Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : QFN77 Component Weight : Document No : QFN77-44LD-PBY-RS-1 Process Type : Standard D/A & Lead Free Finish 0.1276 grams 7.0mmx7.0mm Lead #: No 1 2 3 4 5 6 7 44LD Material Content in % Molding Compound 48.03%
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QFN77-44LD-PBY-RS-1
QFN77
121012HC05
MLF77Q-44LD-PBY-RS-1
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PDF
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : QFN77 Component Weight : Document No : QFN77-48LD-GRN-RS-3 Process Type : Standard D/A & NiPdAu Lead Finish 0.1311 grams 7.0mmx7.0mm Lead #: No 1 2 3 4 5 6 7 48LD Material Content in % Molding Compound 47.96%
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QFN77-48LD-GRN-RS-3
QFN77
Epichlorohydrin9003-36-5
MLF77Q-48LD-GRN-RS-3
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PDF
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : QFN 44 Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Lead Frame Plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 080911PM10 Content in % 62.43%
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QFN77-44LD-GRN-RS-3
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202328A
Abstract: P10 led module CONNECT HEADER 5X2 1N4148 LL4148-1 HRP10H-ND SMD HEADER 5X2 max2850 AAT2428
Text: EVALUATION BOARD DATA SHEET EV191 Evaluation Board for the AAT2428 Sixteen-Channel White LED Driver Solutionwith LED Current and Timing Control Introduction The AAT2428 evaluation board is a hardware platform to evaluate the functions of the AAT2428, a 16-channel white
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EV191
AAT2428
AAT2428,
16-channel
02328A
202328A
P10 led module CONNECT
HEADER 5X2
1N4148
LL4148-1
HRP10H-ND
SMD HEADER 5X2
max2850
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202321A
Abstract: No abstract text available
Text: EVALUATION BOARD DATA SHEET EV187 Evaluation Board for the AAT2469/2499 Sixteen-Channel TVLite White LED Driver Solutionwith LED Current and Timing Control Introduction The AAT2469/AAT2499 evaluation board is a hardware platform to evaluate the functions of the AAT2469 and AAT2499
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EV187
AAT2469/2499
AAT2469/AAT2499
AAT2469
AAT2499
AAT2499
202321A
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LQFP-128L
Abstract: LQFP128L
Text: SPECIFICATION NO. REV. 2000-0026 M DOCUMENT TITLE: SMD PACKAGE MOISTURE SENSITIVITY TABLE OWNER: RELIABILITY MANAGER REQUIRED APPROVALS: RELIABILITY MANAGER QUALITY MANAGER SR. PRODUCT ENGINEERING MANAGER PLANNING AND LOGISTICS DIRECTOR WW TEST OPERATIONS MANAGER
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FCQFN46-34L
FQFN33-16L,
FQFN44-26L,
H3QFN1212-64L
H3QFN88-52L
H4QFN1010-52L
QFN56-30L
H4QFN1212-64L
LGA5032-06L
LGA5555-76L
LQFP-128L
LQFP128L
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Material Component Weight : QFN 7x7mm Document No : 84 Process Type : Content in % Molding Compound 70.09% Copper Alloy Frame 15.36% Spot Silver Plating 0.07% Silver Die Attach Epoxy
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QFN77-84LD-PBY-RS-3B
122210HC09
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