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    QFN LT Search Results

    QFN LT Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    EL9112ILZ Renesas Electronics Corporation Triple Differential Receiver/Equalizer, QFN, /Tube Visit Renesas Electronics Corporation
    ISL59445IRZ Renesas Electronics Corporation 1GHz Triple Multiplexing Amplifiers, QFN, /Tube Visit Renesas Electronics Corporation
    ISL99125BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation
    ISL99135BDRZ-T Renesas Electronics Corporation DrMOS (Driver + FET), QFN, / Visit Renesas Electronics Corporation
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    QFN LT Price and Stock

    Rochester Electronics LLC PEMI6QFN/LT,132

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    DigiKey PEMI6QFN/LT,132 Bulk 76,000 1,902
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    Rochester Electronics LLC PEMI4QFN/LT,132

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    DigiKey PEMI4QFN/LT,132 Bulk 36,000 2,959
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    Rochester Electronics LLC PEMI8QFN/LT,132

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    DigiKey PEMI8QFN/LT,132 Bulk 8,000 1,567
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    Rochester Electronics LLC PEMI2QFN/LT,115

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    DigiKey PEMI2QFN/LT,115 Bulk 3,806
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    Rochester Electronics LLC PEMI1QFN/LT,315

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    DigiKey PEMI1QFN/LT,315 Bulk 3,806
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    Find more QFN LT price and stock on Findchips.com

    QFN LT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    qfn 32 land pattern

    Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern
    Text: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and


    Original     		PDF 32-pin MO-220 199707558G qfn 32 land pattern MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern

    ltc4151

    Abstract: No abstract text available
    Text: RELIABILITY DATA LTC4151 / LTC6101 / LTC6102 / LTC6103 / LTC6104 8/13/2009 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP QFN/DFN 505 154 659 • PRESSURE COOKER TEST AT 15 PSIG, +121°C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP QFN/DFN 10,427


    Original     		PDF LTC4151 LTC6101 LTC6102 LTC6103 LTC6104 00-03-6209B.

    capacitor 100pF 0603

    Abstract: 263 qfn Filtronic MIL-HDBK-263
    Text: FMA3016-QFN 3.5GHz High Power Amplifier for WiMAX applications FEATURES: • • • • • • Preliminary Datasheet v2.1 FMA3016-QFN EVALUATION BOARD: 3.5GHz WiMAX power amplifier 17dB gain 2.5% EVM with 30dBm transmit power 10% PAE with 30dBm transmit power


    Original     		PDF FMA3016-QFN FMA3016-QFN 30dBm 22A114. MIL-STD-1686 MIL-HDBK-263. capacitor 100pF 0603 263 qfn Filtronic MIL-HDBK-263

    capacitor 100pF 0603

    Abstract: 6 ghz amplifier 10w MIL-HDBK-263 64-QAM-OFDM
    Text: FMA3016-QFN 3.5GHz High Power Amplifier for WiMAX applications FEATURES: • • • • • • Preliminary Datasheet v3.1 FMA3016-QFN EVALUATION BOARD: 3.5GHz WiMAX power amplifier 17dB gain 2.5% EVM with 30dBm transmit power 10% PAE with 30dBm transmit power


    Original     		PDF FMA3016-QFN FMA3016-QFN 30dBm 22A114. MIL-STD-1686 MIL-HDBK-263. capacitor 100pF 0603 6 ghz amplifier 10w MIL-HDBK-263 64-QAM-OFDM

    LT1993

    Abstract: LT6402
    Text: RELIABILITY DATA LT1993 / LT6402 8/21/2006 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE QFN/DFN 154 0533 154 • PRESSURE COOKER TEST AT 15 PSIG, +121°C PACKAGE TYPE SAMPLE SIZE QFN/DFN 149 149 • TEMP CYCLE FROM -65°C to +150°C PACKAGE


