J-STD-005
Abstract: land pattern for DFN qfn 10mm land pattern nozzle heater qfn Substrate design guidelines two tinned touch pads ipc-SM-782 PIC16F877A circuit diagram pitch 0.4mm BGA Technical Brief TB389
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages Technical Brief March 27, 2008 TB389.5 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline Drawings Intersil's Quad Flat No Lead QFN package family offering is a relatively new packaging concept that is currently
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J-STD-005
land pattern for DFN
qfn 10mm land pattern
nozzle heater
qfn Substrate design guidelines
two tinned touch pads
ipc-SM-782
PIC16F877A circuit diagram
pitch 0.4mm BGA
Technical Brief TB389
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qfn 32 land pattern
Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern
Text: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and
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32-pin
MO-220
199707558G
qfn 32 land pattern
MO-220 5x5mm
"BGA Rework Practices",
hakko
vqfn 44 land pattern
MO-220
qfp 32 land pattern
jedec package MO-220 vkkd
qfn land pattern
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QFN-48 LAND PATTERN
Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Text: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when
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J-STD-005
Abstract: nozzle heater paste profile qfn 10mm land pattern J-STD-001C solder joint IPC-SM-782 MO-220 TB389 MARK RAY QFN
Text: PCB Land Pattern Design and Surface Mount Guidelines for QFN MLFP Packages Technical Brief March 2004 TB389.2 Authors: Jim Benson, Mark Kwoka, Ray Claudio Introduction General Design Guidelines Intersil’s Quad Flat No Lead (QFN), Micro Lead Frame Plastic (MLFP) package is a relatively new packaging
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J-STD-005
nozzle heater
paste profile
qfn 10mm land pattern
J-STD-001C
solder joint
IPC-SM-782
MO-220
MARK RAY QFN
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qfn 48 7x7 stencil
Abstract: Soldering guidelines pin in paste standoff amkor exposed pad AT88RF1354 IPC-SM-782 qfn 44 7x7 PACKAGE footprint Soldering guidelines pin in paste 10x10 qfn qfn 48 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size
Text: 1. Introduction This document provides PCB designers with a set of guidelines for successful board mounting of Atmel’s QFN MicroLeadFrame package. The QFN package is a near chip scale plastic encapsulated package with a copper leadframe substrate. This is a leadless package where electrical
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Untitled
Abstract: No abstract text available
Text: MSWS3T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP3T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal
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MSWS3T-1004
A17140
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Untitled
Abstract: No abstract text available
Text: MSWS4T-1004 PIN DIODE SWITCH ELEMENT PIN #13 PIN #8 PIN #16 PIN #5 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP4T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal
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MSWS4T-1004
A17141
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qfn 48 7x7 stencil
Abstract: qfn 28 land pattern land pattern for QFN 7x7 24 leads qfn 5x5 qfn 3X3 land pattern "exposed pad" PCB via XAPP439 pcb design 0,5 mm pitch 5x5 matrix qfg48 dimensions QFN PACKAGE thermal resistance
Text: Application Note: CoolRunner, CPLD R PCB Pad Pattern Design and SurfaceMount Considerations for QFN Packages XAPP439 v1.0 April 11, 2005 Summary Xilinx Quad Flat No-Lead (QFN) package is a robust and low profile leadframe-based plastic package that has several advantages over traditional leadframe packages.The exposed die
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XAPP439
qfn 48 7x7 stencil
qfn 28 land pattern
land pattern for QFN 7x7
24 leads qfn 5x5
qfn 3X3 land pattern
"exposed pad" PCB via
XAPP439
pcb design 0,5 mm pitch 5x5 matrix
qfg48 dimensions
QFN PACKAGE thermal resistance
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Untitled
Abstract: No abstract text available
Text: MSWS5T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #16 PIN #5 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground PIN #2 Description Features A SP5T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal
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MSWS5T-1004
A17142
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thermal pcb guidelines
Abstract: 36pin qfn qfn stencil smsc 2112 pcb design
Text: AN 18.15 PCB Design Guidelines for QFN and DQFN Packages 1 Introduction This application note provides information on general printed circuit board layout considerations for the SMSC products using QFN and DQFN packages. 1.1 Audience This application note is written for a reader that is familiar with PCB design, including signal integrity
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PC1318
Abstract: BIPOLAR MOTOROLA 2N J1 TRANSISTOR DIODE SOT-23 PACKAGE PC13180FC 13MHZ NDK MARKING 12p SOT-23 RF loop antenna 13Mhz transistor marking code 7E SOT-23 MC13180 MC71000
Text: Product Preview MC13180PP/D Rev. 2, 08/2002 MC13180 2.4 GHz Low Power Wireless Transceiver IC for Bluetooth Applications Package Information Plastic Package Case 1314 QFN-48 Ordering Information Device Marking Package PC13180FC PC13180FC QFN-48 The MC13180 2.4 GHz Low Power Wireless Transceiver for Bluetooth™ is a part of the
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MC13180PP/D
MC13180
QFN-48)
PC13180FC
QFN-48
MC13180
PC1318
BIPOLAR MOTOROLA 2N
J1 TRANSISTOR DIODE SOT-23 PACKAGE
PC13180FC
13MHZ NDK
MARKING 12p SOT-23
RF loop antenna 13Mhz
transistor marking code 7E SOT-23
MC71000
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JESD30E
Abstract: JESD-30 QFN footprint AN1152 PQFN footprint AN-1152
Text: Application Note AN-1152 Dual 5x6 Power QFN Technology Inspection and Footprint / Stencil Recommendation Application Note By Behnia Barzegarian Table of Contents Page Inspection Techniques . 2
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AN-1152
JESD30E
JESD-30
QFN footprint
AN1152
PQFN footprint
AN-1152
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PQFN footprint
Abstract: IRFH7911PbF PQFN AN-1154 JESD-30 JESD30E
Text: Application Note AN-1154 Power QFN Technology Footprint / Stencil Recommendation Application Note By Behnia Barzegarian Table of Contents Page Inspection Techniques . 3 Examples of Proper Mounting . 3
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AN-1154
127mm
102mm
PQFN footprint
IRFH7911PbF
PQFN
AN-1154
JESD-30
JESD30E
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Untitled
Abstract: No abstract text available
Text: SUF-1033 SUF-1033DC to 20GHz, Cascadable pHEMT MMIC Amplifier DC to 20GHz, CASCADABLE pHEMT MMIC AMPLIFIER Package: QFN, 16-Pin, 3mmx3mm Product Description Features The SUF-1033 is a monolithically matched broadband high IP3 gain block covering DC to 20GHz. This pHEMT based amplifier uses a patented selfbias network that operates from a single 5V supply. It offers efficient cascadable performance in a compact 3mmx3mm Ceramic QFN package. It
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SUF-1033DC
20GHz,
SUF-1033
16-Pin,
SUF-1033
20GHz.
14dBm
DS110718
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Untitled
Abstract: No abstract text available
Text: SUF-1033 SUF-1033DC to 20GHz, Cascadable pHEMT MMIC Amplifier DC to 20GHz, CASCADABLE pHEMT MMIC AMPLIFIER Package: QFN, 16-Pin, 3mm x 3mm Product Description Features The SUF-1033 is a monolithically matched broadband high IP3 gain block covering DC to 20GHz. This pHEMT based amplifier uses a patented selfbias network that operates from a single 5V supply. It offers efficient cascadable performance in a compact 3mm x 3mm Ceramic QFN package. It
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SUF-1033DC
20GHz,
SUF-1033
16-Pin,
SUF-1033
20GHz.
DS120301
SUF-1033SB
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Untitled
Abstract: No abstract text available
Text: SUF-1033 SUF-1033DC to 20GHz, Cascadable pHEMT MMIC Amplifier DC to 20GHz, CASCADABLE pHEMT MMIC AMPLIFIER Package: QFN, 16-Pin, 3mm x 3mm Product Description Features The SUF-1033 is a monolithically matched broadband high IP3 gain block covering DC to 20GHz. This pHEMT based amplifier uses a patented selfbias network that operates from a single 5V supply. It offers efficient cascadable performance in a compact 3mm x 3mm Ceramic QFN package. It
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SUF-1033DC
20GHz,
SUF-1033
16-Pin,
SUF-1033
20GHz.
