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    QFN THERMAL RESISTANCE VS. MOUNTING PAD AREA Search Results

    QFN THERMAL RESISTANCE VS. MOUNTING PAD AREA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    BLM15PX121BH1D Murata Manufacturing Co Ltd FB SMD 0402inch 120ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM15PX181SH1D Murata Manufacturing Co Ltd FB SMD 0402inch 180ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM21HE802SN1L Murata Manufacturing Co Ltd FB SMD 0805inch 8000ohm NONAUTO Visit Murata Manufacturing Co Ltd
    BLM15PX330BH1D Murata Manufacturing Co Ltd FB SMD 0402inch 33ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM15PX600SH1D Murata Manufacturing Co Ltd FB SMD 0402inch 60ohm POWRTRN Visit Murata Manufacturing Co Ltd

    QFN THERMAL RESISTANCE VS. MOUNTING PAD AREA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    diagrams hitachi ecu

    Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog" PDF

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog" PDF

    thermal analysis on pcb

    Abstract: AND8432
    Text: AND8432 Thermal Considerations for a 4x4 mm QFN Prepared by: Roger Stout ON Semiconductor http://onsemi.com APPLICATION NOTE Overview board−to−ambient thermal resistance which is controlled by board size, materials, layout, and thermal boundary conditions , can easily range from about 15°C/W up to in


    Original     		AND8432 AND8432/D thermal analysis on pcb AND8432 PDF

    R53 SOT223 semiconductor

    Abstract: SMD L4 Regulator SOT-223 a 1712 mosfet D47 MOSFET ON MARKING R59 sanyo OS-CON sepc qfn 88 stencil SMD E4 sot SOT223 MARKING r46 R55 SOT223 semiconductor
    Text: NIS3001A Product Preview Integrated Drive and MOSFET Power Chip for Synchronous Buck Controllers http://onsemi.com The NIS3001A is an integrated multi-chip solution for high power DC to DC synchronous buck converters. It contains two power MOSFETs that are controlled by an internal Driver. All three die are


    Original     		NIS3001A NIS3001A/D R53 SOT223 semiconductor SMD L4 Regulator SOT-223 a 1712 mosfet D47 MOSFET ON MARKING R59 sanyo OS-CON sepc qfn 88 stencil SMD E4 sot SOT223 MARKING r46 R55 SOT223 semiconductor PDF

    SOT223 MARKING r46

    Abstract: smd marking code r55 MARKING CODE SMD IC FET N4 smd code marking wl sot23 smd code marking D42 marking 12X sot-23 marking code d47 marking code R52 SMD Transistor marking code WL SMD zener sanyo OS-CON sepc
    Text: NIS3001 Product Preview Integrated Drive and MOSFET Power Chip for Synchronous Buck Controllers http://onsemi.com The NIS3001 is an integrated multi-chip solution for high power DC to DC synchronous buck converters. It contains two power MOSFETs that are controlled by an internal Driver. All three die are


    Original     		NIS3001 NIS3001 NIS3001/D SOT223 MARKING r46 smd marking code r55 MARKING CODE SMD IC FET N4 smd code marking wl sot23 smd code marking D42 marking 12X sot-23 marking code d47 marking code R52 SMD Transistor marking code WL SMD zener sanyo OS-CON sepc PDF

    QFN-48 LAND PATTERN

    Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
    Text: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when


    Original     		PDF

    sanyo OS-CON sepc

    Abstract: SOT223 MARKING r46 MARKING CODE SMD IC FET N4 thermistor R55 smd marking code r55 R8801 GRM188R71H103KA01L smd code marking wl sot23 MARKING CODE SMD IC C59 Zener diode smd marking code c10 g
    Text: NIS3001 Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers The NIS3001 is an integrated multi−chip solution for high power DC to DC synchronous buck converters. It contains two power MOSFETs that are controlled by an internal Driver. All three die are


