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    QFN SUBSTRATE DESIGN GUIDELINES Search Results

    QFN SUBSTRATE DESIGN GUIDELINES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    QFN SUBSTRATE DESIGN GUIDELINES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    JESD22-B113

    Abstract: qfn Substrate design guidelines JESD22B113 JESD22-B111 JESD22B111 AN-1137 AN1136 JEDEC qfn tape JEDEC QFN case outline
    Text: Application Note AN-1136 Discrete Power Quad Flat Pack No-Leads PQFN Board Mounting Application Note Table of Contents Page Device construction . 2 Design considerations . 3 Assembly considerations . 4


    Original     		PDF AN-1136 IRFH7932TRPbF) JESD22-B113 qfn Substrate design guidelines JESD22B113 JESD22-B111 JESD22B111 AN-1137 AN1136 JEDEC qfn tape JEDEC QFN case outline

    JESD22-B113

    Abstract: JESD22B113 QFN PACKAGE thermal resistance AN-1133 JESD22-B111 qfn Substrate design guidelines IR3800 JESD22B111
    Text: Application Note AN-1132 Power Quad Flat Pack No-Leads PQFN Board Mounting Application Note Table of Contents Page Device construction . 2 Design considerations . 3 Assembly considerations . 4 Mechanical test results . 7


    Original     		PDF AN-1132 IR3800PbF) JESD22-B113 JESD22B113 QFN PACKAGE thermal resistance AN-1133 JESD22-B111 qfn Substrate design guidelines IR3800 JESD22B111

    qfn Substrate design guidelines

    Abstract: 514 hg JEDEC QFN case outline QFN PACKAGE thermal resistance AN-1133 JESD22B111 IR3800
    Text: Application Note AN-1132 Power Quad Flat Pack No-Leads PQFN Board Mounting Application Note Table of Contents Page Device construction . 2 Design considerations . 3 Assembly considerations . 4 Mechanical test results . 7


    Original     		PDF AN-1132 IR3800PbF) qfn Substrate design guidelines 514 hg JEDEC QFN case outline QFN PACKAGE thermal resistance AN-1133 JESD22B111 IR3800

    SAC405

    Abstract: viscosity sac405 Sn57Bi JEDEC-STD-20C SAC305 screen emulsion QFN 8 CARSEM SAC305 reflow system in package QFN 16 CARSEM package outline sn63pb37 solder wire
    Text: Application Note Soldering Guidelines for Mounting ANADIGICS QFNs on PCBs Revision 2 OBJECTIVE The objective of this application note is to provide ANADIGICS’ customers’ general guidelines for PCB second level interconnect design when assembling with ANADIGICS’


    Original     		PDF

    SLUA271

    Abstract: IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station
    Text: Application Report SLUA271 - June 2002 QFN/SON PCB Attachment PMP Portable Power ABSTRACT Quad flatpack—no leads QFN and small outline—no leads (SON) are leadless packages with electrical connections made via lands on the bottom side of the component to the surface


    Original     		PDF SLUA271 IPC-7527 IPC7527 DUAL ROW QFN leadframe PCB design for very fine pitch csp package nozzle heater qfn Substrate design guidelines IPC-SM-782 qfn 28 land pattern Service Manual smd rework station

    jedec package MO-247

    Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
    Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB


    Original     		PDF AC322 jedec package MO-247 qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline

    slua271a

    Abstract: SON PCB Attachment IPC-7525 qfn Substrate design guidelines ipc 7525 DUAL ROW QFN leadframe Service Manual smd rework station IPC7525 IPC7711 JESD51-7
    Text: Application Report SLUA271A – June 2002 – Revised September 2007 QFN/SON PCB Attachment Steve Kummerl, Bernhard Lange, Dominic Nguyen . ABSTRACT Quad flatpack no leads QFNs and small-outline no leads (SONs) are leadless


    Original     		PDF SLUA271A slua271a SON PCB Attachment IPC-7525 qfn Substrate design guidelines ipc 7525 DUAL ROW QFN leadframe Service Manual smd rework station IPC7525 IPC7711 JESD51-7

    TB389

    Abstract: No abstract text available
    Text: Technical Brief 389 Authors: Mark Kwoka and Jim Benson PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently experiencing


    Original     		PDF TB389

    J-STD-005

    Abstract: nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 TB389 MARK RAY QFN
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN MLFP Packages Technical Brief March 2004 TB389.2 Authors: Jim Benson, Mark Kwoka, Ray Claudio Introduction General Design Guidelines Intersil’s Quad Flat No Lead (QFN), Micro Lead Frame Plastic (MLFP) package is a relatively new packaging


    Original     		PDF TB389 J-STD-005 nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 MARK RAY QFN

    TB488

    Abstract: No abstract text available
    Text: Technical Brief 488 Authors: Mark Kwoka and Loyde Carpenter PCB Land Pattern Design and Surface Mount Guidelines for POL Modules Introduction Intersil's POL Module Product family offering a relatively new packaging concept that is currently experiencing rapid growth.