    Original     		PDF LT1993 LT6402 00-03-6209B. LT6402

    mc13718

    Abstract: Coin based mobile battery charger circuit diagram RBL 43 P TRANSISTOR MC13717 Delay linear sweep generator using 555 timer circuit diagram for Coin based mobile battery charger Coin Based Mobile Phone Charger RBL 43 P Transistor Circuits coin operated mobile phone charger inverter board monitor backlight
    Text: Freescale Semiconductor Advance Information MC13790/D Rev. 1.1, 11/2004 MC13790 Package Information QFN Package Case 1506-01 QFN–76 MC13790 Ordering Information Integrated Power Management IC Device Operating Temperature Range Package MC13790 TA = –20°C to 70°C


    Original     		PDF MC13790/D MC13790 MC13790 MC13717 MC13790application, MC13790/D mc13718 Coin based mobile battery charger circuit diagram RBL 43 P TRANSISTOR Delay linear sweep generator using 555 timer circuit diagram for Coin based mobile battery charger Coin Based Mobile Phone Charger RBL 43 P Transistor Circuits coin operated mobile phone charger inverter board monitor backlight

    smd code z16

    Abstract: CY22388 CY22389 CY22391 SMD-49 ZZ16 CY22391LTXC-xxx
    Text: CY22388, CY22389, CY22391 Factory Programmable Quad PLL Clock Generator with VCXO Features • 16-/20-pin TSSOP and 32-pin QFN packages ■ 3.3V operation with 2.5V output buffer option ■ Fully integrated phase-locked loops PLLs ■ QFN package Benefits


    Original     		PDF CY22388, CY22389, CY22391 16-/20-pin 32-pin 20-pin 16-pin smd code z16 CY22388 CY22389 CY22391 SMD-49 ZZ16 CY22391LTXC-xxx

    LT6555

    Abstract: LT6556
    Text: DEMO CIRCUIT 892 LT6556QUICK AND LT6555 QFN STARTIN GUIDE LT6556 and LT6555 in QFN Triple High-Speed 2:1 Video MUX DESCRIPTION Demonstration circuit 892 is a Triple H igh-Speed 2:1 Video M U X featuring the LT6556 and LT6555 in Q FN packaging. The –A version of the board includes the


    Original     		PDF LT6556 LT6555 LT6556.

    QFN 64 8x8 dimension

    Abstract: No abstract text available
    Text: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF W13062 W13041 W13028 W13082 W13088 W13024 W13063 W13046 W13083 W13084 QFN 64 8x8 dimension

    QFN 64 8x8 dimension

    Abstract: WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7
    Text: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF WA13062DQAET WA13041DQAET WA13028DQAET WA13082DQAET WA13088DQAET WA13024DQAET WA13063DQAET WA13046DQAET WA13083DQAET WA13084DQAET QFN 64 8x8 dimension WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7

    receiver 8psk schematic diagram

    Abstract: DVB-S2 Tuner demodulator DVB-S front end receiver single chip Single Chip dvb-s2 BLM18RK102 PS20039 dvb-s2 i2c DVB-s receiver schematic diagram PS2003 DVB-S2 demodulator
    Text: PS20037 DVB-S Satellite Tuner with RF bypass Data Sheet 291468 issue 1 Nov-11 Ordering Information PS20037C1Q1BT 28 QFN Tape & Reel 6K PS20037C1Q1B5 28 QFN Trays DESCRIPTION The PS20037 is a fully integrated direct conversion tuner for digital satellite receiver systems. It