    Original     		NIS3001 NIS3001/D sanyo OS-CON sepc SOT223 MARKING r46 MARKING CODE SMD IC FET N4 thermistor R55 smd marking code r55 R8801 GRM188R71H103KA01L smd code marking wl sot23 MARKING CODE SMD IC C59 Zener diode smd marking code c10 g PDF

    thermistor tdk

    Abstract: R8801 MARKING CODE SMD IC FET N4 sanyo OS-CON sepc R53 SOT223 marking code R51 SMD Transistor marking code R52 SMD Transistor smd marking code r54 MARKING SMD transistor R44 POWER MOSFET P1 smd marking code
    Text: NIS3001 Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers The NIS3001 is an integrated multi−chip solution for high power DC to DC synchronous buck converters. It contains two power MOSFETs that are controlled by an internal Driver. All three die are


    Original     		NIS3001 NIS3001 NIS3001/D thermistor tdk R8801 MARKING CODE SMD IC FET N4 sanyo OS-CON sepc R53 SOT223 marking code R51 SMD Transistor marking code R52 SMD Transistor smd marking code r54 MARKING SMD transistor R44 POWER MOSFET P1 smd marking code PDF

    C2C22

    Abstract: sanyo OS-CON sepc EA SOT-23 D4212 marking 12X sot-23 MMJT9410T1 NCP5316 NIS3001 NIS3001AQPT1 R501
    Text: NIS3001A Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers The NIS3001A is an integrated multi−chip solution for high power DC to DC synchronous buck converters. It contains two power MOSFETs that are controlled by an internal Driver. All three die are


    Original     		NIS3001A NIS3001A NIS3001A/D C2C22 sanyo OS-CON sepc EA SOT-23 D4212 marking 12X sot-23 MMJT9410T1 NCP5316 NIS3001 NIS3001AQPT1 R501 PDF

    SMD fet MARKING 34

    Abstract: C3225X7R1C106KT sanyo OS-CON sepc
    Text: NIS3001A Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers The NIS3001A is an integrated multi−chip solution for high power DC to DC synchronous buck converters. It contains two power MOSFETs that are controlled by an internal Driver. All three die are


    Original     		NIS3001A NIS3001A/D SMD fet MARKING 34 C3225X7R1C106KT sanyo OS-CON sepc PDF

    NCS5650

    Abstract: AND8402
    Text: AND8402 Thermal Considerations for the NCS5650 Prepared by: Roger Stout ON Semiconductor http://onsemi.com APPLICATION NOTE Overview Note 1 . On the other hand, because of the small footprint of the package, board−to−ambient thermal resistance (which


    Original     		AND8402 NCS5650 AND8402/D NCS5650 AND8402 PDF

    MAX8556ETE

    Abstract: MAX8556 MAX8556ETE-T MAX8556EVKIT MAX8557 MAX8557ETE T1655 T1655-2 QFN "100 pin" PACKAGE thermal resistance
    Text: Maxim > Products > [Power and Battery Management] MAX8556, MAX8557 4A Ultra-Low-Input-Voltage LDO Regulators Description The MAX8556/MAX8557 low-dropout linear regulators operate from input voltages as low as 1.425V and are able to deliver up to 4A of continuous output


    Original     		MAX8556, MAX8557 MAX8556/MAX8557 100mV. MAX8556 T1655-2 MAX8556/MAX8557 MAX8556ETE MAX8556ETE-T MAX8556EVKIT MAX8557 MAX8557ETE T1655 T1655-2 QFN "100 pin" PACKAGE thermal resistance PDF

    tyco p11b

    Abstract: alcatel 2440 p31b j1 smd p31a TYCO P11A 14 nokia 1280 Littelfuse P26B smd 2640 alcatel marconi 2030 operating manual
    Text: Media Contact: Dan Stanek Director of Marketing & Corporate Marcom Littelfuse, Inc. Tel: 847-391-0714 dstanek@littelfuse.com To download a high-resolution version of this image click here:


    Original     		Photos/26031 tyco p11b alcatel 2440 p31b j1 smd p31a TYCO P11A 14 nokia 1280 Littelfuse P26B smd 2640 alcatel marconi 2030 operating manual PDF

    si514

    Abstract: SI510
    Text: AN765 T HERMAL A NALYSIS OF S I L I C O N L ABS T I M I N G D EVICES 1. Introduction The junction temperature of semiconductor devices affects reliability and performance of Integrated Circuits ICs , including timing devices. This application note provides the following:


    Original     		AN765 si514 SI510 PDF

    smd DEE diode

    Abstract: proximity sensor interface ja smd SPT01-335DEE SPT01335DEE RCC marking AN1351 16 pins qfn 3x3 footprint AN587 EN60947-5-2
    Text: SPT01-335DEE Automation sensor transient and over voltage protection Features • Triple diode array for power bus protection, switch protection and reverse blocking protection ■ Flexible connection for NPN low side or PNP high side sensor configuration


    Original     		SPT01-335DEE smd DEE diode proximity sensor interface ja smd SPT01-335DEE SPT01335DEE RCC marking AN1351 16 pins qfn 3x3 footprint AN587 EN60947-5-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: ECP050D The Communications Edge TM ½ Watt, High Linearity InGaP HBT Amplifier • 14 dB Gain @ 1960 MHz • +5V Single Positive Supply • 16-pin 4x4mm lead-free/green/ RoHS-compliant QFN Package Applications • Final stage amplifiers for Repeaters • Mobile Infrastructure


    Original     		ECP050D 16-pin ECP050D 1-800-WJ1-4401 PDF

    SLUA271

    Abstract: IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station
    Text: Application Report SLUA271 - June 2002 QFN/SON PCB Attachment PMP Portable Power ABSTRACT Quad flatpack—no leads QFN and small outline—no leads (SON) are leadless packages with electrical connections made via lands on the bottom side of the component to the surface


    Original     		SLUA271 IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station PDF

    Untitled

    Abstract: No abstract text available
    Text: SPT01-335DEE Automation sensor transient and overvoltage protection Datasheet − production data Features • Triple diode array for power bus protection, switch protection and reverse blocking protection ■ Flexible connection for NPN low side or PNP high side sensor configuration


    Original     		SPT01-335DEE ID15200 PDF

    smd DEE diode

    Abstract: smd code marking 9l 16 pins qfn 3x3 footprint SPT01-335DEE st smd diode marking code QFN 3X3 STMicroelectronics smd DIODE marking code symbol inductive proximity sensor circuit diagram SMD Tack Switch
    Text: SPT01-335DEE Automation sensor transient and overvoltage protection Datasheet − production data Features • Triple diode array for power bus protection, switch protection and reverse blocking protection ■ Flexible connection for NPN low side or PNP high side sensor configuration


    Original     		SPT01-335DEE ID15200 smd DEE diode smd code marking 9l 16 pins qfn 3x3 footprint SPT01-335DEE st smd diode marking code QFN 3X3 STMicroelectronics smd DIODE marking code symbol inductive proximity sensor circuit diagram SMD Tack Switch PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220 PDF

    Untitled

    Abstract: No abstract text available
    Text: ECP200D The Communications Edge TM 2 Watt, High Linearity InGaP HBT Amplifier • +5V Single Positive Supply • MTTF > 100 Years • 16-pin 4x4mm lead-free/green/ RoHS-compliant QFN Package Applications • Final stage amplifiers for Repeaters • Mobile Infrastructure


    Original     		ECP200D 16-pin ECP200D 1-800-WJ1-4401 PDF

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8 PDF

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220 PDF

    Untitled

    Abstract: No abstract text available
    Text: NCS5650 2 Amp PLC Line Driver The NCS5650 is a high efficiency, Class A/B, low distortion power line driver. Its design is optimized to accept a signal from a Power Line Carrier modem. The output stage is designed to drive up to 2 A peak into an isolation transformer or simple coil coupling to the mains. At


    Original     		NCS5650 NCS5650 NCS5650/D PDF