    Original     		PDF TB488

    qfn Substrate design guidelines

    Abstract: j-std-001d IPC-SM-782 MO-220 TB389
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief August 17, 2006 TB389.3 Author: Mark Kwoka Introduction General Design Guidelines Intersil’s Quad Flat No Lead QFN package is a relatively new packaging concept that is currently experiencing rapid


    Original     		PDF TB389 qfn Substrate design guidelines j-std-001d IPC-SM-782 MO-220

    J-STD-005

    Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		PDF TB389 J-STD-005 land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389

    J-STD-005

    Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
    Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently


    Original     		PDF TB389 J-STD-005 nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 XQFN

    QFN-48 LAND PATTERN

    Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
    Text: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when


    Original     		PDF

    qfn 48 7x7 stencil

    Abstract: Soldering guidelines pin in paste standoff amkor exposed pad AT88RF1354 IPC-SM-782 qfn 44 7x7 PACKAGE footprint Soldering guidelines pin in paste 10x10 qfn qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size
    Text: 1. Introduction This document provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate. This is a leadless package where electrical


    Original     		PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		PDF AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		PDF AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    ISL6605

    Abstract: ISL6608 ISL6608CB ISL6608CB-T ISL6608CR MO-220 TB363 TB389
    Text: ISL6608 Data Sheet PRELIMINARY December 2003 FN9140 Synchronous Rectified MOSFET Driver Features The ISL6608 is a high frequency, MOSFET driver optimized to drive two N-Channel power MOSFETs in a synchronousrectified buck converter topology. This driver combined with


    Original     		PDF ISL6608 FN9140 ISL6608 HIP63xx ISL65xx ISL6605 ISL6608CB ISL6608CB-T ISL6608CR MO-220 TB363 TB389

    Untitled

    Abstract: No abstract text available
    Text: ISL6605 Data Sheet August 2004 Synchronous Rectified MOSFET Driver Features The ISL6605 is a high frequency, MOSFET driver optimized to drive two N-Channel power MOSFETs in a synchronousrectified buck converter topology. This driver combined with an Intersil HIP63xx or ISL65xx Multi-Phase Buck PWM


    Original     		PDF ISL6605 FN9091 ISL6605 HIP63xx ISL65xx 3000pF

    ISL6605IB

    Abstract: MO-220 TB363 ISL6605 ISL6605CB ISL6605CB-T ISL6605CR ISL6605CR-T qfn Substrate design guidelines application note gate driver with bootstrap capacitor
    Text: ISL6605 Data Sheet April 2003 FN9091.1 Synchronous Rectified MOSFET Driver Features The ISL6605 is a high frequency, MOSFET driver optimized to drive two N-Channel power MOSFETs in a synchronousrectified buck converter topology. This driver combined with


    Original     		PDF ISL6605 FN9091 ISL6605 HIP63xx ISL65xx 3000il ISL6605IB MO-220 TB363 ISL6605CB ISL6605CB-T ISL6605CR ISL6605CR-T qfn Substrate design guidelines application note gate driver with bootstrap capacitor

    ISL6605

    Abstract: ISL6605CB ISL6605CB-T ISL6605CR ISL6605CR-T ISL6605IB MO-220 TB363
    Text: ISL6605 Data Sheet August 2003 FN9091.2 Synchronous Rectified MOSFET Driver Features The ISL6605 is a high frequency, MOSFET driver optimized to drive two N-Channel power MOSFETs in a synchronousrectified buck converter topology. This driver combined with


    Original     		PDF ISL6605 FN9091 ISL6605 HIP63xx ISL65xx 300il ISL6605CB ISL6605CB-T ISL6605CR ISL6605CR-T ISL6605IB MO-220 TB363

    ISL6605

    Abstract: ISL6605CB ISL6605CBZ ISL6605CR ISL6605CRZ ISL6605IB MO-220 TB363 ISL6605IRZ
    Text: ISL6605 Data Sheet November 16, 2004 FN9091.4 Synchronous Rectified MOSFET Driver Features The ISL6605 is a high frequency, MOSFET driver optimized to drive two N-Channel power MOSFETs in a synchronousrectified buck converter topology. This driver combined with


    Original     		PDF ISL6605 FN9091 ISL6605 HIP63xx ISL65xx ISL6605CB ISL6605CBZ ISL6605CR ISL6605CRZ ISL6605IB MO-220 TB363 ISL6605IRZ

    ISL6605

    Abstract: ISL6605CB ISL6605CBZ ISL6605CBZA ISL6605CR MO-220 TB363
    Text: DS ME N M O R EC 6609 RSIL CT - ISL E T N U ,I NSSheet Data RO D ESIG NCED P D HA N EW F O R P- I N EN O DR ISL6605 May 9, 2006 FN9091.7 Synchronous Rectified MOSFET Driver Features The ISL6605 is a high frequency, MOSFET driver optimized to drive two N-Channel power MOSFETs in a synchronousrectified buck converter topology. This driver combined with


    Original     		PDF ISL6605 FN9091 ISL6605 HIP63xx ISL65xx ISL6605CB ISL6605CBZ ISL6605CBZA ISL6605CR MO-220 TB363