    Original     		PDF PS20037 Nov-11 PS20037 PS20037C1Q1BT PS20037C1Q1B5 CE5037 receiver 8psk schematic diagram DVB-S2 Tuner demodulator DVB-S front end receiver single chip Single Chip dvb-s2 BLM18RK102 PS20039 dvb-s2 i2c DVB-s receiver schematic diagram PS2003 DVB-S2 demodulator

    receiver 8psk schematic diagram

    Abstract: PS20039C1Q1BT CE5039 PS20313 PS20039 crystal oscillator L-Band diseqc2 950-2150 MHZ filter BLM18RK102SN1D
    Text: PS20039 DVB-S Satellite Tuner with RF bypass Data Sheet 291467 issue 1 Nov-11 Ordering Information PS20039C1Q1BT 28 QFN Tape & Reel 6K PS20039C1Q1B5 28 QFN Trays DESCRIPTION The PS20039 is a fully integrated direct conversion tuner for digital satellite receiver systems, targeted


    Original     		PDF PS20039 Nov-11 PS20039 PS20039C1Q1BT PS20039C1Q1B5 CE5039 receiver 8psk schematic diagram PS20313 crystal oscillator L-Band diseqc2 950-2150 MHZ filter BLM18RK102SN1D

    LT3080

    Abstract: 446V LT1991 LTC2656 LTC2656-H LTC2656-HI6 LTC2656-L LTC2656-LI LTC2656-LI6 LTC2656-LT3080
    Text: Eight 16-Bit, Low INL, VOUT DACs in a 4mm x 5mm QFN Package: Unparalleled Density and Flexibility Leo Chen While 16-bit VOUT DACs are not uncommon, the combination of low INL ±4 LSB and high density (eight DACs in a 4mm × 5mm QFN package) allows the LTC2656 to fit an unparalleled range of sockets.


    Original     		PDF 16-Bit, 16-bit LTC2656 LTC2656s LTC2656 LT3080 446V LT1991 LTC2656-H LTC2656-HI6 LTC2656-L LTC2656-LI LTC2656-LI6 LTC2656-LT3080

    QFN 64 8x8 dimension

    Abstract: 56 qfn 7x7 2x2 dfn qfn 52 6x6
    Text: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF WA13062DQAET WA13041DQAET WA13028DQAET WA13082DQAET WA13088DQAET WA13024DQAET WA13063DQAET WA13046DQAET WA13083DQAET WA13084DQAET QFN 64 8x8 dimension 56 qfn 7x7 2x2 dfn qfn 52 6x6

    MC13180

    Abstract: MC13181 MC13181R2 MC71000 QFN-24 Microprocessor Supervisor Circuit
    Text: Advance Information MC13181/D Rev. 0, 08/2002 MC13181 Wireless Power Management Integrated Circuit Scale 2:1 Package Information Plastic Package Case 1307 (QFN-24) Ordering Information Device Marking Package MC13181R2 13180 QFN-24 The MC13181 Wireless Power Management Integrated Circuit (PMIC) is a monolithic IC


    Original     		PDF MC13181/D MC13181 QFN-24) MC13181R2 QFN-24 MC13181 MC13180 MC71000 MC13181R2 QFN-24 Microprocessor Supervisor Circuit

    QFN 64 8x8 dimension

    Abstract: W13028 QFN 7x5 2x2 dfn Winslow qfn 3x3 socket
    Text: WINSLOW ADAPTICs Data Sheet – QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.


    Original     		PDF W13062 W13041 W13028 W13082 W13088 W13024 W13063 W13046 W13083 W13084 QFN 64 8x8 dimension W13028 QFN 7x5 2x2 dfn Winslow qfn 3x3 socket

    GPIO44

    Abstract: No abstract text available
    Text: EasyFT90x v7 MCU card with FT900 QFN-100 EasyFT90x v7 MCU card with FT900 QFN-100 ver. 1.00 MCU card information This is the default MCU card that comes with EasyFT90x v7. It contains the FT900 microcontroller with on-chip peripherals. After testing and building


    Original     		PDF EasyFT90x FT900 QFN-100 FT900 GPIO44

    QFN12

    Abstract: MC13770 PC13770FC QFN-12
    Text: Product Preview MC13770PP/D Rev. 1, 11/2002 MC13770 W-CDMA LNA and Downconverter Scale 2:1 Package Information Plastic Package Case 1345 (QFN-12) Ordering Information Device Device Marking Package PC13770FC PC70 QFN-12 The MC13770 is a LNA Downconverter designed specifically for WCDMA handsets. The


