02 27.93 35.2 259.14 315.0 322.6 SECTION A – A' 35.2 3.77 6.35 7.62 27.6 Applied Package Quantity (pcs) Tray OT-001T-01 Carbon PPO 120-pin plastic QFP (3.2mm,3.7mm thick) MAX. 24 Material 136-pin plastic QFP (3.7mm thick)
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OT-001T-01
120-pin
136-pin
160-pin
208-pin
QFP JEDEC tray
7404
JEDEC TRAY QFP
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QFP JEDEC tray
Abstract: QFP 160 QFP JEDEC tray 208 136-pin 120-pin 7404 tray Carbon PPO QFP datasheet tray dimensions
Text: UNIT : mm 74.04 30.93 35.2 37.02 135.9 OT-001T-01 A A' 37.02 27.93 35.2 259.14 315.0 322.6 SECTION A – A' 35.2 3.77 6.35 7.62 27.6 Applied Package Quantity (pcs) Tray OT-001T-01 Carbon PPO 120-pin plastic QFP (3.2mm,3.7mm thick) MAX. 24 Material 136-pin plastic QFP (3.7mm thick)
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OT-001T-01
120-pin
136-pin
160-pin
208-pin
QFP JEDEC tray
QFP 160
QFP JEDEC tray 208
7404
tray Carbon PPO
QFP datasheet
tray dimensions
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frequency hopping spread spectrum
Abstract: spread spectrum receiver circuity TDD synchronizer cordless phone "control signals" cordless phone Transceiver IC direct sequence spread spectrum P115 Z87000 Z87001 Z87010
Text: PRELIMINARY CUSTOMER PROCUREMENT SPECIFICATION 1 Z87001/Z87L01 1 ROMLESS SPREAD SPECTRUM CORDLESS PHONE CONTROLLER FEATURES Device ROM * KWords Z87001 Z87L01 64 64 RAM I/O (Words) Lines 512 512 32 32 Package Information • 144-Pin QFP 144-Pin QFP Note: *Maximum accessible external ROM
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Z87001/Z87L01
Z87001
Z87L01
144-Pin
and001010
frequency hopping spread spectrum
spread spectrum receiver circuity
TDD synchronizer
cordless phone "control signals"
cordless phone Transceiver IC
direct sequence spread spectrum
P115
Z87000
Z87001
Z87010
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sd3-75
Abstract: FDC37C67X FDC37C93X cross PD6 GP20 GP25 SA10 SMSC Corporation cross reference
Text: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and
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FDC37C67x/FDC37C93x
FDC37C67x
FDC37C93x.
FDC37C67x
FDC37C93x
FDC37C67x.
sd3-75
cross PD6
GP20
GP25
SA10
SMSC Corporation cross reference
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3525A
Abstract: 136-pin LA-3525A-1 QFP package weight la-3525a
Text: UNIT : mm 335±1.0 59.5±0.5 216±0.5 24±0.5 27±0.5 54±0.1 180±1.0 A' A 126±0.5 42±0.1 PPE 38 22±0.5 HEAT PROOF NEC LA-3525A-1 38 SECTION A-A' 38 5.8 4.5 8.8 27.3 Applied Package Quantity pcs 120-Pin Plastic QFP (3.7mm thick) 136-Pin Plastic QFP (3.7mm thick)
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LA-3525A-1
136-Pin
120-Pin
160-Pin
208-Pin
3525A
LA-3525A-1
QFP package weight
la-3525a
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160 e7
Abstract: g21 Transistor AA10 AA13 AA15 PA-QFE208SB-P-Z-04 177PGA
Text: PA-QFE208SB-P-Z-04 Map 2005, Date: 4/15/05, Rev.: A YAMAICHI A1 Top View - QFP Top View - PGA QFP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 PGA D3 D4 E4 E2 F5 E3 F2 G6 G5 F1 H6 G2 G1 H5 J5 H1 J6 H2 QFP 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
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PA-QFE208SB-P-Z-04
160 e7
g21 Transistor
AA10
AA13
AA15
177PGA
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GP62
Abstract: GP15 126-150 GP61 GP22 GP65 gp6*5 GP10 SA10 SA12
Text: APPLICATION NOTE 6.15 FDC37C68x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C68x and the FDC37C93x. The FDC37C68x is a 128 pin QFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C68x and FDC37C93x data
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FDC37C68x/FDC37C93x
FDC37C68x
FDC37C93x.
FDC37C93x
FDC37C68x.
14CLK
39NTIES,
GP62
GP15
126-150
GP61
GP22
GP65
gp6*5
GP10
SA10
SA12
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65630
Abstract: uPD7105 UART TTL buffer CMOS-6A 65640 65611 CMOS-6S uPD71054 NS16550A uPD71037
Text: DATA SHEET CMOS-6 1.0 Micron CMOS Gate Array Description Features CMOS-6 is NEC’s well-established channelless gate array family. The CMOS-6 family comprises 17 masters, which are available in a wide variety of package types including thin packages T-QFP , QFP with
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set63
65630
uPD7105
UART TTL buffer
CMOS-6A
65640
65611
CMOS-6S
uPD71054
NS16550A
uPD71037
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GP11
Abstract: No abstract text available
Text: APPLICATION NOTE 6.15 FDC37C68x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C68x and the FDC37C93x. The FDC37C68x is a 128 pin QFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C68x and FDC37C93x data
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FDC37C68x/FDC37C93x
FDC37C68x
FDC37C93x.
FDC37C93x
FDC37C68x.
14CLK
FDC37C68x,
GP11
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368-pin
Abstract: Aluminum nitride QFP
Text: QUAD FLAT L-LEADED PACKAGE 368 PIN CERAMIC FPT-368C-C01 Lead pitch 0.40mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50mm Base ceramic material Aluminum nitride 368-pin ceramic QFP FPT-368C-C01 368-pin ceramic QFP (FPT-368C-C01)
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FPT-368C-C01
368-pin
FPT-368C-C01)
F368002SC-3-3
Aluminum nitride QFP
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Untitled
Abstract: No abstract text available
Text: ADVANCED QFP Sockets INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850 / 401-823-5200 Fax 401-823-8723 Email advintC0rp@a0l.C0m Internet http://www.advintcorp.com QFP Sockets Preliminary - Consult Factory Features:
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Untitled
Abstract: No abstract text available
Text: ADVANCED QFP Sockets INTERCONNECTIONS 5 Energy Way, P.0. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850 / 401-823-5200 • Fax 401-823-8723 Email advintcorp@aol.com Internet http://www.advintcorp.com QFP Sockets Preliminary - Consult Factory Features:
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