DS120531
SUF-1033SB
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ipc 610
Abstract: AN-1137 IPC-A-610
Text: Application Note AN-1137 Power QFN Technology Inspection Application Note Table of Contents Page Inspection techniques . 3 Examples of good assembly . 3 Summary of rejection criteria . 4 Types of faults . 4
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AN-1137
IRFH7932TRPbF)
ipc 610
AN-1137
IPC-A-610
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Untitled
Abstract: No abstract text available
Text: Technical Data MC13180/D Rev. 1, 03/2003 MC13180 2.4 GHz Low Power Wireless Transceiver IC for Bluetooth Applications Package Information Plastic Package Case 1314 QFN-48 Ordering Information Contents 1 Specifications . . . . . . . . 4 2 Connections . . . . . . . . . 16
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MC13180/D
MC13180
QFN-48)
MC13180FC
QFN-48
MC13180
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IR384X
Abstract: MCR03EZPFX3921 EEV-FK1E331P GRM1885C1H222JA01D MMBT3904-TP C36N IR3842 MMBT3904TP IRDC3842
Text: IRDC3842 SupIRBuck TM USER GUIDE FOR IR3842 EVALUATION BOARD DESCRIPTION The IR3842 is a synchronous buck converter, providing a compact, high performance and flexible solution in a small 5mmx6mm Power QFN package. An output over-current protection function is
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IRDC3842
IR3842
IR384X
MCR03EZPFX3921
EEV-FK1E331P
GRM1885C1H222JA01D
MMBT3904-TP
C36N
MMBT3904TP
IRDC3842
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MMBT3904 SMD FAIRCHILD
Abstract: ECJ-3YX1C106K EEV-FK1E331P MMBT3904-TP SMD electrolytic capacitor 22uF 63V
Text: IRDC3843W SupIRBuck TM USER GUIDE FOR IR3843W EVALUATION BOARD DESCRIPTION The IR3843W is a synchronous buck converter, providing a compact, high performance and flexible solution in a small 5mmx6mm Power QFN package. An output over-current protection function is
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IRDC3843W
IR3843W
IR3843W
MMBT3904 SMD FAIRCHILD
ECJ-3YX1C106K
EEV-FK1E331P
MMBT3904-TP
SMD electrolytic capacitor 22uF 63V
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IR3853
Abstract: Fairchild 902 EEV-FK1E331P MMBT3904-TP schematic diagram 12v power supply IR3853M GRM188R71H822KA01D
Text: IRDC3853 SupIRBuck TM USER GUIDE FOR IR3853 EVALUATION BOARD DESCRIPTION The IR3853 is a synchronous buck converter, providing a compact, high performance and flexible solution in a small 4mmx5mm Power QFN package. Key features offered by the IR3853 include
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IRDC3853
IR3853
Fairchild 902
EEV-FK1E331P
MMBT3904-TP
schematic diagram 12v power supply
IR3853M
GRM188R71H822KA01D
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IR3802A
Abstract: ECG circuit diagram MCR03EZPFX1801 grm188r71h561ka01d Kemet x7r Ceramic Capacitor -surface .22uF 50V schotky rectifier 16TQC47M BAT54WS smd 4A data GRM188R71H821KA01D
Text: IRDC3802 SupIRBuck TM USER GUIDE FOR IR3802 EVALUATION BOARD DESCRIPTION The IR3802 is a synchronous buck converter, providing a compact, high performance and flexible solution in a small 5mmx6mm Power QFN package. An output over-current protection function is
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IRDC3802
IR3802
IR3802
600kHz
IR3802A
ECG circuit diagram
MCR03EZPFX1801
grm188r71h561ka01d
Kemet x7r Ceramic Capacitor -surface .22uF 50V
schotky rectifier
16TQC47M
BAT54WS
smd 4A data
GRM188R71H821KA01D
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Untitled
Abstract: No abstract text available
Text: RF5355 3.3V, 5GHz LINEAR POWER AMPLIFIER VC2 VC3 Package Style: QFN, 8-Pin, 2.2mmx2.2mmx0.45mm 8 7 Features Input Match IEEE802.11a/n and IEEE802.16e Applications HyperLAN Wireless LAN Systems Commercial and Consumer Systems
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RF5355
IEEE802
11a/n
17dBm
4900MHz
5850MHz
DS100430
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QFN-6x6 0.5mm
Abstract: QFN-6x6 48 qfn 6x6 foot print qfn 44 PACKAGE footprint qfn stencil AN3111
Text: AN3111 Rev 3, 07/2008 Freescale Semiconductor Application Note Soldering the QFN Stacked Die Sensors to a PC Board by: Dave Mahadevan, Russell Shumway, Thomas Koschmieder, Cheol Han, Kimberly Tuck, John Dixon Sensor and Actuator Solutions Division Tempe, Arizona
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AN3111
QFN-6x6 0.5mm
QFN-6x6 48
qfn 6x6 foot print
qfn 44 PACKAGE footprint
qfn stencil
AN3111
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