    Original     		PDF MC13770PP/D MC13770 QFN-12) PC13770FC QFN-12 MC13770 QFN12 PC13770FC QFN-12

    motorola Bluetooth-chipset

    Abstract: Bluetooth-chipset MC13180 MC13181 MC13181FC MC71000 QFN-24
    Text: Technical Data MC13181/D Rev. 1, 11/2002 MC13181 Wireless Power Management Integrated Circuit Scale 2:1 Package Information Plastic Package Case 1307 (QFN-24) Ordering Information Device Marking Package MC13181FC 13181 QFN-24 The MC13181 Wireless Power Management Integrated Circuit (PMIC) is a monolithic IC


    Original     		PDF MC13181/D MC13181 QFN-24) MC13181FC QFN-24 MC13181 MC13180 MC71000 motorola Bluetooth-chipset Bluetooth-chipset MC13181FC QFN-24

    jedec package MO-247

    Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
    Text: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB


    Original     		PDF AC322 jedec package MO-247 qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline

    905 motorola

    Abstract: QFN-20 GSM900 MRFIC0970
    Text: Technical Data MRFIC0970/D Rev. 0, 07/2002 MRFIC0970 3.2 V GSM GaAs Integrated Power Amplifier Scale 2:1 Package Information Plastic Package Case 1308 (QFN-20) Ordering Information Device Marking Package MRFIC0970 0970 QFN-20 The MRFIC0970 is a single supply, RF power amplifier designed for the 2.0 W GSM900


    Original     		PDF MRFIC0970/D MRFIC0970 QFN-20) QFN-20 MRFIC0970 GSM900 QFN-20 905 motorola GSM900

    741 datasheet motorola

    Abstract: QFN-12 741 PIN DIAGRAM MRFIC2408 PRFIC2408
    Text: Product Preview MRFIC2408PP/D Rev. 0, 08/2002 MRFIC2408 2.4 GHz RF Power Amplifier for Bluetooth Applications Scale 2:1 Package Information Plastic Package Case 1408 (QFN-12) Ordering Information Device Marking Package PRFIC2408 2408 QFN-12 The MRFIC2408 is a single chip RF Power Amplifier intended for 2.4 GHz ISM Band


    Original     		PDF MRFIC2408PP/D MRFIC2408 QFN-12) PRFIC2408 QFN-12 MRFIC2408 741 datasheet motorola QFN-12 741 PIN DIAGRAM PRFIC2408

    QFN-24

    Abstract: No abstract text available
    Text: 管理計画 QFN-24 CONTROL PLAN (QFN-24) ﾄﾚｯｸｽ・ｾﾐｺﾝﾀﾞｸﾀｰ株式会社 TOREX SEMICONDUCTOR LTD. 代表例 工程記号 No. 工程名 Flow Process 1 ｳｴﾊ受入 ◇ Wafer incoming 2 酸化 ○ Oxide 3 酸化膜ﾁｪｯｸ


    Original     		PDF QFN-24) QFN-24

    QFN-20

    Abstract: MRFIC1870 20/MRFIC1870
    Text: Product Preview MRFIC1870PP/D Rev. 0, 02/2003 MRFIC1870 3.2 V DCS/PCS GaAs Integrated Power Amplifier Package Information Plastic Package Case 1308 QFN-20 Ordering Information Device Device Marking Package MRFIC1870 1870 QFN-20 The MRFIC1870 is a single supply, RF power amplifier designed for the 2.0 W DCS/PCS


    Original     		PDF MRFIC1870PP/D MRFIC1870 QFN-20) QFN-20 MRFIC1870 QFN-20 20/MRFIC1870